Umgca weBesi Fico Compact - ukusika kunye nokwakheka kwe-semiconductor ye-P

I-Besi Fico Compact Line - P (FCL-P) yinkqubo yokutrima echanekileyo kakhulu, ezenzekelayo ngokupheleleyo kunye nefomu eyenzelwe ngokukodwa iimveliso ze-power semiconductor. Idibanisa ukuchaneka okugqwesileyo, amandla okubhoboza anamandla, kunye nolawulo oluqinileyo lokungcola, ijolise ekujongeni iimfuno ezingqongqo zeProcess Capability Index (Cpk—ngokukodwa, i-long-term process capacity index) kunye nokulandeleka kwimveliso ye-power chip.

**Iiparameter eziphambili ngokukhawuleza**

Ezi zilandelayo ziiparameter eziphambili ze-FCL-P, ezihlanganiswe ngokusekelwe kwiinkcukacha ezisemthethweni:

**Into** | **Iinkcukacha**

**Uhlobo lweZixhobo** | Inkqubo yokuHlola kunye neFomu ezenzekelayo ngokupheleleyo

**Amandla okuBetha** | 50 kN (58 Joules)

**Isantya Sokubetha** | Ukuya kuthi ga kwi-250 strokes/ngomzuzu

**Ububanzi besixhobo** | 225 mm

**Ubungakanani befreyimu ekhokelayo (L x W)** | 150-300 mm x 18-125 mm

**Ukutyeba kwesakhelo esikhokelayo** | 0.1 - 2 mm

**Ubukhulu beMveliso** | 0 – 10 mm

**Inqanaba lengxolo** | Ngaphantsi kwe-75 dB(A)

**Iimfuno zamandla** | 208–480 VAC, ii-3-phase, 50/60 Hz

**Umoya ocinezelweyo** | Ibha ezi-5–10

**Iiteknoloji eziphambili kunye neempawu**

Ukuze i-FCL-P ikwazi ukujongana nemingeni enxulumene nokuveliswa kwezixhobo zamandla, iBesi igxile kwezi ndawo zilandelayo ziphambili ngexesha loyilo lwayo:

**Yenzelwe Ngokukodwa Izixhobo Zombane:** Le nkqubo yenzelwe ukuhlangabezana neemfuno ezingqongqo zeemveliso zombane malunga nokuchaneka, i-Cpk, kunye nokulandeleka; isebenza njengesisombululo "seengcali" esikhethekileyo sokupakisha iitships ezinamandla aphezulu nezithembekileyo.

**Inkqubo yoLawulo lokuNgcolisa ePhambili:** Olu luphawu olubalulekileyo oluvumela i-FCL-P ukuba ikwazi ukuphatha izinto ezinobuthathaka, ezifana neefreyimu ze-lead ezifakwe ngaphambili. Le nkqubo ixhobisa iyunithi nganye yokubhoboza ngesixhobo sokufunxa esizimeleyo kwaye isebenzisa isihluzo sothuli se-cyclonic esintsha ukuze sibambe ngokufanelekileyo izinto ezincinci, ngaloo ndlela siqinisekisa imveliso ezinzileyo nengenazingxaki.

**Ubuchule obuPhezulu kunye ne-Drive Force enamandla:** Inika amandla okubhoboza aqinileyo ukuya kuthi ga kwi-50 kN (58 Joules), ekwaziyo ukucubungula uninzi lwee-leadframes ezinkulu okanye izakhiwo ze-pin ezintsonkothileyo. Ukongeza, idibanisa inkqubo yokuhlola umbono ukuze kuqatshelwe kwaye kubekwe i-leadframe, inika inkxaso yedatha ethembekileyo yohlalutyo lomgangatho olulandelayo. Uyilo lweModular oluguquguqukayo kunye nokuZenzekelayo: I-FCL-P inikezela ngeendlela zokumisela eziguquguqukayo ngeemodyuli ezahlukeneyo—kuquka iinkqubo zokuphatha iimagazini ezikrelekrele, ii-feeders zeetyhubhu ezinefomathi ezininzi, ii-laser markers, kunye nee-sorters—ukuze kuhlangatyezwane neemfuno zemveliso ezenziwe ngokwezifiso kakhulu. Ngaphezu koko, ixhasa ukuhlanganiswa okukhethwayo ngeprotocol ye-SECS/GEM ukuze iqhagamshelane ngokungenamthungo neenkqubo ze-MES zefektri, ngaloo ndlela ivumela ulawulo oluzenzekelayo ngokupheleleyo.

