The ACCRETECH UF200R is a fully automated, cost-effective semiconductor prober from ACCRETECH (Japan) for 120–200mm (5–8 inch) wafers. It's used for electrical testing (CP testing) of wafer-level chips before dicing.
What does it do?
Simply put: Before the wafer is diced into individual chips, probes contact the chip pads to perform electrical/functional testing, separating good and defective chips. Stage: Wafer Testing (CP)
Target: Primarily 200mm (8-inch), also suitable for 5/6-inch wafers
Typical Chips: Logic, Analog, Power Devices, Discrete Devices, MEMS
II. Core Specifications (At a Glance)
Wafer Size: 120/150/200mm (5–8-inch)
Positioning Accuracy: ±1.5μm (XY)
Moving Speed:
XY: Up to 300 mm/s
Z: Up to 30 mm/s
Temperature Range: -40℃ ~ +150℃ (Optional Temperature Control)
Stage: High-rigidity Z/θ platform, compatible with ultra-thin/warped wafers
Operation: Fully automated loading and unloading, automatic alignment, probe inspection
III. Main Functions
Fully Automated Testing Process
Automatic Wafer Loading → Image Alignment → Probe Contact → Electrical Testing → Segmentation and Recording → Automatic Unloading
Multi-Category Compatibility
Standard Logic, Analog, Power, MOSFET, Diode, Transistor, MEMS All can be measured. Wide temperature range and special tests. Complete options for low/high temperature, micro-current, high-voltage testing, etc. Ultra-thin/warped wafer processing. Backside adsorption + special handling mechanism, supporting ultra-thin (≤50μm) and high-warped wafers.
IV. Advantages (Compared to similar products)
High cost-performance ratio: Near the precision and platform of the high-end UF2000 (same as MMI), but at a more affordable price.
High throughput: XY high speed + quick pin change card, suitable for high-volume 8-inch production lines.
Stable and reliable: Mature ACCRETECH platform, low maintenance, long lifespan.
Flexible expansion: Modular design, can be added later with temperature control, high voltage, micro-current, dual-bin, etc.
V. Common comparisons (helping you quickly locate the right product)
UF200R: General 8-inch mass production, logic/power/discrete, cost-effectiveness priority.
UF190R: More compact, entry-level, biased towards discrete devices/small batches.
UF2000: High-end 8-inch, higher precision, wider temperature control, MEMS/ Advanced Technology
In short: The UF200R is the "mainstay cost-effective probe station" in the 8-inch mid-test market—it offers sufficient accuracy, high speed, stability, durability, and expandability, making it suitable for high-volume, multi-variety 8-inch production lines.


