The ASM surface mount machine experienced material flying during installation, causing the material to fall onto the circuit board.

Handling methods and troubleshooting steps

It is recommended to conduct a systematic investigation in order from easy to difficult and from outside to inside.

Step 1: Immediate response and initial observation

Emergency shutdown: Immediately stop the production line to prevent further defective products and equipment damage.

Marking the location of the flying material: Mark the position and model of the dropped component on the PCB where the flying material occurred for subsequent analysis.

Observation phenomenon:

Is the flying material fixed to a certain head? Or is it fixed with a certain material? Or does it happen randomly?

Observe the approximate area where the component falls, is it during the movement after material retrieval or at the moment of installation?

Step 2: Systematic troubleshooting (following the 5M1E method)

1. Suction nozzle

Cleaning and Inspection: First, clean all suction nozzles in use and use a microscope or magnifying glass to check for blockages, wear, and cracks.

Verify the model: Confirm whether the nozzle model matches the specifications of the currently produced components.

Replacement test: Replace the suspected problematic nozzle with a new one and test if the problem is resolved.

2. Feeder

Correct the feeding position: manually step into the feeder and observe whether the feeding position is in the center directly below the suction nozzle. If there is any deviation, re teach the material pickup position.

Check the feeder: Check if the feeder gear is worn, if the cover is tightly pressed, and if the air pipe is unobstructed.

Comparative test: Swap the feeder with flying material with another feeder of the same model from a normal machine to see if the problem is transferred along with the feeder.

3. Components and materials

Check the materials: Check if the tape cover film has peeled off completely and if the components are loose in the tape. Try changing to a new roll of material for testing.

Measuring components: Use a micrometer to measure the thickness, length, and width of the components, and compare them with the parameters set in the program.

4. Program and Parameters

Check the height setting: Verify and re teach the feeding height and mounting height of the components.

Optimization speed: Reduce the Z-axis movement speed of the mounting head appropriately, especially for light and small components (such as 020101005).

Check vacuum/blowing settings: Check if the vacuum detection level is reasonable and if the blowing pressure is too high (usually set at 3-5 Bar, small components need to be smaller).

Check the component library: Ensure that the parameters such as size, thickness, type, etc. in the component library are accurate and correct.

5. Equipment hardware

Check the vacuum system:

On the machine I/O monitoring interface, check if the vacuum value of the mounting head is within the normal range (usually>-70kPa during suction).

Monitor whether the working sound of the vacuum generator is normal.

Check if there is any air leakage sound in the vacuum pipeline and if the joints are loose.

Clean the vacuum filter: Regularly replace or clean the intake filter of the vacuum pump.

Check the mounting head: Check if the mounting head is loose and if the Z-axis motor runs smoothly.

6. Environment and fixtures

Check PCB support: Increase or adjust the position of the ejector pin to ensure that the PCB board is firmly supported during installation, without hanging or shaking.

Check the level of the equipment: Use a spirit level to check if the machine is in a horizontal state.