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Iinkcukacha kunye neeparamitha zeMPM Momentum BTB umshicileli we-solder paste zezi zilandelayo:
Ukuphathwa kweSubstrate:
Obona bukhulu bobungakanani besubstrate: 609.6mmx508mm (24”x20”)
Ubuncinane bobungakanani besubstrate: 50.8mmx50.8mm (2”x2”)
Ubunzima beSubstrate: 0.2mm ukuya ku-5.0mm (0.008” ukuya ku-0.20”)
Ubunzima besubstrate enkulu: 4.5kg (9.92lbs)
Umphetho wesubstrate ucoceko: 3.0mm (0.118”)
Ukukhutshwa okusezantsi: 12.7mm (0.5”) umgangatho, unokulungiselelwa ukuya kuma-25.4mm (1.0”)
I-Substrate clamping: Isibambiso esiphezulu esisisigxina, i-vacuum yetafile, i-EdgeLoc (i-edge lock) (ukhetho)
Iindlela zenkxaso ye-Substrate: I-vacuum yetafile, izikhonkwane zokukhupha imagnethi, izikhonkwane ze-vacuum ejector, iibhloko zenkxaso, izilungiso ezinikezelweyo (izixhobo ezincinci) okanye iGrid-Lok (ukhetho)
Iiparamitha zokuprinta:
Eyona ndawo yoshicilelo: 609.6 mmx508mm (24"x20")
Shicilela ukhupho: 0mm ukuya 6.35mm (0" ukuya 0.25")
Isantya sokuprinta: 0.635mm/sec ukuya ku-304.8mm/sec (0.025in/sec ukuya ku-12in/sec)
Uxinzelelo lokuprinta: 0 ukuya ku-22.7kg (0lb ukuya ku-50lbs)
Ubungakanani befreyim yestencil: 737mmx737mm (29"x29") Amanqaku amancinci amancinci akhoyo
Uhlobo lweFiducial: Iifiducials zemilo esemgangathweni (i-SMEMA iyahambelana), iipads / ukuvula
Inkqubo yekhamera: Ikhamera yedijithali enye, iMPM enelungelo elilodwa lomenzi wenkqubo yombono phezulu / ezantsi
Ulungelelwaniso oluchanekileyo kunye nokuphindaphinda: ± 12.5 microns (± 0.0005") @6σ, Cpk ≥ 2.0*
Okwenziweyo kwi-solder Cola ukuprinta indawo yokuphindaphinda: ±20 microns (±0.0008") @6σ, Cpk ≥ 2.0*
Ixesha lomjikelo: Umgangatho we-9 imizuzwana ye-BTB, imizuzwana eyi-7.5 esemgangathweni ye-Momentum HiE BTB
Imfuno yamandla: 200 ukuya kwi-240VAC (±10%) isigaba esisodwa @50/60Hz, 15A
Imfuno yomoya oxinanisiweyo: 100 psi
Ezi nkcukacha kunye neeparitha zibonisa izalathi ezineenkcukacha zobugcisa kunye neenkcukacha zokusebenza zeMPM Momentum BTB solder paste printer, efanelekileyo kwiimfuno ezahlukeneyo zokuvelisa i-elektroniki.
