ASM DEK printing machines Neo GALAXY

DEK Neo GALAXY is the flagship fully automatic ultra-high precision solder paste printer launched by ASM Assembly Systems, representing the highest level of current SMT solder paste printing technology. This model is designed for the needs of next-generation electronic manufacturing, especially for:

Ultra-fine pitch components (such as 01005, 0.2mm pitch BGA)

Highly complex PCB (5G communication, automotive electronics, AI accelerator card)

Wafer-level packaging (WLP) and advanced packaging applications

II. Core technology principle

1. Intelligent printing system

Multi-axis linkage control: Adopt 8-axis synchronous motion control to achieve nano-level synchronization of scraper, steel mesh and PCB

Adaptive pressure regulation: Real-time monitoring of solder paste rheological properties and automatic adjustment of scraper parameters

Quantum-level vision system: Equipped with 12K ultra-high resolution 3D SPI, with detection accuracy of ±5μm

2. Breakthrough innovative technology

Galactic Flow™ solder paste flow control technology: Predict solder paste flow behavior through AI

Nano-Snap™ demolding technology: Patented nano-level vibration demolding, eliminating bridging and pulling tips

Self-Learning AI engine: Continuously optimize printing parameters to achieve "zero defect" production

III. Core specification parameters

Flokkabreytur

Printing accuracy ±8μm (3σ)

Printing speed 50-500mm/s (intelligent variable speed control)

Applicable components 01005~50mm² large components

Stencil thickness 0.05-0.5mm

Minimum opening 60μm

Repeat accuracy Cpk≥2.0

Line change time <90 seconds (fully automatic)

Communication interface OPC UA+SECS/GEM

IV. Revolutionary features

1. Intelligent production system

Predictive Printing™: Predict and compensate for potential defects in advance

Digital Twin: Virtual debugging and process optimization

Autonomous Calibration: Fully automatic calibration system

2. Ultimate precision guarantee

Nano-level linear motor drive

Active temperature compensation system

Suspended scraper supported by air bearing

3. Industry 4.5 function

Blockchain traceability system

Cloud collaborative optimization

AR remote maintenance support

V. Core functional modules

1. Ultra-precision printing unit

Magnetic suspension scraper system (zero friction)

Six-degree-of-freedom steel mesh leveling

Micro-environment temperature and humidity control

2. Quantum detection system

12K 3D+2D composite detection

Deep learning defect classification

Real-time closed-loop feedback

3. Intelligent maintenance system

Áminning um fyrirsjáanleg viðhald

Self-cleaning paste supply system

Spare parts life monitoring

VI. Typical application scenarios

Ultra-fine pitch printing

Mobile phone APU chipset

MEMS sensor

Mixed assembly

Chip + passive component coplanar printing

Special-shaped component synchronous printing

Special process

Bottom fill glue printing

Precise coating of thermal conductive materials

VII. Key points of use specifications

1. Environmental requirements

Constant temperature workshop: 23±0.5℃

Cleanliness: below Class 1000

Anti-static level: <50V

2. Operation specifications

Use ASM certified solder paste

Perform Nano-Cal calibration daily

Use original consumables set

3. Process window

Parameters Recommended values

Scraper angle 55±2°

Demolding acceleration 0.3-0.8m/s²

Printing gap 0.05-0.15mm

8. Common alarm processing

1. Code: NGX-101

Phenomenon: Quantum camera misalignment

Processing: Execute Auto-QCal calibration process

2. Code: NGX-205

Phenomenon: Abnormal solder paste rheology

Processing: Check solder paste temperature recovery status and change batches

3. Code: NGX-308

Phenomenon: Nano positioning deviation

Processing: Clean linear guide and restart positioning system

9. Intelligent maintenance strategy

Daglega:

Perform Nano-Clean steel mesh cleaning

Check magnetic suspension scraper status

Vikulega:

Calibrate quantum vision system

Update AI model database

Mánaðarlega:

Deep maintenance of linear motor

Replace microenvironment filter

10. Market positioning analysis

Technical benchmark: 3 times more accurate than traditional equipment

Return on investment: 6-12 months to recover costs

Applicable production lines:

High-end smartphone SMT line

Automotive electronics production line

Advanced packaging line

XI. Summary and Outlook

DEK Neo GALAXY redefines the technical boundaries of solder paste printing, and its features include:

Achieving stable submicron printing for the first time

Opening a new era of AI autonomous optimization

Supporting the needs of next-generation electronic packaging

This device is particularly suitable for high-end manufacturing scenarios that pursue "zero defect" production and is the core equipment for building smart factories. With the evolution of 5G-A and 6G technologies, its technical advantages will become more prominent.