Rehm Thermal Systems VisionXP+

‌ ‌The REHM reflow oven VisionXP (VisionXP+) is a “super-class” reflow soldering system with a special focus on energy efficiency, reduced emissions and lower operating costs‌. The system is equipped with an EC motor, which can significantly reduce production energy consumption, and provides vacuum welding options to effectively reduce welding voids and ensure an efficient and stable production process.

Technical features

‌Vacuum welding‌: VisionXP+ is equipped with a vacuum welding option, which can directly enter the vacuum unit when the solder is in a molten state, effectively solving problems such as pores, voids and voids, without the need for complex reprocessing through an external vacuum system‌.

‌Energy-saving and efficient‌: The system uses EC motors, which reduces production energy consumption and reduces maintenance requirements‌.

‌Bottom cooling‌: The system offers multiple cooling options, including bottom cooling, which can efficiently cool heavy and complex circuit boards and ensure stable process temperatures‌.

‌Thermal decomposition system‌: VisionXP+ is equipped with a thermal decomposition system to recover and clean impurities in the process gas to ensure the cleanness and dryness of the furnace‌.

‌Intelligent software solutions‌: The system is equipped with intelligent software solutions designed for manufacturing, which can optimize zone segmentation and ensure precise and stable temperature control‌.

Application scenarios

The VisionXP+ reflow soldering system is suitable for a variety of manufacturing environments, especially where high-quality soldering processes are required. Its modular design makes the system configuration flexible and diverse, and can meet different application requirements, such as frequent line changes and shift operations. In addition, the system offers a variety of add-on options to ensure it meets diverse customer application needs‌