Umatshini we-Wire Bonder kunye ne-ASM Wire Bonding Technology Platform

I-ASM yaziwa ngokubanzi njengomboneleli wetekhnoloji ophambili kwizixhobo zokupakisha ze-semiconductor eziphambili, ngakumbi kwiinkqubo zokubopha iingcingo ezichanekileyo ezisetyenziswa kwiinkqubo zokuhlanganisa i-IC kunye ne-backend manufacturing.

Amaqonga ayo e-wire bonder ayilwe ukuze anikezele ngonxibelelwano olukhawulezayo noluchanekileyo phakathi kwee-silicon chips kunye nezixhobo ze-substrate, exhasa iimfuno ezibalulekileyo kwi-elektroniki yeemoto, i-high-performance computing (HPC), kunye nezicelo zokupakisha eziphambili.

Ngokungafaniyo neenkqubo zesiqhelo zokubopha, izisombululo ze-ASM wire bonder zidibanisa ulawulo lwentshukumo olune-axis ezininzi, ulungelelwaniso lombono wexesha langempela, kunye nolawulo lwamandla okubopha oluhambelanayo, okuvumela imveliso ezinzileyo kwiindawo zepitch ezicolekileyo kakhulu.

Ibhondi yocingo ye-ASM AEROimele isizukulwana esilandelayo soyilo lwe-ASM bonding, oluyilelwe iindawo zokupakisha eziphambili ezifana nokuhlanganiswa kwe-2.5D, i-high-density interconnect (HDI), kunye nezixhobo ze-semiconductor zesizukulwana esilandelayo.

Iingenelo eziphambili zobuchwepheshe ziquka:
- Ulawulo lwentshukumo oluchanekileyo kakhulu oluphezulu kakhulu ngokuchaneka kwinqanaba le-micron
- Inkqubo yombono ephucukileyo yokulungisa ulungelelwaniso oluzenzekelayo
- Ukubopha okuzinzileyo kwe-thermosonic kwizicelo zentambo entle
- Amandla aphezulu okuvelisa izinto kwiindawo ezivelisa izinto ezininzi
- Uzinzo lwenkqubo yemigangatho yokuthembeka kweemoto

Kwimveliso ye-semiconductor backend, kusetyenziswa iindlela ezahlukeneyo zokubopha ngokuxhomekeke kwisakhiwo sokupakisha, iimfuno zokusebenza kombane, kunye neethagethi zeendleko zemveliso. Ukuqonda umahluko phakathi kwezi nkqubo kubalulekile xa ukhetha izixhobo ezifanelekileyo zomgca wemveliso.

Udidi	I-Wire Bonder	I-Bonder	I-Flip Chip Bonder
Umsebenzi ongundoqo	Iqhagamshela ii-chip pads kwi-substrate isebenzisa ucingo oluqinileyo lokubopha	Iindawo kunye nezincamathiselo ziyafa kwisakhelo sesiseko okanye kwisakhelo selothe	Incamathisela ngokuthe ngqo itshiphu ejijekileyo isebenzisa amaqhuma e-solder okanye iintsika zobhedu
Indlela yoQhagamshelo	Ukudityaniswa kocingo (Au / Cu / Al wire)	I-Adhesive okanye i-epoxy die attach	Uqhagamshelo oluthe ngqo olusekelwe kwiBump
Ubunzima beNkqubo	Inkqubo yokuqola ephakathi, ephucuke kakhulu	Iphantsi ukuya kwephakathi kuxhomekeke kwinqanaba lokuzenzekelayo	Iphezulu, ifuna ulungelelwaniso oluchanekileyo kunye nolawulo lwenkqubo oluphambili
Imfuneko Yokuchaneka	Ukuchaneka kokubopha kwinqanaba le-Micron	Ukuchaneka kokubekwa okuphakathi	Ukuchaneka okuphezulu kakhulu kokunxibelelana kwepitch encinci
Usetyenziso oluqhelekileyo	Ukupakishwa kwe-IC, i-LED, izixhobo ze-elektroniki zeemoto	Ukubekwa kwetshiphusi kwindibano yemodyuli	Ikhompyutha esebenza kakuhle, upakisho oluphambili, udibaniso lwe-2.5D/3D
Ukukhula kobuChwepheshe	Ivuthiwe kakhulu kwaye isetyenziswa kakhulu	Ivuthiwe kwaye iyabiza kancinci	Iphucukile kwaye itshintsha ngokukhawuleza
Inqanaba leendleko	Phakathi	Ephantsi ukuya kwephakathi	Phezulu

