Makina Olumikizira Ma waya ndi Pulatifomu Yaukadaulo Yolumikizira Ma waya ya ASM

ASM imadziwika kwambiri ngati kampani yopereka ukadaulo wofunikira kwambiri pazida zapamwamba zopangira ma semiconductor, makamaka mumakina olumikizira mawaya olondola kwambiri omwe amagwiritsidwa ntchito popanga ma IC assembly ndi backend.

Mapulatifomu ake olumikizira mawaya adapangidwa kuti apereke kulumikizana kwachangu komanso kolondola kwambiri pakati pa silicon chips ndi zinthu za substrate, kuthandizira zofunikira kwambiri pa zamagetsi zamagalimoto, makompyuta apamwamba (HPC), ndi mapulogalamu apamwamba opaka.

Mosiyana ndi machitidwe achikhalidwe olumikizirana, mayankho a ASM wire bonder amaphatikiza kuwongolera mayendedwe a multi-axis, kulumikizana kwa masomphenya nthawi yeniyeni, ndi kuwongolera mphamvu yolumikizirana yosinthika, zomwe zimathandiza kupanga kokhazikika m'malo okhala ndi pitch yabwino kwambiri.

Cholumikizira waya cha ASM AEROikuyimira mbadwo wotsatira wa zomangamanga za ASM bonding, zomwe zapangidwira ma node apamwamba opaka monga 2.5D integration, high-density interconnect (HDI), ndi zida za semiconductor za m'badwo wotsatira.

Ubwino waukulu wa ukadaulo ndi monga:
- Kuwongolera mayendedwe molondola kwambiri pamlingo wa micron
- Dongosolo lapamwamba la masomphenya kuti likonzedwe lokha
- Kugwirizana kokhazikika kwa thermosonic kwa ntchito za waya wosalala
- Mphamvu yayikulu yogwiritsira ntchito malo opangira zinthu zambiri
- Kukhazikika kwa njira zoyendetsera miyezo yodalirika yamagalimoto

Mu kupanga zinthu za semiconductor backend, ukadaulo wosiyanasiyana wogwirizanitsa umagwiritsidwa ntchito kutengera kapangidwe ka ma CD, zofunikira pakugwira ntchito kwamagetsi, ndi zolinga za mtengo wopangira. Kumvetsetsa kusiyana pakati pa machitidwe awa ndikofunikira kwambiri posankha zida zoyenera zopangira.

Gulu	Cholumikizira Waya	Wothandizira	Flip Chip Bonder
Ntchito Yaikulu	Amalumikiza ma chip pads ku substrate pogwiritsa ntchito waya womangira wopyapyala	Malo ndi zomangira zimathira pa substrate kapena chimango cha lead	Amalumikiza mwachindunji chip chopindika pogwiritsa ntchito ma solder bumps kapena zipilala zamkuwa
Njira Yolumikizirana	Kulumikiza waya (Au / Cu / Al waya)	Chomangira chomatira kapena cholumikizira cha epoxy	Kulumikizana mwachindunji kochokera ku Bump
Kuvuta kwa Njira	Ndondomeko yokhwima yocheperako komanso yabwino kwambiri	Yotsika mpaka yocheperako kutengera mulingo wodzichitira wekha	Pamwamba, pamafunika kulinganiza bwino komanso kuwongolera njira zapamwamba
Kufunika Koyenera	Kulondola kwa mgwirizano wa micron-level	Kulondola kwa malo pang'ono	Kulondola kwambiri kwa maulumikizidwe ang'onoang'ono
Ntchito Zofananira	Ma CD, LED, zamagetsi zamagalimoto	Kuyika kwa chip mu gawo la module	Makompyuta ogwira ntchito bwino kwambiri, ma phukusi apamwamba, kuphatikiza kwa 2.5D/3D
Kukhwima kwa Ukadaulo	Yokhwima kwambiri komanso yogwiritsidwa ntchito kwambiri	Yokhwima komanso yosawononga ndalama zambiri	Zapamwamba komanso zikusintha mwachangu
Mulingo wa Mtengo	Wapakati	Wotsika mpaka wapakati	Wapamwamba

