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Umatshini wokuhlola i-solder ye-PARMI i-SPI HS70 isizukulwana esitsha sezixhobo zokuhlola i-solder paste eqaliswe yi-PARMI, esetyenziswa kakhulu kwintsimi yokuhlolwa ngokuchanekileyo kwe-3D. Isixhobo sidibanisa amava atyebileyo ePARMI kunye nobuchwepheshe obuphambili kwitekhnoloji yokuhlola. Kubaluleke kakhulu ukukhankanya ukuba ixhotyiswe nge-RSC_6 Sensor, enciphisa kakhulu ixesha lokuhlola. Ikwasebenzisa i-RSC Sensors ezimbini ezine-lens zokwandisa amaxesha e-0.42 kunye namaxesha e-0.6, anokutshintshwa ngokweempawu zemveliso ukwenzela ukwandisa isantya kunye nokuchaneka.
Iinkcukacha zobugcisa kunye neempawu zokusebenza
Indlela yokuhlola: I-SPI HS70 ithatha indlela yokuhlola i-motor ehambelanayo yokuhlola ukuthintela ukungcangcazela okungeyomfuneko ngexesha lenkqubo yokuhlola, ukwenza umatshini uzinze ngakumbi ngexesha lokuhlola kunye nokwandisa ubomi be-hardware yomatshini.
Indlela yokumisa: Uyilo lwe "Down clamping" lwenza ukuba i-substrate izinze ngakumbi kwindawo yokumisa kwaye iphucule ukuchaneka kokuhlolwa.
Uyilo lwengoma: Uyilo lwe-SPI HS70D Dual Lane luxhasa i-2, i-3, kunye ne-4 yohlengahlengiso lobubanzi bomzila, kwaye ingachaza i-1, i-3 okanye i-1, i-4 ukulungiswa komkhondo, okwandisa ukuguquguquka kunye nokuzinza komatshini.
Iiparamitha zobugcisa zePARMI-SPI-HS70 zimi ngolu hlobo lulandelayo:
Ubungakanani: 430x350mm, ubukhulu 4mm, ubunzima 800kg. Isisombululo: 20x10um isantya sosombululo yi80cm²/sec, 13x7um isantya sosombululo yi-40cm²/sec. Ukukwazi ukubona: Iyakwazi ukubona i-ultra-small solder pads, njenge-100um solder pads. Indlela yokufumanisa: Isebenzisa ukukhangela kwemoto yomgca, engayi kubangela ukungcangcazela okungafunekiyo ngexesha lenkqubo, iqinisekisa ukuzinza komatshini. Ukulungelelaniswa kwesondlo: Zonke iintambo zeemoto zikwibhokisi ye-drawer ye-sliding ngaphambili, ekulungele ukugcinwa kunye nokugcinwa, kunye nemisebenzi yokulondoloza inokuqhutywa ngelixa umatshini usebenza. Uyilo lweengoma ezimbini: Ixhasa i-2, i-3, kunye ne-4 yoyilo lwengoma, kunye nobubanzi bomzila bunokulungelelaniswa, olulungele ukucwangciswa kwemveliso eyahlukeneyo. Ezi parameters zobuchwephesha zibonisa ukuba i-PARMI-SPI-HS70 yinto ephezulu yokusebenza kwe-solder yokufumanisa ukunamathisela izixhobo ezifanelekileyo kwiimfuno zokuvelisa ezichanekileyo.
