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xhIinkcukacha kunye neeparamitha zeMPM Momentum solder umshicileli wokuncamathisela zimi ngolu hlobo lulandelayo:
Ukuphathwa kweSubstrate:
Obona bukhulu bobungakanani besubstrate: 609.6mmx508mm (24”x20”)
Ubuncinane bobungakanani besubstrate: 50.8mmx50.8mm (2”x2”)
Ubunzima beSubstrate: 0.2mm ukuya ku-5.0mm (0.008” ukuya ku-0.20”)
Ubunzima besubstrate enkulu: 4.5kg (9.92lbs)
Umphetho wesubstrate ucoceko: 3.0mm (0.118”)
Ukukhutshwa okusezantsi: 12.7mm (0.5”) umgangatho, unokulungiselelwa ukuya kuma-25.4mm (1.0”)
I-Substrate clamping: Ukubambelela okuphezulu okulungisiweyo, i-vacuum yebhentshi, inkqubo ye-EdgeLoc edge clamping
Iindlela zenkxaso ye-substrate: i-vacuum yebhentshi, izikhonkwane zokukhupha imagnethi, izikhonkwane ze-vacuum ejector, iibhloko zenkxaso, ukulungiswa okukhethiweyo (isixhobo esincinci) okanye iGrid-Lok ekhethiweyo.
Iiparamitha zokuprinta:
Eyona ndawo yoshicilelo: 609.6mmx50 8mm (24"x20")
Ukukhutshwa koshicilelo: 0mm ukuya ku-6.35mm (0" ukuya ku-0.25")
Isantya sokushicilela: 0.635mm/sec ukuya ku-304.8mm/sec (0.025in/sec-12in/sec)
Uxinzelelo lokuprinta: 0 ukuya ku-22.7kg (0lb ukuya ku-50lbs)
Ubungakanani besakhelo sesakhelo sesakhelo: 737mmx737mm (29"x29").
Iimpawu zobuchwephesha: Ukuchaneka kolungelelwaniso kunye nokuphinda-phinda: ± 12.5 microns (±0.0005”) @6σ, Cpk≥2.0 Eyona nto i-solder paste yokuprinta isikhundla sokuphindaphinda ngokusekwe kuqinisekiso lwenkqubo yovavanyo lomntu wesithathu: ± ± 0.0008”) @6σ, Cpk≥2. 240VAC (±10%) isigaba esinye @50/60Hz, 15A Iimfuno zomoya oxinanisiweyo: 100 psi Ezi nkcukacha kunye neeparamitha zibonisa ubugcisa obucacileyo bomshicileli we-MPM Momentum solder paste, efanelekileyo kwiimfuno ezahlukeneyo zokwenziwa kombane.
