aeroPULSE FS50 UV Laser Disc

I-DISCO Corporation yinkokeli yehlabathi kumatshini ochanekileyo. I-aeroPULSE FS50 yayo yi-ultraviolet (UV) nanosecond pulse laser eyenzelwe ukuchaneka okuphezulu kwe-micromachining. Isetyenziswa ngokubanzi ekusikeni ngokuchanekileyo, ukugaya kunye nonyango lwangaphezulu kwi-semiconductor, i-electronics, isixhobo sonyango kunye namanye amashishini.

1. Imisebenzi engundoqo kunye neempawu

(1) Ukuchaneka okuphezulu kwe-UV laser processing

Ubude beWavelength: 355nm (UV), kunye nendawo encinci kakhulu echaphazelekayo kubushushu (HAZ), ilungele ukusetyenzwa kwezinto ezinqabileyo.

I-pulse emfutshane (inqanaba le-nanosecond): Inciphisa umonakalo we-thermal kunye nokuphucula umgangatho we-edge.

Izinga eliphezulu lokuphindaphinda (ukuya kuthi ga kwi-500kHz): Ithathela ingqalelo zombini isantya sokusebenza kunye nokuchaneka.

(2) Ukulawula umqadi obukrelekrele

Umgangatho weBeam (M²≤1.3): Indawo encinci ekugxilwe kuyo (ukuya kuthi ga kwinqanaba le-10μm), ilungele ukusetyenzwa kwenqanaba leMicron.

Imowudi yendawo ehlengahlengiswayo: Ixhasa indawo yeGaussian okanye indawo ethe tyaba ukuze ihlangabezane neemfuno zezinto ezahlukeneyo.

(3) Ukuzinza okuphezulu kunye nobomi obude

Uyilo lwelaser yelizwe eliqinileyo, ukugcinwa-simahla, ubomi> iiyure ezingama-20,000.

Ixesha langempela lokujongwa kwamandla ukuqinisekisa ukuhambelana kokusebenza.

(4) Ukuhambelana ngokuzenzekelayo

Ixhasa i-EtherCAT kunye ne-RS232 iiprothokholi zonxibelelwano kwaye zinokudibaniswa kwimigca yokuvelisa ngokuzenzekelayo okanye iinkqubo zengalo zerobhothi.

2. IiNgcaciso eziphambili

Iiparamitha aeroPULSE FS50 Iinkcukacha

Uhlobo lweLaser UV nanosecond pulse laser (DPSS)

Ubude beWaveleng 355nm (UV)

Amandla aphakathi 10W (amandla aphezulu ngokuzikhethela)

I-pulse yamandla enye 20μJ~1mJ (iyalungiseka)

Pulse ububanzi 10ns~50ns (adjustable)

Umlinganiselo wokuphindaphinda 1kHz ~ 500kHz

Umgangatho weBeam (M²) ≤1.3

Idayamitha yendawo 10μm~100μm (iya hlengahlengiswa)

Indlela yokupholisa Ukupholisa umoya/ukupholisa amanzi (ukhetho)

Unxibelelwano lonxibelelwano lwe-EtherCAT, RS232

3. Iindawo zesicelo eziqhelekileyo

(1) Ishishini le-semiconductor

Ukusika i-wafer (izixhobo ezinqabileyo ezifana ne-silicon, i-silicon carbide, i-GaN, njl.).

Ukupakishwa kweChip (i-RDL wiring, TSV drilling).

(2) Ukwenziwa kombane

PCB micro-hole yokomba (ibhodi HDI, flexible circuit).

Ukusika kweglasi / i-ceramic (ikhava yefowuni ephathwayo, imodyuli yekhamera).

(3) Izixhobo zonyango

Ukusika i-Stent (i-stents ye-cardiovascular, iinxalenye zetsimbi ezichanekileyo).

Ukusetyenzwa kwe-Biosensor (iitshiphu ze-microfluidic).

(4) Iinkalo zophando

Ukulungiswa kweMicro-nanostructure (i-photonic crystals, izixhobo ze-MEMS).

4. Ukuthelekiswa kweenzuzo zobugcisa

Iimpawu ze-aeroPULSE FS50 I-laser ye-UV eqhelekileyo

Ulawulo lwe-Pulse Inqanaba le-Nanosecond, ububanzi be-pulse obuhlengahlengiswayo Ububanzi be-pulse esisigxina

Indawo echaphazeleke bubushushu Incinci kakhulu (HAZ<5μm) Enkulu (HAZ>10μm)

Ukudibanisa okuzenzekelayo Inkxaso ye-EtherCAT Basic RS232 kuphela

Izinto ezisetyenziswayo Izixhobo ezinqabileyo (iglasi, iiseramikhi) Iintsimbi eziqhelekileyo/iplastiki

5. Amashishini asebenzayo

Ukupakishwa kweSemiconductor kunye novavanyo

Ii-elektroniki zabathengi (izixhobo ze-5G, iiphaneli zokubonisa)

Izixhobo zonyango (ukufakelwa, izixhobo zokuxilonga)

Ii-optics ezichanekileyo (izihluzi, izinto zokuphazamiseka)

6. Isishwankathelo

I-aeroPULSE FS50 DISC ixabiso elingundoqo:

I-Ultraviolet nanosecond laser - ilungele ukusetyenzwa ngokuchanekileyo kwezinto ezinqabileyo.

Umgangatho ophezulu we-beam (M²≤1.3) - ukuphumeza ukuchaneka kwe-micron-level processing.

Ulawulo olukrelekrele kunye ne-automation ehambelanayo - ukulungelelanisa kwimizila yemveliso ye-Industry 4.0.

Ubomi obude kunye nokugcinwa-simahla - ukunciphisa iindleko zokusetyenziswa ngokubanzi.

Esi sixhobo silungele iimeko ezineemfuno ezingqongqo ekuqhubeni ukuchaneka kunye nomgangatho womphetho