Ingcaciso ephambili:
Ukubopha ngentambo kuseyeyona ndlela yokudibanisa esetyenziswa kakhulu kwimveliso ye-semiconductor ngenxa yokulinganisela kwayo iindleko, ukuthembeka, kunye nokuvuthwa kwenkqubo. Nangona kunjalo, ubuchwepheshe be-flip chip kunye ne-die bonding busetyenziswa ngakumbi kwiindawo eziphambili zokupakisha apho uxinano lokusebenza lubaluleke kakhulu.

Kwiindawo ezininzi zemveliso, ezi teknoloji azifani kodwa zihlala kunye kumanqanaba ahlukeneyo okupakisha kunye neendidi zeemveliso.

Kwi-semiconductor packaging ephucukileyo, ayizizo zonke iinkqubo ze-wire bonding ezibonelela ngenqanaba elifanayo lokuchaneka, isantya, kunye nokuzinza kwenkqubo. I-ASM AERO imele iqonga lesizukulwana esilandelayo elenzelwe usetyenziso lwe-high-density kunye ne-advanced packaging, ngelixa ii-wire bondings eziqhelekileyo zihlala zisetyenziselwa i-IC assembly.

Uphawu	I-ASM AERO Wire Bonder	I-Standard Wire Bonder
Isicelo Esijoliswe Kuso	Ukupakisha okuphucukileyo (2.5D / 3D IC, HPC, iitships ze-automotive-grade)	Izixhobo ze-IC eziqhelekileyo zokupakisha kunye nezixhobo ze-semiconductor ezisemgangathweni
Inqanaba lokuchaneka	Ukuchaneka okuphezulu kakhulu kunye nokulungiswa kokulungelelaniswa okuphambili	Ukuchaneka kwenqanaba le-micron eliqhelekileyo
Inkqubo yoLawulo lweNtshukumo	Inkqubo yokunyakaza ehambelanayo ephucukileyo ene-axis ezininzi	Uyilo oluqhelekileyo lolawulo lokuhamba
Inkqubo yoMbono	Ulungelelwaniso lombono oluhambelanayo olunesisombululo esiphezulu ngexesha langempela	Inkqubo yokulungelelanisa umbono eqhelekileyo
Uzinzo lweNkqubo	Yenzelwe ukuba i-pitch ibe ncinci kakhulu kwaye ibe yinkimbinkimbi	Izinzile kwiinkqubo zokupakisha zesiqhelo
Ubuchule bokuPhuma	Isantya esiphezulu senzelwe imigca yemveliso ephucukileyo	Iphakathi ukuya phezulu kuxhomekeke kwindlela ebekwe ngayo
Ukusetyenziswa Okuqhelekileyo	Iifab ze-semiconductor eziphambili kunye nee-OSAT	Izixhobo zokupakisha ze-semiconductor eziqhelekileyo

Ingcaciso ephambili:
Iinkqubo ze-ASM AERO zenzelwe ngokukodwa ukupakisha i-semiconductor yesizukulwana esilandelayo apho uxinano oluchanekileyo, ukuthembeka kwesignali, kunye nokuzinza kwenkqubo kubaluleke kakhulu. Iibhondi zentambo eziqhelekileyo zihlala zisetyenziswa kakhulu kwiindawo zemveliso ezingabizi kakhulu nezinomthamo ophezulu.

Kwiindawo zemveliso ye-semiconductor yexesha elide, oomatshini be-wire bonder basebenza phantsi komjikelo we-mechanical okhawulezayo, ophindaphindayo. Ekuhambeni kwexesha, ezinye izinto ziwohloka ngokwendalo kwaye zinokuchaphazela uzinzo lwe-bonding, izinga lemveliso, kunye nokuhambelana kwenkqubo.

