en
id
sk
srp
swe
it
pt
ben
may
bel
nl
fra
th
vie
ru
jp
kor
de
arm
aze
bos
bul
bur
cs
dan
div
el
est
fil
fin
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
kan
kin
lao
lav
lit
ltz
lug
mao
mlt
nep
nor
nya
ori
orm
per
pl
rom
san
som
spa
swa
tam
tr
ukr
urd
wel
xho
I-motherboard ye-die bonder yiyunithi yokulawula engundoqo ye-die bonder, enoxanduva lokusebenza kunye nokulungelelaniswa kwesixhobo sonke. Imisebenzi yayo ephambili ibandakanya:
Lawula izenzo ezahlukeneyo ze-die bonder: ezifana nokubekwa kwe-chip, i-welding yocingo lobhedu, ukubonwa kwe-solder joint, njl.
Ukusetyenzwa kwedatha kunye nonxibelelwano: Inkqubo yedatha evela kwi-sensor kunye ne-interfaces zokusebenza, kunye nokunxibelelana nezixhobo zangaphandle.
Inkqubo yokubeka imbonakalo: Qinisekisa ukuchaneka kwe-die bond ngokusebenzisa inkqubo yokubeka imbonakalo emibini.
Iinkcukacha zobugcisa kunye nezalathi zokusebenza ze-motherboard ye-die bonder zichaphazela ngqo uzinzo kunye nokusebenza kakuhle kwemveliso yezixhobo. Iimpawu eziphambili zobugcisa ziquka:
Isantya se-Welding: Isantya se-welding sichaphazela ngokuthe ngqo ukusebenza kwemveliso kwaye sisalathisi esibalulekileyo sokusebenza.
Umgangatho we-welding: Umgangatho we-welding umisela ukuthembeka kwe-chip.
Ukuzinza kwezixhobo: Ukuzinza kwezixhobo kuhambelana nokuzinza komgca wemveliso kunye nobomi bezixhobo.
