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Funa Quote →ASM AD838 die bonder ye precision semiconductor backend equipment platform eyakolebwa okukola stable, high-yield die attach processes mu kukola ebyuma eby’omulembe. Kikozesebwa nnyo mu mbeera z’okufulumya nga kyetaagisa obutuufu bw’okukwatagana obutakyukakyuka n’okutebenkera kw’enkola okw’ekiseera ekiwanvu.
ASM AD838 die bonder ye kyuma ekwata ku semiconductor backend die attach machine ekozesebwa okusiba obulungi silicon dies ku substrates mu nkola z’okupakinga IC. Ekoleddwa okukola emirimu egy’obutebenkevu, egy’obutuufu obw’amaanyi mu mbeera z’okufulumya semikondokita ez’obwengula.
Nga ekika ky’ekyuma ekikulu eky’okusiba ekifa, AD838 ekola okuteeka okufa okufugibwa ng’ekozesa okukwatagana kw’amaaso, enkola ezifuga entambula, n’amaanyi g’okusiba agafugibwa. Ekozesebwa nnyo mu kukungaanya IC, okupakinga LED, n’okukola semiconductor z’amaanyi.
ASM AD838 ekola nga enkola ya precision die attach system mu kukola semiconductor backend, okukakasa okuteekebwa okutuufu n’okukwatagana okwesigika kwa micro-scale chips.
ASM AD838 die bonder ezimbiddwa ku nsengeka ya semikondokita ey’obwengula ey’emitendera mingi. Buli subsystem ekola wamu okukakasa precision die placement, stable bonding force control, n’okukola emirimu egy’amakungula amangi.
Ewa omusingi gw’enzimba y’enkola ya ASM AD838, okukakasa okutebenkera kw’okukankana n’obutuufu bw’ebyuma mu biseera by’emirimu egy’amaanyi.
High-resolution optical inspection module for die recognition, okutereeza alignment, n'okufuga obutuufu bw'ekifo nga tebannaba kusiba.
Multi-axis precision motion control evunaanyizibwa ku kukwata die, enkola y’okuteeka, n’obutuufu bw’okuteeka micro-positioning.
Core execution unit ekola emirimu gya die attach n’amaanyi agafugibwa, sipiidi, n’obutuufu bw’okuteeka.
Afuga epoxy oba solder dispensing ne micro-volume accuracy okukakasa obutakyukakyuka bonding layer obuwanvu.
Ekuuma embeera z’ebbugumu ezitebenkedde mu nkola z’okusiba n’okuwonya okukakasa okwesigika okw’ekiseera ekiwanvu.
Enzimba ya ASM AD838 egatta okutebenkera kw’ebyuma, okukwatagana kw’amaaso, n’okutuufu kw’entambula mu kimuenkola ya die bonding, okusobozesa omulimu gw’okupakinga semiconductor ogutakyukakyuka mu mbeera z’okufulumya ez’obuzito obw’amaanyi.
ASM AD838 die bonder ekola enkola ya die attach ekola mu bujjuvu eya otomatiki eyategekebwa okupakinga semikondokita mu ngeri entuufu. Buli mutendera gulongooseddwa olw’obutuufu bw’okukwatagana, okutebenkera kw’okuteekebwa, n’okwesigamizibwa kw’okukwatagana okw’ebbugumu.
Vacuum collet precisely picks individual dies okuva mu wafer oba tray n'amaanyi agafugibwa okuziyiza okwonooneka.
Enkola y’amaaso ey’obulungi obw’amaanyi ezuula okutunula kwa die era n’etereeza okukyama kw’ekifo nga tennateekebwa.
Okufugibwa epoxy oba solder dispensing okukakasa uniform bonding layer obuwanvu okusobola okunyweza okunywevu.
Omutwe gw’okusiba AD838 gukola ku sipiidi ya waggulu, sub-micron okuteeka die ku substrate n’okufuga amaanyi amatuufu.
Ebbugumu ne puleesa biteekebwa okukakasa nti ekintu ekikwata ku die kinywevu mu byuma n’amasannyalaze.
Enkola y’okuwonya esembayo enyweza ekyesiiga n’okukakasa okwesigika okw’ekiseera ekiwanvu wansi w’embeera y’okutambula kw’ebbugumu.
| Parameter | Omuwendo |
|---|---|
| Ekika ky’Ebyuma | Ekyuma Ekisiba Die |
| Omutendero | Die Attach / Epoxy / Okusonda |
| Obutuufu | Obusobozi bw’okukwatagana mu sub-micron |
| Okusaba | IC / LED / Amaanyi Semikondokita |
| Ekifo | ASM AD Omukulembeze |
Ekyuma kya ASM AD838 die bonding kikozesebwa mu makolero agakola semiconductor backend eziwera nga enkola za high precision die attach zeetaagibwa.
