SAKI 3D AOi smt Makina Oyang'anira Makina Odzipangira okha 3Di-LS3

M'makampani amakono opanga zamagetsi, zofunikira pakuwunika kwa PCB (ma board osindikizidwa) zikukwera kwambiri, makamaka kuyang'ana kwapamwamba kwapang'onopang'ono (monga BGA, QFN, CSP) ndi zida zazing'ono (monga 0201, 01005). Zipangizo zamakono za 2D AOI (automatic optical inspection) zakhala zovuta kukwaniritsa zofunikira zolondola kwambiri, ndipo SAKI 3Di-LS3 3D AOI imapereka njira yowunikira yolondola komanso yowona bwino pamizere yopangira ya SMT (surface mount technology) yokhala ndi luso lazojambula la 3D komanso ma aligorivimu anzeru.

Ubwino wa mankhwala

✅ Kuwunika kolondola kwambiri kwa 3D: Kugwiritsa ntchito ukadaulo wa laser scan, magawo ofunikira monga kutalika kwa mgwirizano wa solder, coplanarity, ndi voliyumu zitha kuyezedwa molondola kuti muchepetse kuweruza molakwika.

✅ Kuyang'ana mwachangu: Kukhathamiritsa makina owoneka bwino ndi ma aligorivimu, liwiro loyendera limaposa 20% kuposa lachikhalidwe cha 3D AOI, chomwe ndi choyenera kupanga mizere yothamanga kwambiri ya SMT.

✅ Kuzindikira cholakwika mwanzeru: AI algorithm imangophunzira ndikukhathamiritsa kuti muchepetse ma alarm abodza (Kuyimba Kwabodza) ndikuwongolera kudalirika koyendera.

✅ Kugwirizana kwakukulu: imathandizira mitundu yonse yamitundu yama board a PCB (yolimba, yosinthika, HDI) ndi zida zovuta (BGA, LGA, PoP, ndi zina).

✅ Mapangidwe amtundu: ntchito zowunikira zitha kukulitsidwa malinga ndi zosowa zamakasitomala, monga kulumikizana kwa SPI (solder paste kuzindikira) kuti mukwaniritse kuwongolera kotseka.

Mfundo yogwira ntchito

SAKI 3Di-LS3 imagwiritsa ntchito ukadaulo wa laser triangulation, wophatikizidwa ndi kamera ya CCD yokwera kwambiri, kuti ikwaniritse kujambula kwa 3D:

Kusanthula kwa laser: Mzere wa laser umawonetsedwa pamwamba pa PCB, ndipo kamera imagwira kuwala kowonekera kuchokera kumakona osiyanasiyana kuti iwerengere kutalika kwa kutalika kwa solder.

Kujambula kwa 3D: Kupyolera mu kusanthula kwamakona ambiri, mbiri ya 3D ya cholumikizira cha solder imapangidwa, ndipo kutalika, voliyumu, mawonekedwe ndi magawo ena amayesedwa molondola.

Kusanthula kwa AI: Algorithm yotengera kuphunzira mozama imangofananiza mtundu wamba wa solder kuti uzindikire zolakwika monga zolumikizira zozizira, solder yosakwanira, bridging, ndi offset.

Ntchito zazikulu

1. Kuzindikira kolumikizana kwa solder kwa 3D

Yesani kutalika, voliyumu, ndi coplanarity wa ophatikizana solder kuonetsetsa kuti soldering khalidwe zobisika solder olowa monga BGA ndi QFN.

Dziwani zolakwika zomwe zimachitika kawirikawiri monga phala losakwanira la solder, mipira ya solder, ndi tombstoneng.

2. Kuzindikira kwachigawo chapamwamba kwambiri

Dziwani zovuta monga kuyika, tombstone, ndi rollover ya zinthu zazing'ono kwambiri monga 0201 ndi 01005.

Kuthandizira kuzindikira kozungulira kwa 3D kwa zigawo zooneka mwapadera, zotchingira zotchinga, ndi zolumikizira.

3. Kusanthula deta mwanzeru

Pangani zokha malipoti a SPC (statistical process control) kuti muwongolere njira zopangira.

Phatikizani ndi MES (kachitidwe kachitidwe kopangira) kuti mukwaniritse kutsata kwa data ndikuwunika munthawi yeniyeni.

4. Mapulogalamu osinthika ndi kukonza zolakwika

Perekani mawonekedwe owonetsera, kuthandizira pulogalamu yapaintaneti (OLP), ndikufupikitsa nthawi yosintha mzere.

Ntchito yophunzirira-yokha kuti muchepetse ntchito yochotsa zolakwika pamanja.

Zogulitsa

📌 Optical system

Kusanthula kwa laser kwapamwamba kwambiri: kulondola kumatha kufika ± 1μm, koyenera kuzindikira gawo lapamwamba kwambiri.

Gwero la kuwala kokhala ndi ma angle angapo: mphete ya LED + coaxial kuwala kophatikizira kuti muchepetse kusokoneza kwa mthunzi ndikuwongolera mawonekedwe.

📌 Mapulogalamu a algorithm

Kuphunzira Mwakuya kwa AI: Imakonza zodziwikiratu kuti zigwirizane ndi mapangidwe osiyanasiyana a PCB.

Adaptive Threshold: Imachepetsa kuganiziridwa molakwika chifukwa cha mtundu wa PCB, mawonedwe, ndi zina.

📌 Kapangidwe ka Makina

High Rigidity Frame: Imachepetsa kugwedezeka ndikuwonetsetsa kukhazikika kwa sikani.

Autofocus System: Imasinthira ku makulidwe osiyanasiyana a board popanda kusintha pamanja.

Mfundo Zaukadaulo

Zotsatira za Project Parameters

Kuzindikira kulondola ±1μm (Z axis)

Kuthamanga kwa kuzindikira Kufikira 25cm²/s

Osachepera chigawo kukula 01005 (0.4mm × 0.2mm)

Laser wavelength 650nm (laser wofiira)

Kusintha kwa kamera 12MP (4096×3072)

Yogwirizana PCB kukula 50mm × 50mm ~ 510mm × 460mm

Kuyankhulana kwa SECS/GEM, TCP/IP

Zofunikira zamagetsi AC 200-240V, 50/60Hz

Zochitika zantchito

Consumer electronics: High-density PCB kuzindikira mafoni a m'manja, mapiritsi, ndi zipangizo zovala zanzeru.

Zamagetsi zamagalimoto: Kuwongolera kwamtundu wazinthu zazikulu monga ADAS ndi ECU.

Kuwongolera mafakitale: Kuzindikira kudalirika kwa PCB kwa ma seva ndi malo olumikizirana.

Mapeto

SAKI 3Di-LS3 3D AOI yakhala chida chofunikira kwambiri chowongolera khalidwe lamakono muzopanga zamakono zamakono zomwe zimakhala ndi makina osindikizira a laser, AI intelligent algorithm ndi luso lozindikira mofulumira kwambiri. Kaya ikuchita ndi magawo ang'onoang'ono kapena njira zopakira zovuta, imatha kupereka njira zodalirika komanso zodziwikiratu kuti zithandizire makasitomala kukonza zokolola ndikuchepetsa mtengo wopangira.