Chidziwitso Chofunika:
Kulumikiza mawaya kumakhalabe njira yolumikizirana yomwe imagwiritsidwa ntchito kwambiri popanga ma semiconductor chifukwa cha kulinganiza mtengo wake, kudalirika kwake, komanso kukhwima kwa njira. Komabe, ukadaulo wa flip chip ndi die bonding ukugwiritsidwa ntchito kwambiri m'malo apamwamba opangira ma CD komwe kuchuluka kwa magwiridwe antchito ndikofunikira kwambiri.

M'malo ambiri opangira zinthu, ukadaulo uwu suli wosiyana koma umakhalapo nthawi zonse pazigawo zosiyanasiyana zopakira ndi magulu azinthu.

Mu ma CD apamwamba a semiconductor, si makina onse olumikizirana mawaya omwe amapereka mulingo wofanana wa kulondola, liwiro, ndi kukhazikika kwa njira. ASM AERO ikuyimira nsanja ya m'badwo wotsatira yopangidwira ntchito zopaka kwambiri komanso zapamwamba, pomwe ma waya okhazikika nthawi zambiri amagwiritsidwa ntchito popangira ma IC ambiri.

Mbali	Chingwe cha waya cha ASM AERO	Cholumikizira Waya Chokhazikika
Kugwiritsa Ntchito Cholinga	Ma phukusi apamwamba (2.5D / 3D IC, HPC, ma chips agalimoto)	Ma CD ambiri ndi zida zodziwika bwino za semiconductor
Mulingo Wolondola	Kulondola kwambiri komanso kukonza bwino kwambiri	Kulondola kwa mulingo wa micron wamba
Dongosolo Lowongolera Kuyenda	Dongosolo lapamwamba losinthasintha la multi-axis	Kapangidwe ka kayendetsedwe ka kayendetsedwe kabwino
Dongosolo la Masomphenya	Kulinganiza masomphenya osinthika nthawi yeniyeni komanso omveka bwino	Dongosolo lokhazikika lolinganiza masomphenya
Kukhazikika kwa Njira	Yokonzedwa bwino kuti ikhale ndi phula labwino kwambiri komanso magawo ovuta	Yokhazikika pa njira zachizolowezi zopakira
Kutha Kuthamanga	Liwiro lapamwamba kwambiri lokonzedwa bwino kuti ligwirizane ndi mizere yopangira yapamwamba	Pakati mpaka pamwamba kutengera momwe zinthu zilili
Kagwiritsidwe Ntchito Kanthawi	Mafakitale apamwamba a semiconductor ndi OSATs	Malo osungiramo zinthu za semiconductor

Chidziwitso Chofunika:
Makina a ASM AERO adapangidwa makamaka kuti azigwiritsidwa ntchito popanga ma semiconductor a m'badwo wotsatira komwe kulondola kwa kuuma, kukhulupirika kwa chizindikiro, ndi kukhazikika kwa njira ndizofunikira kwambiri. Ma waya okhazikika amagwiritsidwabe ntchito kwambiri popanga zinthu zotsika mtengo komanso zotsika mtengo.

M'malo opangira ma semiconductor kwa nthawi yayitali, makina olumikizira mawaya amagwira ntchito motsatira liwiro lapamwamba komanso pafupipafupi. Pakapita nthawi, zigawo zina zimawonongeka mwachibadwa ndipo zimatha kusokoneza kukhazikika kwa ma bonding, kuchuluka kwa zokolola, komanso kusinthasintha kwa njira.

