Does every MRSI-605 support temperatures up to 500 degrees Celsius?

No. The approximately 500 degree Celsius specification was associated with a specialized heated stage for a documented TO-package eutectic configuration.

Used Advanced Packaging Equipment

Used MRSI-605 AP Die Bonder for Sale, Inspection and Support

Source a used MRSI-605 AP or Newport MRSI-605 die bonder with configuration verification, condition review, tooling confirmation, export preparation and technical coordination. Each machine is evaluated according to its installed process modules and your actual production requirement.

Availability changes by machine and location. Request the current equipment list rather than relying on an old stock photograph or an unverified model description.

Check Current Availability Send Existing Machine Details

Used MRSI-605 AP Newport die bonder for sale and inspection

MRSI-605 / MRSI-605 AP Actual machine photographs and configuration are supplied during equipment confirmation.

Used Equipment

Machine Identification Confirm model plate, serial number, year, location and operating status.

Configuration Verification Review vision, bond heads, handlers, heated stages, dispensers and tooling.

Inspection Support Coordinate photographs, video, power-on checks and available test results.

Export and Delivery Plan equipment preparation, packing, transport and installation requirements.

Procurement-Focused Equipment Page

Buying a Used MRSI-605 Requires More Than Finding the Model Name

The MRSI-605 AP is a legacy advanced packaging die bonder that was supplied in different application configurations. It may also appear in equipment records as the MRSI-605, Newport MRSI-605 or MRSI-605 Ultra-Precision Assembly Work Cell.

Historical configurations supported epoxy die attach, eutectic bonding and flip-chip assembly for products such as photonics packages, microwave and RF modules, MEMS devices, hybrid circuits and multi-chip modules.

However, two MRSI-605 machines may contain different cameras, bond heads, heated stages, material handlers, dispensers, computer systems, software and tooling. The correct purchasing decision must therefore be based on the actual installed configuration and present machine condition.

For a broader introduction to the MRSI equipment family, review our MRSI Systems die bonding machine overview. This page focuses specifically on used MRSI-605 sourcing and delivery.

What Equipment Users Care About

Six Questions That Must Be Answered Before Purchase

A credible quotation should answer these questions instead of presenting only a machine photograph and model number.

Is the Machine Complete?

Confirm the computer, controller, cameras, heads, handlers, stages, pumps, feeders, fixtures, safety covers and supporting accessories.

Can It Power On and Initialize?

Check whether the control system boots, axes home, cameras display images and the machine completes its basic startup sequence.

Does It Support the Required Process?

Do not assume epoxy, eutectic or flip-chip capability without checking the specific hardware, software and tooling installed.

Can Accuracy Be Verified?

Request calibration information or define a practical acceptance test based on the intended component, substrate and placement requirement.

Are Software and Programs Recoverable?

Confirm the industrial computer, hard disks, licenses, backups, operating interface and any available production recipes.

Can It Be Installed and Supported?

Review utilities, floor space, transport, spare parts, installation engineering and operator training before shipment.

What We Can Provide

Support Built Around the Equipment Project

Our role is to reduce uncertainty before purchase and coordinate the steps required to move a legacy die bonder from its current location into a usable production environment.

Equipment Search

Global Machine Sourcing

Search available equipment according to model, year, location, condition, process configuration and expected delivery schedule.

Technical Review

Configuration Matching

Compare the installed machine modules with the required die, substrate, material input, bonding process and production conditions.

Condition Review

Photographs and Power-On Checks

Request current machine photographs, serial-number information, power-on video and available maintenance or calibration records.

On-Site Support

Third-Party Inspection Coordination

Where project conditions allow, coordinate a technician or inspection party to review machine completeness and operating condition.

Technical Preparation

Tooling and Parts Planning

Identify missing collets, fixtures, cameras, computers, pumps, stages or service parts that may be required after delivery.

Export Delivery

Packing and Logistics Support

Coordinate machine shutdown, securing of moving assemblies, moisture protection, export packing and international transport.

Site Preparation

Installation Requirement Review

Confirm power, compressed air, vacuum, gas, exhaust, floor conditions, door dimensions and rigging access.

Post-Delivery

Installation and Technical Follow-Up

Evaluate installation, startup, calibration, operator guidance and troubleshooting support according to destination and project scope.

Equipment Condition Options

Choose the Required Level of Machine Preparation

The exact service scope depends on machine location, condition, available engineering resources and the final commercial agreement.

Option 01

As-Is Equipment

Suitable when the customer has its own engineering team and accepts the machine based on the available condition information.

Basic machine identification
Available photographs and records
Included accessories list
Export packing coordination

Option 02

Tested Equipment

Suitable when the project requires defined power-on checks or inspection before shipment.

Startup and initialization review
Basic axis and vision checks
Installed module confirmation
Inspection report where available

Option 03

Prepared Project Machine

Suitable when additional preparation, missing-item sourcing or technical coordination is required before delivery.

