Imashini yo gufunga insinga n'ikoranabuhanga rya ASM ryo guhuza insinga

ASM izwi cyane nk'ikigo cy'ingenzi mu gutanga ikoranabuhanga mu bikoresho bigezweho byo gupakira ibikoresho bya semiconductor, cyane cyane mu buryo bwo guhuza insinga bukoresha ikoranabuhanga rigezweho bukoreshwa mu guteranya ibikoresho bya IC no gukora ibikoresho bya backend.

Uburyo bwo guhuza ibyuma byayo bw’insinga bwakozwe kugira ngo butange uburyo bwo guhuza ibyuma bya silikoni n’ibikoresho bya substrate byihuta kandi neza, bushyigikira ibisabwa by’ingenzi mu bikoresho by’ikoranabuhanga by’imodoka, ikoranabuhanga rigezweho (HPC), ndetse n’uburyo bwo gupakira ibintu mu buryo buhanitse.

Bitandukanye na sisitemu zisanzwe zo guhuza, ibisubizo bya ASM wire bonder bihuza uburyo bwo kugenzura ingendo mu buryo bwa multi-axis, guhuza icyerekezo mu buryo bw'igihe nyacyo, no kugenzura imbaraga zo guhuza, bigatuma habaho umusaruro uhamye mu bice by'umuvuduko mwiza cyane.

Insinga ya ASM AEROihagarariye igisekuru gitaha cy’imiterere y’ubuhuza ya ASM, yagenewe ahantu hagezweho ho gupakira nka 2.5D integration, high-density interconnect (HDI), n’ibikoresho bya semiconductor byo mu gisekuru gitaha.

Ibyiza by'ingenzi by'ikoranabuhanga birimo:
- Kugenzura ingendo neza cyane ku rwego rwa mikoroni
- Sisitemu yo kureba igezweho yo gukosora uburyo bwo guhuza ibintu mu buryo bwikora
- Guhuza thermosonic mu buryo buhamye kugira ngo insinga nziza zikoreshwe
- Ubushobozi bwo gutanga umusaruro mwinshi mu bidukikije bikorerwamo ibintu byinshi
- Gukomera ku mikorere kugira ngo habeho amahame y’ubwizerwe ku rwego rw’imodoka

Mu nganda zikora ibikoresho bya semiconductor backend, hakoreshwa ikoranabuhanga ritandukanye ryo guhuza ibikoresho bitewe n'imiterere y'ibipfunyika, ibisabwa mu mikorere y'amashanyarazi, n'intego z'ikiguzi cyo gukora. Gusobanukirwa itandukaniro riri hagati y'izi sisitemu ni ingenzi cyane mu guhitamo ibikoresho bikwiye ku murongo w'ibikorwa.

Icyiciro	Insinga zo gufunga	Umufatanyabikorwa	Flip Chip Bonder
Imikorere y'ibanze	Ihuza utubati tw'ibyuma (chip pads) n'icyuma gifunganye hakoreshejwe insinga nto	Ishyiramo kandi igafata ibinyabiziga ku gice cy'ubutaka cyangwa ku gitereko cy'icyuma	Ifata ku buryo butaziguye ikoresheje uduce duto two gusoda cyangwa inkingi z'umuringa
Uburyo bwo guhuza	Guhuza insinga (Au / Cu / Al wire)	Adhesive cyangwa epoxy die attach	Guhuza hakoreshejwe uburyo bwa Bump
Ingorane z'Imikorere	Uburyo bwo gukura buringaniye kandi bunoze cyane	Hasi kugeza ku gipimo bitewe n'urwego rw'imikorere y'ikoranabuhanga	Hejuru, bisaba guhuza neza no kugenzura ibikorwa bigezweho
Ibisabwa ku buryo bunonosoye	Uburinganire bwo guhuza ku rwego rwa micron	Ubuziranenge buri hagati mu gushyira ibintu	Ubuhanga bwo hejuru cyane ku miyoboro mito y'itumanaho
Ibisanzwe	Gupakira IC, LED, ibikoresho by'ikoranabuhanga by'imodoka	Gushyira chips mu gice cy'itsinda ry'ibikoresho	Ikoranabuhanga rihambaye, gupakira neza, guhuza 2.5D/3D
Iterambere ry'ikoranabuhanga	Ikuze cyane kandi ikoreshwa cyane	Ikuze kandi ihendutse	Iterambere kandi itera imbere vuba
Urwego rw'Ikiguzi	Hagati	Kuva hasi kugeza hagati	Hejuru