Mavuto omwe amawonedwa m'malo opangira zinthu ndi awa:

- Kuwonongeka kwa mutu wa bond komwe kumabweretsa mphamvu yosakhazikika yolumikizirana kapena kupanga loop yosasinthasintha - Kuipitsidwa kwa capillary komwe kumachitika chifukwa cha kusonkhana kwa zotsalira kapena njira zoyeretsera zosayenerera - Kusakhazikika bwino kwa dongosolo la masomphenya komwe kumabweretsa malo olakwika a pad panthawi yolumikizirana - Kusakhazikika kwa waya chifukwa cha kusintha kwa kukangana kapena kusakhazikika kwa spool tension - Kuthamanga kwa kutentha komwe kumakhudza kukhazikika kwa mphamvu yolumikizirana popanga kosalekeza

Mavuto amenewa nthawi zambiri samawonekera mwadzidzidzi, koma pang'onopang'ono amakhudza kukhazikika kwa njira, zomwe zimapangitsa kuti phindu lizichepa pang'ono musanayambe kulephera kooneka.

Kusamalira nthawi zonse koteteza nthawi zambiri kumafunika m'malo otsatirawa:
- Kuyang'anira ndi kuyang'anira kutayika kwa mutu wa bond - Kukonza nthawi yosinthira capillary kutengera kuchuluka kwa nthawi yozungulira - Kutsimikizira kukhazikika kwa makina owonera - Kuyeretsa njira yolumikizira mawaya ndi kusintha kwa mphamvu - Kuyang'anira kukhazikika kwa kutentha m'malo olumikizirana

Mu kupanga ma semiconductor ambiri, kusunga ubwino wokhazikika wa ma bonding nthawi zambiri kumadalira kwambiri njira yodzitetezera kuposa momwe makina amagwirira ntchito okha.

Kusankha waya wolumikizira si njira yongoyerekeza zinthu zokha, komanso chisankho chozikidwa pa kukhazikika kwa kupanga, kugwirizana kwa chipangizo, komanso kuwongolera mtengo wopanga kwa nthawi yayitali.

Mu kukonzekera kwenikweni kwa kupanga ma semiconductor, zinthu zotsatirazi nthawi zambiri zimawunikidwa:

1. Liwiro logwirizanitsa ndi kufunika kwa throughput
Mizere yopangira yokhala ndi mphamvu yayikulu ya IC imafuna mphamvu yokhazikika yolumikizirana mwachangu popanda kuwononga kulondola kwa malo kapena kusinthasintha kwa kuzungulira.

2. Kugwirizana kwa zinthu za waya
Kugwiritsa ntchito kosiyanasiyana kumafuna waya wagolide (Au), mkuwa (Cu), kapena aluminiyamu (Al). Kusankha zinthu kumakhudza mwachindunji kutentha kwa mgwirizano, kuwongolera mphamvu, komanso kudalirika kwa nthawi yayitali.

3. Kukhazikika kwa zenera molondola komanso njira
Kupaka kwapamwamba kumafuna kulondola kwa kulinganiza kwa micron. Nthawi zambiri, zenera lokhazikika la njira ndilofunika kwambiri kuposa kufotokozera kwa makina apamwamba.

4. Malo ochitira zinthu zokha komanso malo opangira zinthu
Makina odziyendetsa okha okha ndi omwe amakondedwa kwambiri m'malo opangira zinthu zambiri, pomwe makina odziyendetsa okha nthawi zambiri amagwiritsidwa ntchito mu kafukufuku ndi chitukuko kapena kupanga zinthu zochepa.

5. Chitsanzo cha ntchito ndi mtundu wa chipangizo
Zofunikira zimasiyana kwambiri pakati pa ma CD wamba, zida zamagetsi zamagalimoto, ndi mapangidwe apamwamba a ma CD monga kuphatikiza kwa 2.5D/3D.

6. Kuganizira za mtengo wa moyo wonse
Kupatula ndalama zoyambira zogulira makina, ndalama zokonzera, kupezeka kwa zida zogwiritsidwa ntchito, komanso chiopsezo cha nthawi yogwira ntchito ziyeneranso kuganiziridwa pa mtengo wonse wa umwini (TCO).

M'machitidwe, opanga ambiri amasankha zipangizo osati kutengera zomwe zafotokozedwa, komanso kutengera kukhazikika kwa kupanga kwa nthawi yayitali komanso kuthekera kothandizira ntchito.