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SUNBIRD: ASMPT's latest new equipment provides a total solution for sorting, six-sided inspection, independent device testing, and laser marking. The equipment is equipped with ASMPT's self-developed iTechnology technology, providing users with a smart production equipment that is not only high-speed, but also highly stable, high-yield, and highly reliable. Applications include wafer-level package/die inspection, which can include six-sided micro-crack inspection and sorting based on wafer map data generated by upstream processes
SUNBIRD
Fully automated turret wafer-level test system
Dimensions W x D x H
1,393 x 1,580 x 2,330 mm
Features
High-speed device handling: up to 40,000 devices per hour (device size: 1 x 1 mm²)
Non-contact device corrector – ensures that devices are not damaged by contact
Smart technologies (iTechnologies) provide easy machine adjustment and optimal device protection (option)
6-sided vision inspection
Sorting of devices using wafer map
Automatic refilling of tape and reel
Quick and simple setup process for handling new devices (iLearn)
Wafer rebuild (option)
