Ekyuma ekigatta waya & ASM Wire Bonding Technology Platform

ASM emanyiddwa nnyo ng’omugabi wa tekinologiya omukulu mu byuma eby’omulembe eby’okupakinga semikondokita naddala mu nkola z’okusiba waya ezituufu ennyo ezikozesebwa mu nkola z’okukuŋŋaanya IC n’okukola eby’emabega.

Enkola zaayo ezikwata waya zikoleddwa yinginiya okutuusa okuyungibwa okw’amaanyi, okw’obutuufu obw’amaanyi wakati wa chips za silicon n’ebintu ebikola substrate, nga biwagira ebyetaago ebikulu mu byuma by’emmotoka, kompyuta ez’omutindo ogwa waggulu (HPC), n’okukozesa okupakinga okw’omulembe.

Okwawukana ku nkola za bulijjo ez’okusiba, ASM waya bonder solutions zigatta multi-axis motion control, real-time okulaba alignment, n’okukyusakyusa bonding force control, okusobozesa okufulumya okutebenkevu mu ultra-fine pitch environments.

ASM AERO ekiyungo kya wayaekiikirira omulembe oguddako ogw’enzimba y’okukwatagana kwa ASM, eyakolebwa ku nsonga z’okupakinga ez’omulembe nga 2.5D integration, high-density interconnect (HDI), n’ebyuma bya semiconductor eby’omulembe oguddako.

Ebirungi ebikulu ebiri mu tekinologiya mulimu:
- Ultra-high precision entambula control ku micron-level obutuufu
- Enkola y’okulaba ey’omulembe ey’okutereeza okukwatagana mu ngeri ey’otoma
- Stable thermosonic bonding okusobola okukozesa waya ennungi
- Obusobozi obw’okuyita waggulu ku mbeera z’okufulumya ebintu mu bungi
- Okutebenkera kw’enkola ku mutindo gw’okwesigamizibwa ogw’omutindo gw’emmotoka

Mu kukola semiconductor backend, tekinologiya ow’enjawulo ow’okusiba akozesebwa okusinziira ku nsengeka y’okupakinga, ebyetaago by’omutindo gw’amasannyalaze, n’ebigendererwa by’omuwendo gw’okufulumya. Okutegeera enjawulo wakati w’enkola zino kikulu nnyo ng’olonda ebyuma ebituufu eby’okukola layini y’okufulumya.

Olubu	Ekiyungo kya Waya	Aba Bonder	Flip Chip Bonder nga bwe kiri
Omulimu Omukulu	Agatta chip pads ku substrate nga ekozesa fine bonding wire	Ebifo n’ebikwata ku bifa ku substrate oba lead frame	Akwata butereevu chip ezikyusiddwa ng’okozesa ebikonde bya solder oba empagi z’ekikomo
Enkola y’okuyunga	Okusiba waya (Waya ya Au / Cu / Al) .	Adhesive oba epoxy die attach	Okuyungibwa obutereevu okwesigamiziddwa ku bump
Enkola Enzibu	Enkola y’okukula ey’ekigero, erongooseddwa ennyo	Wansi okutuuka ku kigero okusinziira ku ddaala lya automation	Waggulu, yeetaaga okukwatagana okutuufu n’okufuga enkola ey’omulembe
Ekyetaagisa Okukola Obutuufu	Obutuufu bw’okukwatagana ku ddaala lya micron	Obutuufu bw’okuteeka mu kifo eky’ekigero	Ultra-high precision for okuyungibwa kw’eddoboozi eddungi
Enkozesa eya bulijjo	Okupakinga IC, LED, ebyuma by’emmotoka	Okuteeka chip mu kukungaanya modulo	Kompyuta ey’omutindo ogwa waggulu, okupakinga okw’omulembe, okugatta 2.5D/3D
Okukula kwa Tekinologiya	Ekuze nnyo era ekozesebwa nnyo	Ekuze era ekendeeza ku ssente	Okukulaakulana era okukulaakulana amangu
Omutendera gw’Ensimbi	Midiyamu	Wansi okutuuka ku wakati	Waggulu

Okutegeera Ebikulu:
Okusiba waya kusigala nga y’enkola y’okuyunga wakati esinga okukozesebwa mu kukola semikondokita olw’enjawulo yaayo ey’omuwendo, obwesigwa, n’okukula kw’enkola. Wabula tekinologiya wa flip chip ne die bonding yeeyongera okukozesebwa mu mbeera z’okupakinga ez’omulembe nga density y’omutindo y’emirimu kikulu nnyo.

