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xhSAKI 3D SPI 3Si LS2 is a 3D solder paste inspection system, mainly used to detect the quality of solder paste printing on printed circuit boards (PCBs).
Main features and application scenarios
SAKI 3Si LS2 has the following main features:
High precision: Supports three resolutions of 7μm, 12μm and 18μm, suitable for high-precision solder paste detection needs.
Large format support: Supports circuit board sizes up to 19.7 x 20.07 inches (500 x 510 mm), suitable for a variety of application scenarios.
Z-axis solution: The innovative Z-axis optical head control function can inspect high components, crimped components and PCBAs in the fixture, ensuring accurate detection of high components.
3D detection: Supports 2D and 3D modes, with a maximum height measurement range of up to 40 mm, suitable for complex surface mount components.
Technical specifications and performance parameters
The technical specifications and performance parameters of SAKI 3Si LS2 include:
Resolution: 7μm, 12μm and 18μm
Board size: Maximum 19.7 x 20.07 inches (500 x 510 mm)
Maximum height measurement range: 40 mm
Detection speed: 5700 square millimeters per second
Market positioning and user evaluation
SAKI 3Si LS2 is positioned in the market as a high-precision 3D solder paste inspection system for industrial applications that require high-precision detection. User evaluations show that the system performs well in detection accuracy and efficiency, and can significantly improve production efficiency and product quality.
