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xhYibhondi ezenzekelayo ezenzekelayo eyenzelwe isekethe edibeneyo kunye nezicelo zecandelo elicacileyo. Idibanisa iingenelo ze-ultra-fast and high-precision, kwaye ixhotyiswe ngenkqubo yokulawula i-glue, ilungele ukusetyenzwa kwe-12-intshi ye-wafer die bonding.
Iimpawu eziphambili
Umthamo wemveliso ephezulu : I-AD8312 series die bonder ibeka umgangatho omtsha womthamo ophezulu wemveliso, kunye nemveliso yeyure ukuya kuma-17,000 amaqhekeza.
Ukuchaneka okuphezulu : I-XY yokuchaneka kwendawo ye-solder yi-±20 μm @ 3σ kwimodi eqhelekileyo kunye ne-±12.5 μm @ 3σ kwimodi echanekileyo.
Uyilo lwetafile ye-workpiece yendalo yonke : Ilungele ukusetyenzwa kwezakhelo ezikhokelayo ezinoxinano oluphezulu, ezinobume obuhlukeneyo ukuhlangabezana neemfuno zeemarike ezahlukeneyo.
Inkqubo yokuqaphela umfanekiso : Ixhotyiswe nge-iFlash yenkqubo yokuqaphela umfanekiso, iphucula ukuchaneka kwe-die bonding 1.
Iindawo zesicelo
I-AD8312 Plus ilungele usetyenziso kwiisekethe ezidibeneyo kunye nezinto ezidityanisiweyo, ngakumbi ukusetyenzwa koxinzelelo oluphezulu lwezakhelo kunye neemfuno ezahlukeneyo zokupakisha.
