Besi Datacon 8800 ni chip yateye imbereGuhuza Imashini, ikoreshwa cyane muburyo bwa tekinoroji ya 2.5D na 3D, cyane cyane TSV (Binyuze muri Silicon Via)
2024-12-04Ibiranga ● Ukuri ± 3 µm @ 3s ● Gutanga kole / jetting yaUwiteka GuhuzaSource Inkomoko yibikoresho kugirango igenzurwe neza ● Igishushanyo mbonera cyo kugurisha imitwe ● Kugera kuri 8 "x 8" gutunganya insimburangingo ● Amahitamo ● Ubushobozi bwa chip chip ● UV gukizaIbipimoW x D x H2,150
2024-11-11Sisitemu ya MRSIUwitekaBonder nigicuruzwa cyitsinda rya Mycronic, ryibanda mugutanga byimazeyo, byuzuye-byuzuye, ultra-flexibleUwiteka Guhuzasisitemu, zikoreshwa cyane munganda za optoelectronics
2024-11-11SD8312 ya ASMPT yuzuye igurisha byoroshyeUwitekasisitemu ya bonder nigikoresho cyateye imbere cyagenewe gutunganya wa-12-ya wafer, hamwe nubushobozi buke bwo kuyobora ikadiri yo gutunganya no kuyoboraUwiteka Guhuzaumuvuduko. Sisitemu ikwiranye nimbaraga za semicon
2024-11-10AD7 *. Ndashimira XY ikosora
2024-11-10Ibiranga generation Igisekuru gishya gifite ubushobozi-buke bwa AD8312Uwitekaabahuza bashiraho amahame mashya yinganda design Igishushanyo mbonera gikora ku isi, gikwiye gutunganyirizwa hamwe amakaramu yo mu rwego rwo hejuru ● Kuboneka muburyo bwinshi kugirango uhuze amasoko atandukanye ● AD8312P
2024-11-10Ibisobanuro n'ibipimo bya ASMPT byikora byuzuyeUwiteka Guhuzasisitemu niyi ikurikira: Ibipimo: W x D x H 1,970 x 1,350 x 2,190 mm
2024-11-10Menyesha inzobere mu kugurisha
Shikira itsinda ryacu ryo kugurisha kugirango ushakishe ibisubizo byabigenewe bihuye neza nubucuruzi bwawe kandi ukemure ibibazo byose waba ufite.