EN
id
sk
sr
sv
it
pt
bn
ms
be
nl
fr
th
vi
ru
ja
ko
de
hy
az
bs
bg
my
cs
da
dv
el
et
fil
fi
ga
gl
gn
he
hi
km
hr
hu
is
kn
rw
lo
lv
lt
lb
lg
mi
mt
ne
no
ny
or
om
per
pl
ro
sa
so
es
sw
ta
tr
uk
ur
cy
xhImisebenzi ephambili kunye neziphumo ze-Mirtec SPI MS-11e ziquka le miba ilandelayo:
Ukubona ngokuchanekileyo okuphezulu: I-Mirtec SPI MS-11e ixhotyiswe ngekhamera ye-15-megapixel, enokufikelela kwi-3D ephezulu echanekileyo. Isisombululo sayo sobude sifikelela kwi-0.1μm, ukuchaneka kobude yi-2μm, kunye nokuphindaphinda ukuphakama yi-± 1%.
Imisebenzi yokufumanisa emininzi: Isixhobo sinokubona umthamo, indawo, ubude, ulungelelwaniso lwe-XY, kunye neebhulorho zokuncamathelisa i-solder. Ukongeza, inokubuyisela ngokuzenzekelayo imeko yokugoba ye-substrate ukuqinisekisa ukubhaqwa okuchanekileyo kwiiPCB ezigobileyo.
Uyilo oluphezulu lwe-optical: I-Mirtec SPI MS-11e yamkela ukuqikelelwa kabini kunye noyilo lwe-ripple yesithunzi, enokuphelisa isithunzi sokukhanya okukodwa kunye nokufezekisa iziphumo ezichanekileyo nezichanekileyo zovavanyo lwe-3D. Uyilo lwelensi yekhompawundi ye-telecentric iqinisekisa ukukhulisa rhoqo kwaye akukho parallax.
Utshintshiselwano lwedatha yexesha langempela: I-MS-11e inenkqubo ye-loop evaliweyo eyenza unxibelelwano lwexesha lokwenyani phakathi kwabashicileli/abakhweli, kwaye idlulise ulwazi malunga nendawo yokuncamathelisa i-solder komnye nomnye, ngokusisiseko ukusombulula ingxaki yokuprintwa kwe-solder emdaka kunye nokuphucula. umgangatho wemveliso kunye nokusebenza kakuhle.
Umsebenzi wokulawula kude: Isixhobo sinenkqubo yokudibanisa i-Intellisys eyakhelwe-ngaphakathi exhasa ulawulo olude, ukunciphisa ukusetyenziswa kwabasebenzi kunye nokuphucula ukusebenza kakuhle. Xa iziphene zenzeka kumgca, inkqubo inokuthintela kwaye ilawule kwangaphambili.
Uluhlu olubanzi lwezicelo: I-Mirtec SPI MS-11e ifanelekile kwi-SMT yokukhangela isiphene se-solder paste, ngakumbi kwishishini lokuvelisa i-electronics efuna ukuchongwa okuphezulu.