Incamake y'ingenzi:
Uburyo bwo guhuza insinga bukomeje kuba uburyo bukoreshwa cyane mu gukora semiconductor bitewe n’uko bungana mu biciro, uburyo bwizewe, n’igihe cy’imikorere. Ariko, ikoranabuhanga rya flip chip na die bonding rikomeje gukoreshwa cyane mu bice bigezweho byo gupakira aho ubwinshi bw’imikorere ari ingenzi cyane.

Mu bikorwa byinshi, ubu buryo ntibuhuza ahubwo buhorana mu byiciro bitandukanye byo gupakira no mu byiciro bitandukanye by'ibicuruzwa.

Mu gupakira ibikoresho bya semiconductor bigezweho, si sisitemu zose zo guhuza insinga zitanga urwego rumwe rw'ubuziranenge, umuvuduko, n'ubudahangarwa bw'imikorere. ASM AERO ni urubuga rw'igisekuru gitaha rwagenewe gukoreshwa mu gupakira ibikoresho bigezweho kandi by'ubucucike, mu gihe udukoresho dusanzwe two guhuza insinga dukoreshwa mu guteranya ibikoresho rusange bya IC.

Ikiranga	Umugozi w'insinga wa ASM AERO	Insinga zisanzwe zo gufunga
Porogaramu y'intego	Gupakira bigezweho (2.5D / 3D IC, HPC, utwuma tw’imodoka)	Gupakira muri rusange IC n'ibikoresho bisanzwe bya semiconductor
Urwego rw'Uburyo Bw'isuku	Ubuhanga bwo hejuru cyane hamwe no gukosora uburyo bwo guhuza ibintu mu buryo buhanitse	Uburinganire busanzwe ku rwego rwa mikoroni
Sisitemu yo Kugenzura Ingendo	Sisitemu yo kugenda igezweho ifite umurongo munini w’imikorere	Imiterere isanzwe yo kugenzura ingendo
Sisitemu yo Kureba	Gutunganya icyerekezo gishya mu gihe nyacyo	Sisitemu isanzwe yo guhuza amaso
Ihindagurika ry'Imikorere	Yakozwe neza kugira ngo ikoreshwe neza cyane kandi ikoreshwe mu buryo bugoye	Ihamye mu buryo busanzwe bwo gupakira
Ubushobozi bwo gukoresha	Ifite umuvuduko mwinshi kandi ikoreshwa neza mu gutunganya ibicuruzwa	Hagati kugeza hejuru bitewe n'imiterere
Ikoreshwa Risanzwe	Indangagaciro za semiconductor zigezweho na OSAT	Ibikoresho bikuru byo gupakira ibikoresho bya semiconductor

Incamake y'ingenzi:
Sisitemu za ASM AERO zakozwe by’umwihariko kugira ngo zikoreshwe mu gupakira ibikoresho bya semiconductor byo mu gisekuru gitaha aho ubucucike bw’ubuhanga, ubuziranenge bw’ibimenyetso, no kudahungabana kw’imikorere ari ingenzi cyane. Imigozi isanzwe y’insinga iracyakoreshwa cyane mu bikorwa bihendutse kandi bitanga umusaruro mwinshi.

Mu bikorwa by’igihe kirekire byo gukora semiconductor, imashini zikoresha insinga zikora ku buryo bwihuse kandi bwihuta cyane. Uko igihe kigenda gihita, bimwe mu bice byazo birangirika kandi bishobora kugira ingaruka ku kudahinduka kw’insinga, umusaruro, no ku buryo ibintu bihora bihinduka.

