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I-motherboard ye-die bonder yiyunithi yokulawula engundoqo ye-die bonder, enoxanduva lokusebenza kunye nokulungelelaniswa kwesixhobo sonke. Imisebenzi yayo ephambili ibandakanya:
Lawula izenzo ezahlukeneyo ze-die bonder: ezifana nokubekwa kwe-chip, i-welding yocingo lobhedu, ukubonwa kwe-solder joint, njl.
Ukusetyenzwa kwedatha kunye nonxibelelwano: Inkqubo yedatha evela kwi-sensor kunye ne-interfaces zokusebenza, kunye nokunxibelelana nezixhobo zangaphandle.
Inkqubo yokubeka imbonakalo: Qinisekisa ukuchaneka kwe-die bond ngokusebenzisa inkqubo yokubeka imbonakalo emibini.
Iinkcukacha zobugcisa kunye nezalathi zokusebenza ze-motherboard ye-die bonder zichaphazela ngqo uzinzo kunye nokusebenza kakuhle kwemveliso yezixhobo. Iimpawu eziphambili zobugcisa ziquka:
Isantya se-Welding: Isantya se-welding sichaphazela ngokuthe ngqo ukusebenza kwemveliso kwaye sisalathisi esibalulekileyo sokusebenza.
Umgangatho we-welding: Umgangatho we-welding umisela ukuthembeka kwe-chip.
Ukuzinza kwezixhobo: Ukuzinza kwezixhobo kuhambelana nokuzinza komgca wemveliso kunye nobomi bezixhobo.