Iindawo eziphambili zokusetyenziswa

Ngamafutshane, i-FCL-P yenzelwe ngokukodwa izinto eziphambili ezisetyenziswa kwiimeko zokusetyenziswa ezithembekileyo kakhulu nezinamandla aphezulu.

Indawo yoSetyenziso | Umsebenzi oPhambili

IiPower Semiconductors | Kwimveliso yee-power chips—ezifana nee-IGBTs, iiMOSFET, kunye nee-IC zolawulo lwamandla—inoxanduva lokubetha, ukwahlula, kunye nokwenza ukwakheka kokugqibela kwee-leadframes ezipheleleyo.

Ii-Elektroniki zeMoto | Ibonelela ngomgangatho wokwakheka ozinzileyo nothembekileyo kwiitships zodidi lwemoto (umz., ii-ECU), iqinisekisa ukuqina kwazo kunye nokuthembeka kwazo kwiimeko zokusebenza ezinzima.

Ezinye izicelo eziQinisekisiweyo kakhulu | Ilungiselela amacandelo afana nolawulo lwemizi-mveliso kunye namandla amatsha, yenza ngokufanelekileyo imisebenzi yokusika nokulungisa izixhobo ze-semiconductor zesizukulwana sesithathu, ezifana nezixhobo zeSiC kunye neGaN.

Iintlobo ngeentlobo zeePakeji | Iyakwazi ukuphatha uluhlu olubanzi lweepakeji ezinoxinano olukhulu, ezincinci, kubandakanya i-DFN, i-QFN, i-SOT, kunye ne-SOD.

Inkqubo yeNdalo eSebenzisanayo

Ngaphakathi komgca wemveliso yokupakisha we-semiconductor, i-FCL-P idla ngokusebenzisana ngokusondeleyo nezixhobo ezisezantsi neziphezulu ukuze zenze inkqubo yemveliso evaliweyo equka "ukubumba, ukwenza, kunye nokwahlula."

Intsebenziswano ne-Upstream Equipment: Ifumana ii-leadframes okanye ii-substrates ezigqibile inkqubo yokubumba kwiimashini zokubumba, ize emva koko yenze imisebenzi yokusika kunye nokubumba.

Ukuhlanganiswa nezinye izixhobo zeBesi: Oku kubonisa indlela efanelekileyo yokwandisa ukusebenza kakuhle kwenkqubo kunye nokusebenza kwayo.

Iinkqubo zokubumba zeFico: Zibonelela ngeemveliso xa inkqubo yokubumba igqityiwe.

Imodyuli yokuMakisha yeLaser eDibeneyo: Ivumela ukumakishwa kweemveliso—ngeenombolo zebhetshi, iikhowudi zeQR, okanye ezinye izinto zokukhomba—nokuba ngaphambi okanye emva kwenkqubo yokusika nokubumba, ngaloo ndlela iqinisekisa ukulandeleka ngokupheleleyo kwemveliso.

Umhlalutyi: Wenza uhlengahlengiso lokugqibela, ukubala, kunye nokupakishwa kwezixhobo emva kokuba zibethelwe zaza zahlulwa.

Isishwankathelo

I-Besi Fico Compact Line - P (FCL-P) ayisiyo nje umatshini wokusika nowokubumba "osetyenziswa ngokubanzi"; endaweni yoko, "yingcali yenkqubo echanekileyo kakhulu" eyenzelwe ngobuchule icandelo le-power semiconductor.

Isebenzisa amandla okubhoboza e-50kN aqinileyo kunye nenkqubo yokulawula ungcoliseko ekhokelayo kushishino, isombulula ngempumelelo ingxaki ebalulekileyo yongcoliseko lweenxalenye ngexesha lenkqubo yemveliso.

Uyilo lwayo olunemodyuli nolulandelekayo luhlangabezana nemigangatho engqongqo efunekayo ukuze kusebenze ngokuzenzekelayo kwifektri kunye nolawulo lomgangatho.

Ke ngoko, xa iimfuno zakho zemveliso zigxile kwiimpawu eziphambili "zeemveliso zamandla," "ukuchaneka okuphezulu," kunye "nokuthembeka okuphezulu," i-FCL-P ngokuqinisekileyo iphuma njengesixhobo esiphambili esifanele siqwalaselwe nzulu.