Condition-based preparation plan
Parts and tooling coordination
Defined acceptance requirements
Installation planning support

Historical Capability Reference

MRSI-605 AP Process and Application Overview

This information is provided to help define the search requirement. It must not be treated as confirmation that every used MRSI-605 includes the listed capability.

Verify Actual Configuration

Capability	Historical MRSI-605 Information	Required Verification
Equipment type	Automated advanced packaging die bonder and ultra-precision assembly work cell	Confirm the model plate, build configuration and whether the machine is complete.
Bonding processes	Historical systems were offered for epoxy die attach, eutectic bonding and flip-chip assembly.	Check dispensers, dipping or flux systems, flip hardware, heated stages, scrub and software.
Placement accuracy	A documented TO-package eutectic configuration was described with 10 μm placement accuracy.	Do not apply this value to every machine; request calibration or define an acceptance test.
Force control	Closed-loop force feedback and controlled handling of delicate GaAs and InP devices were documented.	Confirm installed bond head, load cell, force range, collet and present calibration condition.
Vision	Advanced machine vision was used for component and substrate alignment.	Inspect cameras, lenses, lighting, vision boards, image quality and pattern recognition.
Material inputs	Available presentation methods included waffle packs, Gel-Paks, wafers and feeders.	Verify the stations, wafer ejector, holders and feeder bases included with the actual machine.
TO-package option	A specialized configuration included automatic clamping and rotation for TO-package assembly.	Confirm all package-handling, rotation, fixture and control hardware.
Eutectic materials	The documented TO option supported direct AuSi and AuSn or AuGe preform reflow.	Verify heated stage, process gas, scrub, tooling and temperature control.
Temperature	The specialized TO-package work stage was documented with programmable control up to approximately 500°C.	This is not a standard value for every MRSI-605 and must be confirmed on the offered machine.
Process atmosphere	The documented eutectic option used heated hydrogen and nitrogen cover gas over the hot plate.	Confirm gas lines, controls, safety requirements and destination-facility compliance.

Technical accuracy notice: MRSI-605 systems were often built or modified for specific applications. Model name, machine appearance and year alone cannot confirm its bonding processes or performance.

Used Machine Inspection

MRSI-605 Pre-Purchase Inspection Checklist

The inspection should focus on whether the machine can be recovered for the intended process—not only whether its main power turns on.

Request Inspection Support

Model and serial number Verify the machine plate, formal designation, production year and ownership information.

Computer and controller Check operating system, control software, hard drives, licenses, backups and communication.

Axis movement Review initialization, homing, abnormal sound, alarms, travel and mechanical condition.

Vision system Check cameras, lighting, lenses, image quality, recognition and calibration functions.

Bond heads Confirm installed heads, load cells, Z mechanisms, collets, cables and force feedback.

Material handlers Check wafer hardware, ejector, waffle-pack stations, Gel-Pak holders and feeders.

Process modules Inspect dispensing, dipping, flux, eutectic, flip-chip, heated-stage and scrub systems.

Utilities and safety Review power, air, vacuum, gas, exhaust, interlocks, emergency stops and safety covers.

Tooling and fixtures List collets, needles, package fixtures, wafer rings, carriers, boats and calibration tools.

Documentation Confirm manuals, drawings, parts lists, recipes, maintenance history and service records.

Acceptance Planning

Recommended Acceptance Levels

The appropriate test level should be agreed before the inspection or quotation is finalized.

LEVEL 01

Visual Completeness

Confirm machine identity, major modules, covers, computer, handlers and included accessories.

LEVEL 02

Power-On Function

Check startup, axis initialization, camera display, basic controls, alarms and safety functions.

LEVEL 03

Basic Motion Test

Review axis movement, homing, repeat movement, tool change and available material handling.

LEVEL 04

Application Test

Run an agreed test using suitable die, substrate, program, tooling and measurable acceptance criteria.

Quotation Clarity

What Should Be Listed in the Equipment Offer?

A clear quotation helps prevent disputes concerning missing modules or accessories after the machine arrives.

Machine Information

The quotation or supporting document should identify:

Exact model and serial number
Production year where available
Current machine location
Operational and deinstallation status
Power and utility requirements
Machine dimensions and approximate weight

Included Configuration

The quotation should separately list:

Computer, monitor and operating software
Cameras, lighting and vision hardware
Bond heads, collets and tool holders
Material-input stations and feeders
Dispensing, eutectic or flip-chip modules
Fixtures, manuals and spare parts

Typical Application Requirements

Where Used MRSI-605 Equipment May Still Be Valuable

The strongest reason to purchase a legacy MRSI-605 is usually compatibility with an existing product, process or production environment.

Photonics and Optical Packages

Laser, detector, optical module and TO-package applications using suitable epoxy or eutectic configurations.

Microwave and RF Modules

MMIC, RF power, beam-lead and hybrid microwave assemblies requiring controlled component placement.

MEMS and Sensor Devices

Fragile devices that require appropriate pickup tooling and closed-loop placement-force control.

