I-MIRTEC 2D AOI MV-6e

I-MIRTEC 2D AOI MV-6e sisixhobo sokuhlola esizenzekelayo esizenzekelayo, esisetyenziswa ngokubanzi kwiinkqubo ezahlukeneyo zokwenziwa kwe-elektroniki, ngakumbi ekuhloleni i-PCB kunye nezixhobo ze-elektroniki.

Iimpawu eziphezulu zekhamera: I-MV-6e ixhotywe ngekhamera ye-15-megapixel ephezulu, enokubonelela ngokuhlolwa kwesithombe se-2D esichanekileyo. Ukuhlolwa kweendlela ezininzi: Isixhobo samkela ukukhanya kombala onamacandelo amathandathu ukubonelela ngohlolo oluchanekileyo. Ukongeza, ikwaxhasa iSide-Viewer yokuhlola iindlela ezininzi (ukhetho). Ukufunyanwa kwesiphako: Iyakwazi ukubona iziphene ezahlukeneyo ezifana neendawo ezilahlekileyo, i-offset, ilitye lengcwaba, icala, i-tin eninzi, i-tin encinci kakhulu, ukuphakama, i-IC pin soldering ebandayo, i-part warping, i-BGA warping, njl. Ulawulo olukude: Nge-Intellisys inkqubo yoxhulumaniso, ulawulo olukude kunye nokuthintela isiphene kunokufezekiswa, ukunciphisa ilahleko yabasebenzi kunye nokuphucula ukusebenza kakuhle. Iiparamitha zobugcisa

Ubukhulu: 1080mm x 1470mm x 1560mm (ubude x ububanzi x ukuphakama)

PCB ubukhulu: 50mm x 50mm ~ 480mm x 460mm

Ubude becandelo eliphezulu: 5mm

Ukuchaneka kobude: ± 3um

Izinto zokuhlola ze-2D: iindawo ezingekhoyo, i-offset, i-skew, ilitye lesikhumbuzo, emacaleni, iinxalenye ezijikiweyo, umva, iindawo ezingalunganga, umonakalo, i-tinning, i-solder ebandayo, i-voids, i-OCR

Izinto zokuhlola ze-3D: iindawo eziwisiweyo, ukuphakama, indawo, itoti eninzi kakhulu, itoti encinci kakhulu, i-solder evuzayo, i-chip ephindwe kabini, ubungakanani, i-IC unyawo olubandayo lwe-solder, into yangaphandle, i-warping, i-BGA warping, ukuhlolwa kwe-tin erhubuluzayo, njl.

Isantya sokuhlola: Isantya sokuhlola se-2D yi-0.30 imizuzwana/i-FOV, isantya sokuhlola i-3D yi-0.80 imizuzwana/FOV

Iimeko zesicelo

I-MIRTEC 2D AOI MV-6e isetyenziswa ngokubanzi kuhlolo lwe-PCB kunye namacandelo e-elektroniki, ngakumbi xa kujongwa iindawo ezilahlekileyo, i-offset, ilitye lengcwaba, emacaleni, itoti egqithisileyo, itoti engonelanga, ukuphakama, i-IC pin soldering ebandayo, i-arping parts, i-BGA warping. kunye nezinye iziphene. Ukuchaneka kwayo okuphezulu kunye nokusebenza okuphezulu kuyenza ibe sisixhobo sokuhlola esiyimfuneko kwinkqubo yokwenziwa kombane.