Ekozesebwa mu layini z’okukuŋŋaanya circuit ezigatta okusobola okuteeka die okutuufu ku substrates ezirina okutebenkera kw’amakungula amangi.
Ewagira okupakinga kwa MOSFET, IGBT, ne modulo z’amaanyi nga kyetaagisa okukwatagana okw’amaanyi okw’ebbugumu n’ebyuma.
High-volume die attach for LED chips nga zirina okwakaayakana okutambula n’okufuga omutindo gw’ebbugumu.
Ekozesebwa mu kukola ECU, ADAS, ne sensor module nga kyetaagisa okwesigika okw’amaanyi n’okutebenkera kw’obulamu obuwanvu.
Ekozesebwa mu modulo za RF front-end ne communication IC packaging nga kyetaagisa precision alignment.
Awagira enkola ez’okugatta ez’enjawulo n’okupakinga mu density enkulu mu fabs za semiconductor ez’omulembe.
Mu kupakinga kwa semiconductor backend, ASM AD838, BESI die bonders, ne K&S (Kulicke & Soffa) enkola zikozesebwa nnyo mu mbeera ez’enjawulo ez’okufulumya. Okugeraageranya wansi kulaga enjawulo mu butuufu, okussa essira ku nkola, n’okuteeka mu kifo ky’okufulumya.
Ekifo:Enkola y’okufulumya ebintu ebikulu mu ngeri ey’obutuufu obw’amaanyi
Amaanyi:Stable die attach, okufuga enkola okw’amaanyi, okukwatagana kw’amakungula amangi
Ekisinga obulungi ku:Okupakinga IC, LED, ebyuma ebikozesebwa mu maanyi, ebyuma by’emmotoka
Ekigambo ekikulu:ASM AD838 die bonder / Ekyuma ekikwata ekifa ekya ASM
Ekifo:Enkola ez’omulembe ez’okupakinga & ez’omulembe eza flip chip
Amaanyi:Obutuufu obw’amaanyi ennyo, obusobozi bw’okukwatagana obw’omulembe obw’omugatte
Ekisinga obulungi ku:Okupakinga okw’omulembe, okugatta ku ddaala lya wafer, fabs za semiconductor ez’omutindo ogwa waggulu
Ebbaluwa:Ensimbi ezisingako, essira liteekeddwa ku nkola ey’omulembe nodes
Ekifo:Flexible waya bonding & okufa okugatta platform
Amaanyi:Ekola ebintu bingi, ekozesebwa nnyo mu kukola semikondokita ez’omu makkati
Ekisinga obulungi ku:General IC assembly, layini z’okufulumya eby’edda, fabs ezitafaayo ku ssente
Ebbaluwa:Strong installed base, naye wansi automation level vs enkola empya
Singa ekyetaagisa kiba stable high-volume die attach production, ASM AD838 esigala nga strong balanced solution. BESI yettanirwa nnyo okuyiiya okupakinga okw’omulembe, ate enkola za K&S zitera okukozesebwa mu mbeera z’okufulumya ezikekkereza ssente oba ez’edda.
Ekozesebwa mu nkola z’okuyunga semiconductor die mu kupakinga IC, okukuŋŋaanya LED, n’okukola semiconductor z’amaanyi.
Yee, kyuma kya die bonding eky’obutuufu obw’amaanyi ekyakolebwa okuteeka chip mu ngeri ey’otoma ku semikondokita substrates.
Die bonder ekwataganya chips za silicon ku substrates, ate wire bonder eyunga terminal z’amasannyalaze nga ekozesa waya ennungi.
Ekozesebwa nnyo mu kupakinga kwa semikondokita, ebyuma by’emmotoka, okukola LED, n’okukola ebyuma ebikozesa amaanyi.
Yee, ekoleddwa mu mbeera z’okufulumya ezitebenkedde ezikola amakungula amangi nga zeetaaga obutuufu bw’okuteeka die obutakyukakyuka.
Ewagira enkola ya epoxy bonding, solder bonding, ne adhesive die attach enkola okusinziira ku byetaago by’okukozesa.
Ekoleddwa yinginiya okusobola okukwatagana obulungi ku ddaala lya sub-micron mu nkola ez’omulembe ez’okupakinga semikondokita.
Yee, ekozesebwa nnyo mu butale obw’okubiri, layini z’ebyuma bya semikondokita eziddaabiriziddwa, n’enkola z’okufulumya eby’edda.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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