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Get Quote →The K&S ICONN PLUS is a fully automatic thermo-sonic ball bonding machine used in semiconductor packaging processes for wire interconnection on integrated circuits. It is designed for fine-pitch bonding applications and supports high-density IC leadframes used in advanced microelectronic assembly.
The machine is commonly applied in semiconductor manufacturing environments where precise wire bonding is required for IC devices, power semiconductors, sensors, and other microelectronic components. It supports both gold and copper wire bonding depending on process configuration and tooling setup.
K&S ICONN PLUS belongs to the K&S wire bonder platform developed for automated wire bonding processes in high-volume production environments.
Model: Kulicke & Soffa ICONN PLUS | Status: Operational / Ready for Custom Tooling
The K&S ICONN PLUS wire bonding machine stands as an industry benchmark for high-speed microelectronic wire interconnects. Engineered by Kulicke & Soffa, this platform delivers precise XY placement accuracy and extreme looping consistency, making it a staple across global OSAT facilities for complex integrated circuit (IC) and optoelectronic production expansion.
Procuring a certified refurbished K&S ICONN PLUS wire bonder enables assembly lines to rapidly scale capacity, handle delicate low-cost copper (Cu) or silver (Ag) wire alloy specifications, and bypass long manufacturer lead times while securing an optimized return on investment (ROI).
Sourcing back-end semiconductor equipment requires clear mechanical accountability. We mitigate supply chain friction by performing multi-stage electrical, pneumatic, and positioning checks on all K&S bonding modules, ensuring hassle-free cleanroom integration upon arrival.
Built upon Kulicke & Soffa's dominant structural pedigree, the ICONN PLUS wire bonder delivers the mechanical stiffness and transducer control needed for ultra-fine-pitch leadframe matrices.
Eliminate human operational limits. Advanced on-board vision positioning software updates alignment references in real-time, boosting units-per-hour (UPH) indexes and line capabilities.
Avoid high factory lead times and expensive pricing options. Sourcing certified refurbished hardware allows packaging companies to immediately capture new manufacturing project bids.
Maintains full software, data logging, and parts cross-compatibility across existing packaging grids. Operators execute changeovers seamlessly without production latency gaps.
Due to its high axis feedback resolution and programmable force profiling, the ICONN PLUS adapts efficiently across varied complex encapsulation matrices. We assist buyers in verifying custom clamp layouts, indexer types, and heat-block sizing parameters prior to export logistics execution.
We specialized in backend semiconductor machinery validation and international compliance logistics. For every K&S ICONN PLUS inquiry, our focus centers on providing complete physical status transparency and equipment configuration alignment.
To expedite validation and matching operations, please specify your target alloy types and production package geometries when initiating your equipment query.
Outline your target leadframe pitch, wire material specs, and capacity milestones.
Our team verifies active warehouse availability, machine vintage, and options matching.
Review comprehensive diagnostic run videos, optical matrices, and configuration lists.
Secure custom wood crating, anti-moisture vacuum wraps, and global port logistics routing.
While the standard ICONN platform established baseline thermosonic ball bonding consistency, the K&S ICONN PLUS wire bonder brings engineered enhancements to XY positioning steps and ultrasonic energy response. The integration of advanced ProX loop handling allows packaging facilities to run thinner wire diameters safely at higher speeds without sacrificing continuous production yield lines.
| Engineering Metrics | Standard K&S ICONN | Upgraded K&S ICONN PLUS |
|---|---|---|
| Process Envelope | Standard IC packaging arrays | Advanced fine-pitch & high-density leadframes |
| Positioning Drive Resolution | Baseline servo feedback tracking | Sub-micron voice coil precision mapping |
| Wire Alloy Profiling | Optimized primarily for Gold (Au) wire | Advanced native Copper (Cu) & Silver (Ag) configurations |
| Looping Software Matrix | Standard looping configuration packages | ProX high-density multi-bend loop profiling architecture |
Because physical options packages alter actual installation dimensions and air supply metrics, ensure configuration matching parameters are aligned prior to formal crating dispatch.
Contact our technical team with your package specs and target location to get stock availability reports and clear pricing lists.
The ProX system provides advanced software-controlled wire trajectories. This allows packaging engineers to design ultra-low loop shapes and multi-bend wires with high mechanical stability, preventing wire sagging or shorts in fine-pitch multi-die IC packages.
The K&S ICONN PLUS wire bonder configuration includes a specialized gas delivery system that forms a protective shielding zone (using forming gas) around the capillary. This prevents ambient oxygen from causing copper ball oxidation during the electronic flame-off (EFO) process.
While the mechanical chassis and core structural layout share similar dimensions, many internal electronics components, camera matrix attachments, and mainboard driver modules are specific to the ICONN PLUS platform. Please check compatibility lists with our technical staff.
The tool requires stable electrical power and high-purity Clean Dry Air (CDA) lines with constant pneumatic pressure control. Variations below manufacturer specifications can induce errors within the bond-head vacuum sensor lines, causing pick-up faults or placement retries.
Submit your manufacturing specifications below. Our semiconductor equipment sourcing team will cross-reference live warehouse availability, configuration matching, and logistic pricing limits to reply within 12 business hours.
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