Mu mbeera ezisinga ez’okufulumya, tekinologiya ono takwatagana wabula abeera wamu ku mitendera egy’enjawulo egy’okupakinga n’ebika by’ebintu.

Mu kupakinga kwa semikondokita okw’omulembe, si nkola zonna ez’okusiba waya ezituusa omutindo gwe gumu ogw’obutuufu, sipiidi, n’okutebenkera kw’enkola. ASM AERO ekiikirira omukutu ogw’omulembe oguddako ogwategekebwa okukozesebwa mu kupakinga mu density enkulu n’ey’omulembe, ate nga standard wire bonders zitera okukozesebwa mu kukuŋŋaanya IC okwa bulijjo.

Ekintu eky'enjawulo	ASM AERO Ekiyungo kya waya	Standard Wire Bonder
Okusaba Okugenderera	Okupakinga okw’omulembe (2.5D / 3D IC, HPC, chips ez’omutindo gw’emmotoka)	Okupakinga kwa IC okwa bulijjo n’ebyuma bya semiconductor ebya mutindo
Omutendera gw’Obutuufu	Ultra-high precision n'okutereeza alignment ey'omulembe	Obutuufu obw’omutindo gwa micron-level
Enkola y’okufuga entambula	Enkola ey’omulembe ey’entambula ey’okukyusakyusa ey’ebisenge ebingi (multi-axis adaptive motion system).	Enzimba y’okufuga entambula eya bulijjo
Enkola y’okulaba	Okukwatagana kw’okulaba okukwatagana mu kiseera ekituufu okw’obulungi obw’amaanyi	Enkola y’okukwatagana kw’okulaba okwa mutindo
Okutebenkera kw’enkola	Optimized for ultra-fine pitch ne substrates enzibu	Enywevu ku nkola eza bulijjo ez’okupakinga
Obusobozi bw’okuyita mu nkola	High-speed optimized ku layini z’okufulumya ez’omulembe	Eky’ekigero okutuuka ku kya waggulu okusinziira ku nsengeka
Enkozesa eya bulijjo	Fabs za semiconductor ez’omulembe ne OSATs	Ebifo ebikulu ebipakiddwamu semikondokita

Okutegeera Ebikulu:
Enkola za ASM AERO zikoleddwa mu ngeri ey’enjawulo okupakinga semikondokita ez’omulembe oguddako nga density entuufu, obulungi bwa siginiini, n’okutebenkera kw’enkola bikulu nnyo. Standard waya bonders zisigala nga zikozesebwa nnyo mu mbeera z’okufulumya ezitasaasaanya ssente nnyingi, ezikola obungi obw’amaanyi.

Mu mbeera z’okufulumya semikondokita ez’ekiseera ekiwanvu, ebyuma ebisiba waya bikola wansi w’okutambula okw’ebyuma okw’amaanyi, okwa frequency enkulu. Oluvannyuma lw’ekiseera, ebitundu ebimu mu butonde bivunda era biyinza okukosa okutebenkera kw’okukwatagana, omutindo gw’amakungula, n’obutakyukakyuka mu nkola.

