Oomatshini bokushicilela be-ASM DEK Neo GALAXY

I-DEK Neo GALAXY sisishicileli se-solder esizenzekelayo esizenzekela ngokugqibeleleyo se-ultra-high echanekileyo esungulwe ziiNkqubo zeNdibano ze-ASM, ezimele elona nqanaba liphezulu leteknoloji yoshicilelo lwe-solder ye-SMT yangoku. Le modeli yenzelwe iimfuno zesizukulwana esilandelayo sokwenziwa kombane, ngakumbi:

Amacandelo epitch ecwengileyo (afana ne-01005, 0.2mm pitch BGA)

I-PCB entsonkothileyo kakhulu (unxibelelwano lwe-5G, ii-elektroniki zemoto, ikhadi le-AI lokukhawulezisa)

I-Wafer-level packaging (WLP) kunye nezicelo zokupakisha eziphambili

II. Umgaqo weteknoloji engundoqo

1. Inkqubo yoshicilelo ekrelekrele

Ulawulo lonxibelelwano lwe-Multi-axis: Yamkela i-8-axis yokulawula intshukumo ye-synchronous ukufikelela kwi-nano-level synchronization ye-scraper, i-mesh yensimbi kunye ne-PCB

Ukulawulwa koxinzelelo oluguquguqukayo: Ukubekwa kweliso kwexesha lokwenyani kwepropathi ye-heological ye-solder paste kunye nohlengahlengiso oluzenzekelayo lweeparamitha ze-scraper.

Inkqubo yombono wenqanaba le-Quantum: Ixhotyiswe nge-12K ye-ultra-high resolution ye-3D SPI, kunye nokuchongwa kokuchaneka kwe-± 5μm

2. Ukuphumelela iteknoloji entsha

Itekhnoloji yokulawula ukuhamba kwe-solder ye-Galactic Flow ™: Qikelela i-solder paste flow flow nge-AI

Itekhnoloji yokubonisa i-Nano-Snap™: Ukwenziwa kwe-patent ye-nano-level vibration, ukuphelisa iibhulorho kunye neengcebiso zokutsala

I-injini ye-AI yokuziFundela: Qhubeka nokwandisa iiparamitha zoshicilelo ukufezekisa imveliso "ye-zero defect"

III. Iiparamitha zokuchaza ezingundoqo

Iiparamitha zodidi

Ukuchaneka koshicilelo ±8μm (3σ)

Isantya soshicilelo 50-500mm/s (ulawulo oluguquguqukayo olukrelekrele)

Amalungu asebenzayo 01005~50mm² amacandelo amakhulu

Ubunzima bestencil 0.05-0.5mm

Ubuncinci bokuvula 60μm

Phinda ukuchaneka kweCpk≥2.0

Ixesha lokutshintsha umgca <90 imizuzwana (ngokupheleleyo ngokuzenzekelayo)

Ujongano lonxibelelwano OPC UA+SECS/GEM

IV. Iimpawu zenguqu

1. Inkqubo yemveliso ekrelekrele

I-Predictive Printing™: Qikelela kwaye ubuyekeze iziphene ezinokubakho kwangaphambili

I-Digital Twin: I-debugging ebonakalayo kunye nokuphucula inkqubo

Ulungelelwaniso oluZimeleyo: Inkqubo yolungelelwaniso oluzenzekelayo ngokupheleleyo

2. Isiqinisekiso esichanekileyo

I-Nano-level linear motor drive

Inkqubo yembuyekezo yobushushu esebenzayo

I-scraper emisiweyo exhaswa yi-air bear

3. Umsebenzi weshishini 4.5

Inkqubo yokulandelela iBlockchain

Ukusebenzelana kwamafu

Inkxaso yolondolozo lwe-AR ekude

Iimodyuli ezisebenzayo zeV

1. Iyunithi yoshicilelo oluchanekileyo

Inkqubo ye-magnetic suspension scraper (zero friction)

