en
id
sk
srp
swe
it
pt
ben
may
bel
nl
fra
th
vie
ru
jp
kor
de
arm
aze
bos
bul
bur
cs
dan
div
el
est
fil
fin
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
kan
kin
lao
lav
lit
ltz
lug
mao
mlt
nep
nor
nya
ori
orm
per
pl
rom
san
som
spa
swa
tam
tr
ukr
urd
wel
xhoYibhondi ezenzekelayo ezenzekelayo eyenzelwe isekethe edibeneyo kunye nezicelo zecandelo elicacileyo. Idibanisa iingenelo ze-ultra-fast and high-precision, kwaye ixhotyiswe ngenkqubo yokulawula i-glue, ilungele ukusetyenzwa kwe-12-intshi ye-wafer die bonding.
Iimpawu eziphambili
Umthamo wemveliso ephezulu : I-AD8312 series die bonder ibeka umgangatho omtsha womthamo ophezulu wemveliso, kunye nemveliso yeyure ukuya kuma-17,000 amaqhekeza.
Ukuchaneka okuphezulu : I-XY yokuchaneka kwendawo ye-solder yi-±20 μm @ 3σ kwimodi eqhelekileyo kunye ne-±12.5 μm @ 3σ kwimodi echanekileyo.
Uyilo lwetafile ye-workpiece yendalo yonke : Ilungele ukusetyenzwa kwezakhelo ezikhokelayo ezinoxinano oluphezulu, ezinobume obuhlukeneyo ukuhlangabezana neemfuno zeemarike ezahlukeneyo.
Inkqubo yokuqaphela umfanekiso : Ixhotyiswe nge-iFlash yenkqubo yokuqaphela umfanekiso, iphucula ukuchaneka kwe-die bonding 1.
Iindawo zesicelo
I-AD8312 Plus ilungele usetyenziso kwiisekethe ezidibeneyo kunye nezinto ezidityanisiweyo, ngakumbi ukusetyenzwa koxinzelelo oluphezulu lwezakhelo kunye neemfuno ezahlukeneyo zokupakisha.
