Umatshini we-ASM siemens umatshini we-twin head component camera 03016339

Ikhamera yecandelo le-33 ye-IC yentloko yekhamera (03016339) yomshini wokubeka i-ASM yinto ephambili ebonakalayo eyenzelwe icandelo eliphezulu le-IC (njenge-QFP, BGA, CSP, njl.) Ukubekwa. Ifanelekile kwi-IC ezinikeleyo yokubeka intloko ye-ASM SIPLACE umatshini wokubeka uchungechunge. Oku kulandelayo luhlalutyo olubanzi lweenkcukacha, imisebenzi, iimpawu, izicelo, ukulungisa iingxaki, ukugcinwa kunye nokulungisa iingcamango.

1. Iinkcukacha

Inqaku leeparamitha ezineenkcukacha

Imodeli 03016339 (No. 33 IC intloko yekhamera)

Izixhobo ezisebenzayo ASM SIPLACE series (ezifana X4, TX, D series)

Uhlobo lwekhamera Ukulungiswa okuphezulu kwekhamera yedijithali yoshishino (CCD/CMOS)

Isisombululo 2MP~5MP (inkxaso 0.3mm yepitch ecolekileyo yokubhaqwa kwe-IC pin)

Ireyithi yesakhelo 30 ~ 60fps (ukudubula kwesantya esiphezulu, kukulungele ukubekwa okuchanekileyo)

Umthombo wokukhanya Umthombo wokukhanya we-LED weringi yemibala emininzi (obomvu / oluhlaza okwesibhakabhaka / omhlophe, ulawulo olunocwangciso)

Unxibelelwano lonxibelelwano lweGigE Vision / Ikhonkco leKhamera

Umgangatho wokhuseleko IP50 (uthuli, ulungele indawo yokusebenzela ye-SMT)

Indlela yokufakela Igxininise kwintloko yokubeka i-IC, isetyenziswe ngeNombolo ye-33 yomlomo

2. Imisebenzi kunye neziphumo

(1) Umsebenzi ongundoqo

Ukuchongwa okuchanekileyo okuphezulu kwamacandelo e-IC

Ukufunyanwa kwendawo ye-IC (X/Y), i-engile yokujikeleza (θ), i-pin coplanarity, kunye ne-polarity mark.

Inkxaso ye-0.3mm ye-pitch emihle ye-QFP kunye ne-BGA yokubona ibhola ye-solder.

Ukunyusa isilungiso

Ukusebenzisa intloko ye-IC ukufezekisa i-± 15μm yokuphakama okuphezulu okuphezulu (okufana ne-CPU yefowuni ephathwayo, i-memory chip).

Buyekeza ngokuzenzekelayo ngokuchola umbhobho ukuze uqinisekise ulungelelwaniso olugqibeleleyo phakathi kweebhola ze-solder ze-BGA kunye neepads zePCB.

Ukufunyanwa kwesiphene

Chonga i-IC pin deformation, iibhola ezingekhoyo, i-polarity ebuyela umva, umonakalo wephakheji kunye nezinye iimeko ezingathandekiyo.

(2) Iimeko zesicelo

Indibano yePCB yoxinaniso oluphezulu (ezinje ngeebhodi ze-smartphone, iiseva, kunye nee-ECU zeemoto).

Ukunyuswa kwe-IC echanekileyo (i-BGA, i-QFN, i-CSP, i-POP yokupakisha).

3. Iimpawu eziphambili

INkcazelo yeNdawo

I-Ultra-high resolution ye-5MP sensor, ixhasa uhlalutyo lwepixel esezantsi, iqinisekisa ukubonwa kwepitshi yepitshi eyi-0.3mm

Ukukhanya kwe-multi-spectral Ukukhanya okubomvu / okuluhlaza okwesibhakabhaka / okumhlophe okuguquguqukayo, kuphucula ukungafani kwe-ICs yezinto ezahlukeneyo (ezifana neeplastiki zeplastiki kunye nezikhonkwane zetsimbi)

Ugxininiso olukhawulezayo lwe-autofocus Luhlengahlengisa ngokutshintsha ubude bojoliso ukuze bulungelelanise nee-ICs zobunzima obahlukeneyo (ezinje ngeCSP ebhityileyo kunye neQFP eshinyeneyo)

