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Siemens SMT machine SX1 is the world's leading placement platform for high-mix electronic production. Here is a detailed introduction:
Machine features
Strong scalability: SX1 is the world's only placement solution that realizes comprehensive cantilever modularization. With the unique interchangeable cantilever, the production capacity can be expanded or reduced as needed, that is, SIPLACE on-demand expansion. Customers can easily add or reduce a set of cantilevers and placement heads within 30 minutes, increase or adjust the production line capacity without changing the production line layout, flexibly respond to production changes, and protect customer investment.
High flexibility: Equipped with a variety of placement heads, such as SIPLACE SpeedStar, SIPLACE MultiStar and SIPLACE TwinStar, suitable for the placement of components of different types and sizes. It can handle components of various sizes such as 0201 (metric)-6x6mm, 01005-50x50mm, 0201-200x125mm, etc., which can meet the high-speed placement requirements as small as 0201, and can also handle the placement of large-sized special-shaped components.
Rich in intelligent functions: It has a series of intelligent functions, such as automatic identification of nozzle ID and reliable selection of the correct nozzle from any nozzle changer with up to 320 nozzle positions; regular analysis of nozzle condition, automatic cleaning and discarding of damaged nozzles; automatic determination of the correct step setting for 8mm tape after each new loading, new production task, feeder change or material splicing, etc. It also provides wizards for handling inadequately described components, new reference points or placement height questions, and can enter and/or verify information directly on the machine or remotely to speed up production startup.
พารามิเตอร์ทางเทคนิค
Placement speed: IPC speed is 29,500cph, SIPLACE benchmark evaluation speed is 37,000cph, theoretical speed is 43,450cph.
Placement accuracy: ±41μm/3σ (SpeedStar placement head), angle accuracy is ±0.5°/3σ.
Component range: 0201 (metric)-6x6mm.
PCB size: 50x50mm - max. 850x560mm.
PCB thickness: 0.3 - 6.5mm.
PCB weight: max. 3kg.
Feeder capacity: 120 8mm X feeders.
Machine dimensions: 1.5x2.4m.
Placement head features
SpeedStar (CP20P2): For high speed and placement of components as small as 0201 (metric) with maximum precision.
MultiStar (CPP): The only placement head in the world that can switch on demand between collect placement, pick and place, mixed mode.
TwinStar (TH): Placement head for special tasks with placement accuracy up to 22μm @3 (with TwinStar).
Other advantages
Reliable component identification: Digital SIPLACE imaging systems can quickly and reliably identify components of all shapes and colors. With the help of SIPLACE database information, the system can complete the description of new components in just a few seconds through offline teaching or directly on the production line. The stored image library helps to analyze scrap and other component-related issues.
With 3D detection capabilities: By combining two pictures from a high-precision component camera to generate a 3D image, it can reliably detect damaged THT pin tops and perform targeted on-board inspections of critical areas, such as determining the location of pads, whether there are missing components under the shielding frame, and whether the positioning is correct.
Precise placement pressure control: With non-contact placement and total placement pressure control from 0.5N to 100N, it can realize the placement of different types of components from sensitive LEDs to sturdy connectors.
Flexible transmission track: It provides single-track transmission and flexible dual-track transmission modes. The transmission types include asynchronous, synchronous, and independent placement modes. Small circuit boards with a size of 450mmx265mm can be moved using efficient dual-track transmission. By using the AMS Smart Transport Module, large circuit boards with a size of 1,525mmx560mm can also be processed.
In short, the Siemens SMT machine SX1 performs well in small-batch and multi-variety SMT production. It is widely used in many fields such as automobiles, automation, medical, telecommunications, and IT infrastructure. It can meet the needs of different industries for quality, process reliability, and speed.
