SCREEN wafer cleaner SU-3200

The SCREEN SU-3200 is a landmark 300mm single-wafer cleaning system in the semiconductor manufacturing industry. With its superior throughput and leading cleanliness technology, it served as SCREEN's mainstay model for a long time, supporting the manufacturing of logic and memory chips from 32nm to 7nm and even more advanced nodes, playing a crucial role in the cleaning equipment market.

Core Positioning and Technology Overview: The core positioning of the SU-3200 is to significantly increase the throughput of single-wafer cleaning while maintaining extremely high cleanliness, meeting the extreme efficiency demands of advanced processes.

High-throughput Design: Through an innovative four-layer stacked architecture, a single system can be configured with up to 12 independent process chambers, achieving a processing capacity of up to 800 wafers per hour (WPH), which was world-leading among single-wafer cleaning systems at the time.

Ultra-Clean Process Environment: To meet the stringent requirements of 22nm and more advanced nodes, the SU-3200 is equipped with SCREEN's proprietary APAC (Advanced Process Atmosphere Control) technology. By optimizing the chamber environment across multiple dimensions, it ensures the ultimate cleanliness of the cleaning process.

Key Technical Details: To achieve the dual goals of throughput and cleanliness, the SU-3200 employs a series of innovative designs, detailed in the table below:

Technology Dimension | Technology Name | Core Function and Implementation Method

Breakthrough Capacity Improvement | Compact Chamber | Reduces the volume of a single process chamber to half that of its predecessor, making it possible to deploy more chambers within the same space, thereby increasing throughput per unit area.

High-Speed Transfer System | Optimizes the transfer logic and speed of wafers between chambers, a key support for achieving a high throughput of 800 wafers/hour (WPH).

Cleanliness Assurance | APAC Technology | Ultra-clean chamber technology is a collective term for a series of technologies. Its core sub-technologies include:

 AMC Micro-chamber: Reducing the internal volume of the chamber to one-third of its predecessor, enabling faster gas replacement and effectively improving environmental cleanliness.

ABG Airflow Balancing Baffle: Used to even out the clean airflow blown down by the top high-efficiency particulate filter (FFU), preventing eddies or dead zones within the chamber and ensuring effective removal of particulate matter.

ASP Advanced Splash Protection: Through precise design, minimizing chemical splashing during chemical spraying, ensuring a clean wafer processing environment.

APN Air Protection Nozzle: Utilizing an "air curtain" during the drying stage to protect the wafer surface and prevent water stains caused by liquid evaporation residue.

Flexible Chemical Supply: Chemical sources can be flexibly arranged. Both Dynamic Direct Injection (DDI) and cabinet-type systems are available, allowing customers to choose flexibly according to specific process requirements.

Ease of Maintenance: Pull-out structure: The process chamber can be pulled out like a drawer for easy cleaning, component replacement, and other maintenance work, effectively reducing equipment downtime. Application Areas: From Cutting-Edge R&D to Mature Manufacturing

The SU-3200 has a wide range of applications, covering multiple key stages of semiconductor manufacturing.

Advanced Logic and Memory Chips: The SU-3200 is used in the R&D and production of chips, including 7nm and more advanced nodes, in both front-end (FEOL) and back-end (BEOL) processes.

Key Semiconductor Materials and Processes: Among the many processes it supports is the cleaning of third-generation semiconductor materials such as SiC (Silicon Carbide) and GaN (Gallium Nitride).

Cutting-Edge Research and Ecosystem Collaboration: The powerful performance of the SU-3200 makes it the choice of leading R&D institutions worldwide. For example, IBM has implemented the SU-3200 at its semiconductor research center in Albany, New York. Furthermore, SCREEN has partnered with Applied Materials, installing the SU-3200 at its META Center for developing more advanced chip processes.

Market Position and Historical Contributions

The SU-3200 is not only a successful product but also a key factor in establishing SCREEN's market leadership position.

Market Dominance: Following the success of the SU-3200, SCREEN further solidified its leading position in the cleaning equipment field. According to official SCREEN data, as of July 2025, its cumulative shipments of semiconductor cleaning equipment exceeded 15,000 units, holding the number one global market share in multiple segments including single-wafer cleaning, batch cleaning, and spin cleaning.

Revenue Pillar: For a long time, the SU-3200 was SCREEN's star product, and its cleaning equipment business revenue was highly dependent on this model.