Uyilo lokuchasana nokuphazamiseka kwe-Electromagnetic shielding (EMI), anti-vibration, iqhelanisa nesantya esiphezulu sendawo yokunyuka

Ukugcinwa kwemodyuli ILens kunye nomthombo wokukhanya unokutshintshwa ngokwahlukeneyo ukunciphisa iindleko zokulondoloza

4. Iimpazamo eziqhelekileyo kunye neendlela zokuphatha

Impazamo enokwenzeka Unobangela Isisombululo

Ukusilela kokuqondwa kwe-IC Umthombo wokukhanya ongaqhelekanga/ungcoliseko lwelensi/ukulinganisa ukulinganisa 1. Jonga ukukhanya kwe-LED

2. Coca i-lens

3. Hlaziya kwakhona

Umfanekiso omfiliba (izikhonkwane azicacanga) Gxininisa kwi-offset/ungcoliseko lwelensi 1. Hlaziya ugxininiso

2. Coca ngelaphu elingenathuli

Uphazamiseko loNxibelelwano (akukho mfanekiso) Ukukhulula intambo / i-interface oxidation 1. Phinda uqhagamshele intambo yeGigE

2. Faka endaweni yentambo eyonakeleyo

Imposiso enkulu ekubhaqweni kwebhola ye-solder ye-BGA Umthombo wokukhanya ongalinganiyo/iparamitha ezingalunganga ze-algorithm 1. Lungisa i-engile yomthombo wokukhanya

2. Hlaziya isoftware ebonakalayo

Ikhamera iyazicima ngokuzenzekelayo ngenxa yokushisa okugqithisileyo Ukutshatyalaliswa kobushushu / umsebenzi oqhubekayo wokulayisha ngaphezulu 1. Jonga i-fan yokupholisa

2. Qala kwakhona emva kokunqumamisa ukupholisa

5. Iindlela zogcino

(1) Ukugcinwa kwemihla ngemihla

Mihla le: Sula ngobunono i-lens kunye nefestile yomthombo wokukhanya ngelaphu elingenathuli + isopropyl alcohol.

Rhoqo ngeveki: Jonga uqhagamshelo lwentambo ukuqinisekisa ukuba akukho kukhululeka okanye ukunxiba.

(2) Ukulungelelaniswa rhoqo

Ngenyanga:

Sebenzisa ipleyiti yokulinganisa esemgangathweni (efana ne-ASM 03016000) ukulinganisa i-optical calibration.

Jonga ukufana komthombo wokukhanya ukunqanda ukuqaqamba okugqithisileyo/ubumnyama bendawo.

Ngekota: Gcina iiparamitha zekhamera ukuthintela ukulahleka kwedatha.

(3) Ukugcinwa okunzulu

Qho ngonyaka: Qhagamshelana negosa le-ASM okanye ababoneleli ngeenkonzo abagunyazisiweyo ukuba:

Ukuhlolwa kwenkqubo ye-Optical (i-lens, inzwa).

Ukucoca inkqubo yokupholisa (i-fan, i-vents).

6. Ukulungisa iingcamango

(1) Ukusombulula ingxaki

Qwalasela isalathisi sokukhanya (ukukhanya okuluhlaza xa kuqhelekile, ukukhanya okubomvu/okudanyazayo xa kungalunganga).

Jonga i-ASM SIPLACE impazamo yelogi yenkqubo (efana ne "Vision Error 3301").

(2) Ukulungiswa kwezixhobo

Ukutshintshwa kwamalungu:

ILens yonakale kakhulu → Buyisela indawo ye-lens ye-optical lens assembly (ASM P/N: 03016340).

Umthombo wokukhanya kwe-LED wonakalisiwe → Buyisela imodyuli yokukhanya kweringi (ASM P/N: 03016341).

Uphuculo lweFirmware:

Hlaziya umqhubi wekhamera kunye ne-algorithm yombono ngokusebenzisa i-ASM Service Hub.

(3) Inkxaso yobungcali

Ukuba isiphoso asikwazi ukusonjululwa, qhagamshelana nenkxaso yezobuchwepheshe ye-ASM okanye iziko lokulungisa eligunyazisiweyo ukuze ugweme umonakalo kwintloko ye-IC ngenxa yokungasebenzi kakuhle.