Izidanga ezithandathu ze-freedom mesh yentsimbi

Ubushushu bendalo encinci kunye nolawulo lokufuma

2. Inkqubo yokufumanisa i-quantum

12K 3D + 2D ubhaqo oluhlanganisiweyo

Ulwahlulo lwesiphene ekufundeni nzulu

Ingxelo yexesha lokwenyani ivaliwe

3. Inkqubo yokulondoloza ehlakaniphile

Isikhumbuzo sogcino oluqikelelweyo

Ukuzicoca inkqubo yokuncamathelisa

Ukubeka iliso kubomi beendawo ezisecaleni

VI. Iimeko zosetyenziso oluqhelekileyo

Ukuprintwa kwepitch entle kakhulu

Ifowuni ye-APU chipset

Uluvo lwe-MEMS

Indibano edibeneyo

I-Chip + icandelo lokwenziwa koshicilelo lwe-coplanar

Ushicilelo olulungelelanisiweyo olumilise okwenxalenye eyodwa

Inkqubo ekhethekileyo

Ukuprinta kweglue ezantsi

Ukugquma okuchanekileyo kwezinto zokuqhuba i-thermal

VII. Iimpawu eziphambili zokusetyenziswa

1. Iimfuno zokusingqongileyo

Iworkshop yobushushu obuthe rhoqo: 23±0.5℃

Ukucoceka: ngaphantsi kweClass 1000

Inqanaba le-Anti-static: <50V

2. Iinkcukacha zokusebenza

Sebenzisa intlama ye-solder eqinisekisiweyo ye-ASM

Yenza i-Nano-Cal calibration yonke imihla

Sebenzisa izinto ezisetyenziswayo zoqobo

3. Inkqubo yefestile

Iiparamitha Amaxabiso acetyiswayo

I-engile ye-scraper 55±2 °

Ukukhawulezisa ukwakhiwa kwe-0.3-0.8m/s²

Umsantsa wokushicilela 0.05-0.15mm

8. Ukulungiswa kwe-alarm eqhelekileyo

1. Ikhowudi: NGX-101

I-Phenomenon: Ukungahambi kakuhle kwekhamera ye-quantum

Ukuqhubela phambili: Yenza inkqubo yokulinganisa i-Auto-QCal

2. Ikhowudi: NGX-205

I-Fenomenon: I-rheology ye-solder paste engaqhelekanga

Ukusetyenzwa: Jonga imeko yokubuyisela ubushushu be-solder kunye nokutshintsha iibhetshi

3. Ikhowudi: NGX-308

I-Phnomenon: Ukutenxa kwindawo yeNano

Ukuqhubekeka: Coca isikhokelo somgca kwaye uqalise kwakhona inkqubo yokubeka

9. Isicwangciso esihlakaniphile sokulondoloza

Yonke imihla:

Yenza i-Nano-Clean metal mesh yokucoca

Jonga imo ye-magnetic suspension scraper

Rhoqo ngeveki:

Ukulungelelanisa inkqubo yombono we-quantum

Hlaziya imodeli yedatha ye-AI

Ngenyanga:

Ukugcinwa okunzulu kwemoto yomgca

Faka endaweni yesihluzi sendalo esingqongileyo

10. Uhlalutyo lokuma kwemarike

Umgangatho wobugcisa: amaxesha ama-3 achaneke ngakumbi kunezixhobo zemveli

Ukubuya kutyalo-mali: iinyanga ezi-6-12 zokubuyisela iindleko

Imigca yemveliso esebenzayo:

Umgca we-smartphone we-SMT ephezulu

Umgca wokuvelisa i-Automotive electronics

Umgca wokupakisha ophezulu

XI. Isishwankathelo kunye ne-Outlook

I-DEK Neo GALAXY ichaza kwakhona imida yobugcisa yokuprinta i-solder paste, kunye neempawu zayo ziquka:

Ukufezekisa ushicilelo lwe-submicron oluzinzileyo okokuqala

Ukuvula ixesha elitsha le-AI yokuzimela ngokuzimeleyo

Ukuxhasa iimfuno zesizukulwana esilandelayo sokupakishwa kwe-elektroniki

Esi sixhobo silungele iimeko zokuvelisa eziphezulu ezilandela imveliso ye "zero defect" kwaye sisixhobo esingundoqo sokwakha iifektri ezihlakaniphile. Ngokuziphendukela kweteknoloji ye-5G-A kunye ne-6G, izibonelelo zayo zobugcisa ziya kuba zivelele ngakumbi.