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xhI-SC-810 ngumatshini wokucoca we-semiconductor odibeneyo ozenzekelayo we-intanethi, osetyenziselwa ukucocwa ngokuchanekileyo kwi-intanethi ye-residual flux kunye ne-organic and inorganic pollutants emva kwe-welding yezixhobo ze-semiconductor ezifana nesakhelo seNkokheli, i-IGBTIMP, imodyuli ye-I, njl. kwizinga elikhulu lokucocwa kwe-chips, kuthathelwa ingqalelo zombini ukucoca kunye nesiphumo sokucoca. Iimpawu zeMveliso
1. Isistim echanekileyo yokucoca i-intanethi yeetshiphusi zeepakethe ze-semiconductor ezinkulu.
2. Ukutshiza indlela yokucoca, ukususwa ngokufanelekileyo kwe-flux kunye ne-organic and inorganic pollutants.
3. Ukucoca iikhemikhali + ukuhlanjululwa kwamanzi e-DI + inkqubo yokomisa umoya oshushu igqityiwe ngokulandelelana.
4. Ukucoca ulwelo longezwa ngokuzenzekelayo; Amanzi e-DI ayongezwa ngokuzenzekelayo.
5. Uxinzelelo lwenaliti yokucoca ulwelo lunokulungelelaniswa ukuze luhambelane neemfuno ezahlukeneyo zokucoca.
6. Ngokuhamba okukhulu kunye noxinzelelo oluphezulu, i-liquid yokucoca kunye namanzi e-DI inokungena ngokupheleleyo kwi-micro gap yesixhobo kwaye ihlambuluke ngokucokisekileyo.
7. Ixhotyiswe ngenkqubo yokubeka iliso ephuculweyo yokukhangela umgangatho wamanzi okuhlamba amanzi e-DI.
8. Imela yomoya yokusika + inkqubo yokomisa yomoya oshushu ixesha elide,
9. Inkqubo yokulawula i-PLC, i-interface yokusebenza yaseTshayina / yesiNgesi, kulula ukuyibeka, ukutshintsha, ukugcina nokubiza inkqubo
10. Umzimba we-SUS304 wensimbi engenasici, imibhobho kunye namalungu, ukumelana nobushushu, i-acidic, i-alkaline kunye nolunye ulwelo lokucoca.
11. Inokudibaniswa nezixhobo zangaphambili nangemva ukwenza umgca wokucoca ngokuzenzekelayo.
12. Ulungelelwaniso olwahlukeneyo olunokuzikhethela olunjengokucoca ukujongwa koxinaniso lolwelo
