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xhVCTA-V850 is a solder paste thickness detector, which is mainly used to detect the thickness of solder paste and ensure the quality of patch processing.
Functions and Roles
The main functions of VCTA-V850 include:
Solder paste thickness detection: Through high-definition, high-speed cameras with high-field telecentric lenses, accurate measurement of solder paste thickness is achieved.
High frame rate shooting: GPU large-scale parallel technology is used to improve the speed of calculation and detection, and effectively deal with problems such as FPC warping.
Three-dimensional stereo image display: Phase modulation profile measurement technology (PMP) is used to obtain high-precision object shape contour and volume measurement results, and display true color three-dimensional stereo images.
Diversified functional modules: Including red glue detection, bare board learning programming, automatic board bending compensation, camera barcode recognition, offline programming and debugging and other functions.
Technical parameters
Detection resolution: 8-bit grayscale resolution, reaching a detection resolution of 0.37 microns.
Detection capability: Compared with laser measurement accuracy, the accuracy is improved by 2 orders of magnitude, which greatly improves the detection capability and application range of the equipment.
Display effect: Using the self-developed RGB three-color light source, 3D and 2D true color images are realized, and the display effect is extremely close to the real object.
Application scenario
VCTA-V850 is suitable for the field of SMT patch processing, especially in the scene that requires high-precision solder paste thickness detection. Its high definition and high precision make it have a wide range of application prospects in the electronics manufacturing industry
