EN
id
sk
sr
sv
it
pt
bn
ms
be
nl
fr
th
vi
ru
ja
ko
de
hy
az
bs
bg
my
cs
da
dv
el
et
fil
fi
ga
gl
gn
he
hi
km
hr
hu
is
kn
rw
lo
lv
lt
lb
lg
mi
mt
ne
no
ny
or
om
per
pl
ro
sa
so
es
sw
ta
tr
uk
ur
cy
xhSony SI-F130 is an electronic component placement machine, mainly used in the electronics manufacturing industry for efficient and precise mounting of electronic components.
Functions and Features High-precision mounting: SI-F130 is equipped with high-precision large substrates, supporting a maximum LED substrate size of 710mm×360mm, suitable for substrates of various sizes. Efficient production: The equipment can mount 25,900 components per hour under specified conditions, suitable for large-scale production needs. Versatility: Supports a variety of component sizes, including 0402-□12mm (mobile camera) and □6mm-□25mm (fixed camera) within 6mm in height. Intelligent experience: Although SI-F130 itself does not include AI functions, its design focuses on rapid implementation and traceability, suitable for environments that require efficient production. Technical parameters
Installation speed: 25,900 CPH (conditions specified by the company)
Target component size: 0402-□12mm (mobile camera), □6mm-□25mm (fixed camera) within 6mm in height
Target board size: 150mm×60mm-710mm×360mm
Head configuration: 1 head/12 nozzles
Power supply requirements: AC3 phase 200V±10% 50/60Hz 1.6kVA
Air consumption: 0.49MPa 0.5L/min(A.N.R)
Dimensions: W1,220mm×D1,400mm×H1,545mm (excluding signal tower)
Weight: 1,560kg
Application scenarios
Sony SI-F130 is suitable for production environments that require efficient and precise electronic component installation, especially for large-scale production and scenarios that require high-precision installation
