SAKI 3D SPI 3Si LS2

I-SAKI 3D SPI 3Si LS2 yinkqubo yokuhlola i-solder ye-3D ye-paste, eyona nto isetyenziselwa ukufumanisa umgangatho wokuprinta kwi-solder paste kwiibhodi zesekethe eziprintiweyo (PCBs).

Iimpawu eziphambili kunye neemeko zesicelo

I-SAKI 3Si LS2 inezi mpawu zilandelayo:

Ukuchaneka okuphezulu: Ixhasa izisombululo ezintathu ze-7μm, i-12μm kunye ne-18μm, ezifanelekileyo kwiimfuno zokubona ukuncamathisela kwe-solder ephezulu.

Inkxaso yefomathi enkulu: Ixhasa ubungakanani bebhodi yesekethe ukuya kuthi ga kwi-19.7 x 20.07 intshi (500 x 510 mm), ifanelekile kwiimeko ezahlukeneyo zesicelo.

Isisombululo se-Z-axis: Umsebenzi wokulawula intloko ye-Z-axis entsha unokuhlola amacandelo aphezulu, amacandelo e-crimped kunye ne-PCBA kwi-fixture, ukuqinisekisa ukufunyanwa ngokuchanekileyo kwamacandelo aphezulu.

Ukufunyanwa kwe-3D: Ixhasa iindlela ze-2D kunye ne-3D, kunye nobude obuphezulu bokulinganisa ubude ukuya kwi-40 mm, ifanelekile kumacandelo obunzima obunzima.

Iinkcukacha zobugcisa kunye neeparamitha zokusebenza

Iinkcukacha zobugcisa kunye neeparamitha zokusebenza ze-SAKI 3Si LS2 ziquka:

Isisombululo: 7μm, 12μm kunye ne-18μm

Ubungakanani bebhodi: Ubuninzi 19.7 x 20.07 intshi (500 x 510 mm)

Ubuninzi bobude bomlinganiselo wobude: 40 mm

Isantya sokubona: 5700 square millimeters ngomzuzwana

Ukuma kwemarike kunye novavanyo lomsebenzisi

I-SAKI 3Si LS2 ibekwe kwimarike njengeyona ndlela iphezulu yokuhlola i-3D ye-solder yokuhlola usetyenziso lwemizi-mveliso efuna ukuchongwa okuphezulu kokuchaneka. Uvavanyo lomsebenzisi lubonisa ukuba inkqubo yenza kakuhle ekubhaqweni ukuchaneka kunye nokusebenza kakuhle, kwaye inokuphucula kakhulu ukusebenza kwemveliso kunye nomgangatho wemveliso.