Ibibazo bikunze kugaragara mu bijyanye n'umusaruro birimo:

- Kwangirika k'umutwe w'imigozi bigatuma imbaraga zo gufatana zidahindagurika cyangwa imiterere idahwitse y'imigozi - Kwanduza imiyoboro y'amaraso biterwa no kwibumbira mu bisigazwa cyangwa isuku idakwiye - Kutareba neza kw'uburyo bwo kubona ibintu bigatuma imigozi ishyirwa mu mwanya udakwiye mu gihe cyo gufatana - Kudakomera kw'insinga guterwa no guhindagurika kw'imigozi cyangwa kudahuza kw'imigozi - Guhindagurika k'ubushyuhe ku ngira ingaruka ku buryo ingufu zo gufatana zikomeza gukora.

Ibi bibazo ubusanzwe ntibigaragara mu buryo butunguranye, ariko buhoro buhoro bigira ingaruka ku kudahinduka kw'imikorere, bigatera ihindagurika ry'umusaruro mbere yuko habaho gutsindwa kugaragara.

Ubusanzwe, kubungabunga impanuka mu buryo buhoraho ni ngombwa muri ibi bikurikira:
- Gupima umutwe w'imigozi no kugenzura kwangirika kwayo - Gahunda yo gusimbuza imiyoboro y'amaraso hashingiwe ku mubare w'ingendo - Kugenzura uburyo bwo kureba ibintu - Gusukura inzira y'insinga no guhindura imbaraga - Gukurikirana ubushyuhe mu migozi mu gihe cyo guhuza ibintu

Mu nganda zikora ibikoresho bya semiconductor binini, kubungabunga ubuziranenge bw'imibanire ihamye akenshi bishingiye ku ngamba zo kubungabunga ibyuma kuruta imikorere y'imashini gusa.

Guhitamo umugozi w'insinga si uburyo bwo kugereranya gusa ibipimo, ahubwo ni n'icyemezo gishingiye ku buryo umusaruro uhamye, guhuza ibikoresho, no kugenzura ikiguzi cy'inganda mu gihe kirekire.

Mu igenamigambi nyaryo ry’umusaruro wa semiconductor, ibintu bikurikira bikunze gusuzumwa:

1. Umuvuduko wo guhuza ibintu n'ibisabwa mu gutanga umusaruro
Imirongo ikora ifite umusaruro mwinshi wa IC isaba ubushobozi buhamye bwo guhuza umuvuduko mwinshi nta gutakaza uburyo bwo guhuza cyangwa guhuza umurongo.

2. Guhuza ibikoresho by'insinga
Uburyo butandukanye bwo gukoresha busaba insinga za zahabu (Au), umuringa (Cu), cyangwa aluminiyumu (Al). Guhitamo ibikoresho bigira ingaruka ku bushyuhe bwo gufatanya, kugenzura imbaraga, no kwizerwa igihe kirekire.

3. Gutuza neza no gushimangira idirishya
Gupakira bigezweho bisaba uburyo bwo guhuza neza mu rwego rwa mikoroni. Idirishya ry'imikorere ihamye akenshi ni ingenzi kuruta ibisobanuro by'imashini.

4. Urwego rw'imikorere y'ikoranabuhanga n'aho ibikorwa bikorerwa
Sisitemu zikora zikoresheje ikoranabuhanga ryikora neza zikundwa cyane mu bikorwa byinshi, mu gihe sisitemu zikora zikoresha ikoranabuhanga ryikora zikunze gukoreshwa mu bushakashatsi no mu iterambere cyangwa mu gukora ibintu bike.

5. Imiterere y'ikoreshwa n'ubwoko bw'igikoresho
Ibisabwa biratandukanye cyane hagati y’ibipfunyika bisanzwe bya IC, ibikoresho by’amashanyarazi by’imodoka, n’imiterere igezweho yo gupfunyika nka 2.5D/3D.

6. Ikiguzi cy'ubuzima bw'umuntu
Uretse ishoramari rya mbere ry’imashini, ikiguzi cyo kubungabunga, kuboneka kw’ibice bishobora gukoreshwa, ndetse n’ingaruka zo kudakora neza kw’imashini, bigomba kandi kureberwa ku giciro cyose cy’umutungo (TCO).

Mu by’ukuri, abakora ibikoresho benshi bahitamo ibikoresho bidashingiye gusa ku bipimo, ahubwo bishingiye ku buryo umusaruro uhoraho uhoraho ndetse n’ubushobozi bwo gutanga serivisi.