Multi-Chip Modules

Complex packages containing different semiconductor devices, materials and assembly sequences.

Hybrid Microelectronics

Established products with existing fixtures, component programs and validated bonding processes.

Aerospace and Defense Products

Long-life programs where replacing a qualified legacy process may create significant revalidation work.

Project Qualification

When to Buy—and When Not to Buy—an MRSI-605

A legacy platform is valuable only when its compatibility and total recovery cost support the project.

Decision Factor	A Good MRSI-605 Project	A High-Risk MRSI-605 Project
Production process	The factory already has an established or documented MRSI-605 process.	The process is completely new and no application engineering information is available.
Tooling	Existing fixtures, collets, programs or package tooling can be reused.	All application-specific tooling is missing and cannot be reproduced easily.
Machine condition	The machine is complete, inspectable and has recoverable software.	The machine is incomplete, cannot power on and has no control-system backup.
Engineering support	The customer has internal experience or qualified technical support.	No engineer is available to install, calibrate or maintain the legacy platform.
Commercial objective	The platform reduces revalidation work or adds compatible production capacity.	The machine is selected only because the initial purchase price appears low.

Equipment Purchase Workflow

From Requirement to International Delivery

A structured process allows technical and commercial risks to be identified before shipment.

STEP 01

Submit Requirement

Provide process, machine condition, destination and expected schedule.

STEP 02

Identify Equipment

Review candidate machines by serial number, location and configuration.

STEP 03

Verify Condition

Collect photographs, video, records and agreed inspection information.

STEP 04

Confirm Offer

Define included items, exclusions, acceptance scope and delivery terms.

STEP 05

Prepare Delivery

Coordinate shutdown, packing, transport and installation requirements.

Why This Page Is Different

Equipment Information Designed to Support a Real Decision

Not Just a Stock Listing

Model Name Alone Is Not Enough

We do not treat every MRSI-605 as the same machine. The quotation process should identify the actual configuration, current condition, included tooling and known technical limitations.

Conversion With Trust

Clear Information Produces Better Inquiries

Providing the required process, existing machine details and acceptance expectations allows us to search for a more relevant machine and reduce unnecessary quotation exchanges.

Frequently Asked Questions

Used MRSI-605 AP Die Bonder FAQ

Is a used MRSI-605 AP currently available?

Availability changes according to machine location, condition and market inventory. Send the required configuration and destination so that current candidate machines can be checked.

Is MRSI-605 the same as MRSI-605 AP?

Used-equipment records may describe the machine as MRSI-605, MRSI-605 AP, Newport MRSI-605 or MRSI-605 Ultra-Precision Assembly Work Cell. Final identification should be based on the model plate, serial number and installed configuration.

Can every MRSI-605 perform epoxy, eutectic and flip-chip bonding?

No. These processes were historically available on the MRSI-605 AP platform, but the required dispensers, stages, scrub systems, flip hardware, cameras, tooling and software may not be installed on every machine.

What is the placement accuracy of the MRSI-605?

A documented MRSI-605 TO-package eutectic configuration was described with 10 μm placement accuracy. The accuracy of an individual used machine must be confirmed through its records, calibration status or an agreed placement test.

Does every MRSI-605 support temperatures up to 500°C?

No. The approximately 500°C specification was associated with a specialized programmable heated stage for a documented TO-package eutectic configuration. The installed stage and controls must be checked.

Can you inspect an MRSI-605 before shipment?

Inspection can be evaluated according to machine location and seller access. The scope may include current photographs, power-on video, configuration review, basic functional checks or an agreed on-site inspection.

What information is needed to find a replacement MRSI-605?

Provide photographs of the existing model plate and machine interior, serial number, year, software version, bond heads, cameras, handlers, process modules, tooling, product type and known fault.

Can you supply MRSI-605 tooling and spare parts?

Tooling and parts requirements can be evaluated according to the installed configuration and available resources. Useful information includes photographs, labels, part numbers, dimensions and installed position.

Can you support export packing and international shipping?

Export delivery support can include machine preparation, securing of moving assemblies, moisture protection, wooden-case packing, loading and transport coordination according to the destination.

Can you provide installation and startup support?

Installation, startup, calibration and operator-support requirements can be evaluated according to destination, machine condition, process scope and available engineering resources.

Used MRSI-605 Equipment Request

Request Current Machines With the Required Configuration

Send details about your existing MRSI-605 or the intended bonding process. This allows us to check the relevant machine configuration instead of sending an unrelated equipment offer.

Existing model plate and serial number, when available
Required epoxy, eutectic or flip-chip process
Die, substrate and package information
Required handlers, heads, stages and tooling
Preferred machine condition and inspection level
Destination country and expected delivery schedule

Check MRSI-605 Availability

Include photographs or part information in your follow-up email or WhatsApp conversation where possible.

MRSI, Newport, Mycronic and related product names are trademarks of their respective owners. GEEKVALUE is an independent equipment supplier and technical service provider and is not presented as the original manufacturer.