Ensonga ezitera okutunuulirwa mu mbeera z’okufulumya mulimu:

- Okwambala kw’omutwe gwa bond ekivaako empalirizo y’okukwatagana etali nnywevu oba okutondebwa kwa loopu okutakwatagana - Obujama bw’emisuwa obuva ku kuzimba ebisigalira oba enzirukanya y’okwoza etali ntuufu - Enkola y’okulaba obutakwatagana ekivaamu okuteeka paadi mu ngeri etali ntuufu mu kiseera ky’okusiba - Obutabeera mu ntebenkevu mu mmere ya waya okuva ku nkyukakyuka mu kusikagana oba obutakwatagana mu kusika omuguwa - Okuwuguka kw’ebbugumu okukosa okukwatagana kw’amasoboza ag’okukwatagana mu kukola okutambula obutasalako

Ensonga zino mu bujjuvu tezirabika mangu, naye mpolampola zikwata ku ntegeka y’enkola, ekivaako okukyukakyuka kw’amakungula okutali kwa maanyi nga okulemererwa okulabika tekunnabaawo.

Okuddaabiriza okuziyiza buli kiseera kitera okwetaagisa mu bintu bino wammanga:
- Okupima omutwe gwa bond n’okukebera okwambala - Enteekateeka y’okukyusa emisuwa okusinziira ku kubala enzirukanya - Okukakasa okukwatagana kw’enkola y’okulaba - Okwoza ekkubo ly’emmere ya waya n’okutereeza okusika - Okulondoola okutebenkera kw’ebbugumu mu mbeera y’okusiba

Mu kukola semikondokita ez’obuzito obw’amaanyi, okukuuma omutindo gw’okukwatagana ogunywevu kitera okwesigama ennyo ku nkola y’okuddaabiriza ey’okuziyiza okusinga ku nkola y’ekyuma yokka.

Okulonda waya bonder si nkola ya kugeraageranya specification yokka, naye era okusalawo okwesigamiziddwa ku kutebenkera kw’okufulumya, okukwatagana kw’ebyuma, n’okufuga omuwendo gw’okukola okumala ebbanga eddene.

Mu nteekateeka entuufu ey’okufulumya semikondokita, ensonga zino wammanga ze zitera okwekenneenyezebwa:

1. Sipiidi ya bonding n’obwetaavu bw’okuyita
Layini z’okufulumya ezirina IC output ey’obuzito obw’amaanyi zeetaaga obusobozi obunywevu obw’okusiba ku sipiidi ey’amaanyi awatali kusaddaaka butuufu bwa kifo oba obutakyukakyuka bwa loopu.

2. Okukwatagana kw’ebintu bya waya
Enkola ez’enjawulo zeetaaga waya ya zaabu (Au), ekikomo (Cu), oba aluminiyamu (Al). Okulonda ebintu kukosa butereevu ebbugumu ly’okukwatagana, okufuga amaanyi, n’okwesigamizibwa okw’ekiseera ekiwanvu.

3. Precision n'enkola eddirisa okutebenkera
Okupakinga okw’omulembe kyetaagisa okukwatagana okutuufu ku ddaala lya micron. Eddirisa ly’enkola ennywevu litera okuba enkulu okusinga okunnyonnyola ekyuma ku ntikko.

4. Omutendera gwa otomatiki n’embeera y’okufulumya
Enkola ezikola mu bujjuvu ze zisinga okwettanirwa mu mbeera z’okufulumya ebintu mu bungi, ate enkola ezitali za otomatiki mu bujjuvu zitera okukozesebwa mu R&D oba okufulumya ebintu mu bungi obutono.

5. Enkola y’okukozesa n’ekika ky’ekyuma
Ebyetaago byawukana nnyo wakati w’okupakinga kwa IC okwa mutindo, ebyuma ebikozesa amaanyi g’emmotoka, n’ensengeka z’okupakinga ez’omulembe nga 2.5D/3D integration.

6. Okulowooza ku nsaasaanya y’obulamu
Okusukka ku nsimbi z’ebyuma ezisooka, ssente z’okuddaabiriza, okubeerawo kw’ebitundu ebikozesebwa, n’akabi k’okuyimirira nabyo birina okulowoozebwako mu nsaasaanya yonna ey’obwannannyini (TCO).

Mu nkola, abakola bangi balondawo ebyuma si okusinziira ku biwandiiko byokka, wabula okusinziira ku kutebenkera kw’okufulumya okumala ebbanga eddene n’obusobozi bw’okuwagira empeereza.