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xhSC-810 is an integrated fully automatic semiconductor package chip online cleaning machine, which is used for online precision cleaning of residual flux and organic and inorganic pollutants after welding of semiconductor devices such as Lead frame, IGBTIMP, I module, etc. It is suitable for large-scale ultra-precision centralized cleaning of chips, taking into account both cleaning efficiency and cleaning effect. Product Features
1. Precision online cleaning system for large-scale semiconductor package chips.
2. Spray cleaning method, efficient removal of flux and organic and inorganic pollutants.
3. Chemical cleaning + DI water rinsing + hot air drying process is completed in sequence.
4. Cleaning liquid is automatically added; DI water is automatically added.
5. The cleaning liquid injection pressure can be adjusted to correspond to different cleaning requirements.
6. With large flow and high pressure, the cleaning liquid and DI water can fully penetrate into the micro gap of the device and clean thoroughly.
7. Equipped with rinsing positive rate monitoring system to detect the water quality of rinsing DI water.
8. Wind knife wind cutting + ultra-long hot air circulation drying system,
9. PLC control system, Chinese/English operation interface, easy to set, change, store and call the program
10. SUS304 stainless steel body, pipes and parts, heat-resistant, acidic, alkaline and other cleaning liquids.
11. Can be connected with front and rear equipment to form an automatic cleaning line.
12. Various optional configurations such as cleaning liquid concentration monitoring