Imiba eqhelekileyo ebonwayo kwiindawo zemveliso ibandakanya:

- Ukuguguleka kwentloko yebhondi okukhokelela ekungazinzileni kwamandla okubopha okanye ukwakheka kweluphu engahambelaniyo - Ungcoliseko lwe-capillary olubangelwa kukwakheka kwentsalela okanye imijikelo yokucoca engafanelekanga - Ukungahambi kakuhle kwenkqubo yokubona okubangela ukubekwa kwephedi ngendlela engachanekanga ngexesha lokubopha - Ukungahlali kakuhle kwe-wire feed okubangelwa kukutshintsha kokungqubana okanye ukungalingani koxinzelelo lwe-spool - Ukushukuma kobushushu okuchaphazela ukuhambelana kwamandla okubopha kwimveliso eqhubekayo

Ezi ngxaki azibonakali ngequbuliso, kodwa ngokuthe ngcembe zichaphazela uzinzo lwenkqubo, nto leyo ekhokelela ekutshintsheni kwemveliso okuncinci ngaphambi kokuba kwenzeke ukusilela okubonakalayo.

Ukugcinwa rhoqo kokuthintela kudla ngokufuneka kwezi ndawo zilandelayo:
- Ukuhlolwa kokulinganiswa kwentloko yebhondi kunye nokuguguleka kwayo - Ucwangciso lokutshintshwa kwe-capillary ngokusekelwe kubalo lwemijikelo - Ukuqinisekiswa kokulungelelaniswa kwenkqubo yombono - Ukucocwa kwendlela yokuphakelwa kwentambo kunye nokulungiswa koxinzelelo - Ukubeka iliso kuzinzo lobushushu kwindawo yokuphakelwa kwebhondi

Kwimveliso ye-semiconductor enomthamo omkhulu, ukugcina umgangatho wokubopha ozinzileyo kudla ngokuxhomekeka kakhulu kwisicwangciso sokukhusela ukugcinwa kunokuba kuxhomekeke ekusebenzeni komatshini kuphela.

Ukukhetha i-wire bonder akusiyo nje inkqubo yokuthelekisa iinkcukacha, kodwa kukwayisigqibo esisekelwe kuzinzo lwemveliso, ukuhambelana kwesixhobo, kunye nolawulo lweendleko zokwenziwa kwexesha elide.

Kwisicwangciso sokwenyani semveliso ye-semiconductor, ezi zinto zilandelayo zihlala zivavanywa:

1. Isantya sokubopha kunye nemfuneko yokukhupha
Imigca yemveliso enemveliso ye-IC ephezulu ifuna amandla okubambelela azinzileyo ngesantya esiphezulu ngaphandle kokunciphisa ukuchaneka kwendawo okanye ukuhambelana kweluphu.

2. Ukuhambelana kwezinto zentambo
Iindlela ezahlukeneyo zokusetyenziswa zifuna ucingo lwegolide (Au), ubhedu (Cu), okanye i-aluminium (Al). Ukukhethwa kwezinto kuchaphazela ngokuthe ngqo ubushushu bokubopha, ulawulo lwamandla, kunye nokuthembeka kwexesha elide.

3. Ukuchaneka kunye nokuzinza kwefestile yenkqubo
Ukupakisha okuphucukileyo kufuna ukuchaneka kokulungelelaniswa kwenqanaba le-micron. Ifestile yenkqubo ezinzileyo idla ngokuba yeyona ibalulekileyo kuneenkcukacha zomatshini ophakamileyo.

4. Inqanaba lokuzenzekelayo kunye nendawo yemveliso
Iinkqubo ezizenzekelayo ngokupheleleyo zikhethwa kwiindawo zemveliso yobuninzi, ngelixa iinkqubo ezizenzekelayo zihlala zisetyenziswa kwi-R&D okanye kwimveliso yomthamo ophantsi.

5. Imeko yesicelo kunye nohlobo lwesixhobo
Iimfuneko zahluka kakhulu phakathi kokupakisha okuqhelekileyo kwe-IC, izixhobo zamandla eemoto, kunye nezakhiwo eziphambili zokupakisha ezifana nokuhlanganiswa kwe-2.5D/3D.

6. Ingqwalasela yeendleko zomjikelo wobomi
Ngaphandle kotyalo-mali lokuqala loomatshini, iindleko zokulungisa, ukufumaneka kwezixhobo ezisetyenziswayo, kunye nomngcipheko wexesha lokungasebenzi kufuneka kuqwalaselwe nakwixabiso elipheleleyo lobunini (i-TCO).

Enyanisweni, abavelisi abaninzi bakhetha izixhobo kungekuphela nje ngokweenkcukacha, kodwa ngokusekelwe kuzinzo lwemveliso lwexesha elide kunye nokukwazi ukuxhasa inkonzo.