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Umatshini wokudibanisa ucingo oluzenzekelayo oluzenzekelayo i-AB383 sisixhobo sokuvelisa i-semiconductor yobuchwepheshe obuphezulu, esetyenziselwa ukuqaphela inyathelo eliphambili kwinkqubo ye-microelectronics - ukubopha ucingo. Isakhiwo sayo sezixhobo sibandakanya ukunikezelwa kwamandla, inkqubo yokunyakaza, inkqubo ye-optical system, inkqubo yokulawula kunye nenkqubo yokuncedisa. Unikezelo lwamandla lunika amandla, inkqubo eshukumayo iqhuba iX, Y, kunye ne-Z ii-axes zomatshini wokubopha ucingo ukuba zihambe ngokuchanekileyo, inkqubo yokukhanya ibonelela ngomthombo wokukhanya, inkqubo yolawulo isebenza ngokubanzi ngeprosesa esembindini, kunye nenkqubo encedisayo. kubandakanya ukupholisa, i-pneumatic kunye ne-sensor systems, njl., ukubonelela ngenkxaso eyimfuneko kunye nesiqinisekiso sezixhobo.
Umgaqo wokusebenza
Umgaqo osebenzayo womatshini we-AB383 wokubopha ucingo ikakhulu ubandakanya la manyathelo alandelayo:
Ukuma: Hambisa intloko yokubopha ucingo kwindawo ekhankanyiweyo ngenkqubo yentshukumo.
Ukuma kwe-Optical position: Misa izinto ezimbini ekufuneka zidityaniswe ngenkqubo yokukhanya.
Ulawulo oluchanekileyo: Inkqubo yokulawula yenza ulawulo oluchanekileyo ukulungelelanisa intloko yentambo yocingo kunye nezinto ezimbini eziza kufakwa.
Ukuwelda: Ukubonelela ngamandla ngonikezelo lwamandla ukudibanisa ucingo oludibanisa ucingo kwizinto ezimbini.
Izinto eziluncedo kunye neemeko zesicelo
Iingenelo zomatshini wokudibanisa ucingo we-AB383 kukuchaneka kwawo, ukuzinza kunye nokusebenza okuphezulu. Ukuma kwayo okuchanekileyo kunye netekhnoloji ye-welding inokuqinisekisa ukuwelda okuchanekileyo kwezinto ezincinci, kwaye ukuhamba kwayo okusebenzayo kunokuphucula ukusebenza kakuhle kwemveliso. Iimeko zayo eziphambili zesicelo ziquka ukuveliswa kweesekethe ezidibeneyo, ukuveliswa kweeseli zelanga, ukuveliswa kwe-LED kunye nezinye iinkalo ezifuna i-micron-level precision welding.
