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The SIPLACE CA machine is a hybrid placement machine launched by ASMPT, which can realize both semiconductor flip chip (FC) and chip attachment (DA) processes on the same machine.
Technical specifications and performance parameters
The SIPLACE CA machine has a placement speed of up to 420,000 chips per hour, a resolution of 0.01mm, a number of feeders of 120, and a power supply requirement of 380V12. In addition, the SIPLACE CA2 has an accuracy of up to 10μm@3σ and a processing speed of 50,000 chips or 76,000 SMDs per hour.
Application areas and market positioning
The SIPLACE CA machine is particularly suitable for production environments that require high flexibility and powerful functions, such as automotive applications, 5G and 6G devices, smart devices, etc. By combining traditional SMT with bonding and flip chip assembly, SIPLACE CA improves the productivity of advanced packaging, maximizes flexibility, efficiency, productivity and quality, and saves a lot of time, cost and space.
Market and Technology Background
As automotive applications, 5G and 6G, smart devices and many other devices require more compact and powerful components, advanced packaging has become one of the key technologies. SIPLACE CA machines create new opportunities for electronics manufacturers through their highly flexible configuration and streamlined processes, open up new markets and new customer groups, reduce costs and increase productivity.
In summary, SIPLACE CA machines are the ideal choice for electronics manufacturers with their high performance, high flexibility and powerful functions, especially in production environments that require high integration and advanced packaging
