Besi Datacon 8800 ye chip ey’omulembeOkukwatagana (bonding). Masiini, okusinga ekozesebwa mu tekinologiya w’okupakinga mu 2.5D ne 3D naddala mu nkola ya TSV (Through Silicon Via).

Ebifaananyi●Obutuufu ± 3 μm @ 3s●Glue dispensing/jetting forOmu Okukwatagana (bonding).●Okulondoola ensibuko y’ebintu okusobola okutumbula omutindo●Dizayini y’omutwe gwa soldering eriko patent●Okukwata ku substrate okutuuka ku 8” x 8”●Ebyokulonda●Obusobozi bwa flip chip●UV curingDimensionsW x D x H2,150

Enkola za MRSIOmuBonder kiva mu Mycronic Group, essira erisinga kulissa ku kuwa fully automatic, high-precision, ultra-flexibleOmu Okukwatagana (bonding).enkola, ezikozesebwa ennyo mu by’amasannyalaze g’amaaso

ASMPT's SD8312 fully automatic solder omugonvuOmubonder system kyuma kya mulembe ekyakolebwa okukola wafer ya yinsi 12, nga kirimu obusobozi bw’okukola fuleemu ya lead eya density enkulu n’okukulemberaOmu Okukwatagana (bonding).supiidi. Enkola eno esaanira semicon y’amaanyi

AD420XL egaba emisinde egy’amaanyi, egy’okulonda n’okuteeka Mini LED COB solutions ku LCD BLUs ennene (for local dimming) ne ultra-fine pitch LED displays, nga zirina obusobozi bw’okukwata chip entono, nga ntono nga 2 x 4 mil LED chips *. Okwebaza aba XY corr

Ebirimu● Omulembe omupya ogw'obusobozi obw'amaanyi AD8312 seriesOmubonders ziteekawo omutindo omupya eri amakolero● Universal worktable design, esaanira okukola ku high-density lead frames● Esangibwa mu configurations eziwera okutuukiriza ebyetaago by’akatale eby’enjawulo● AD8312P

Ebikwata ku ASMPT n’ebipimo byayo mu bujjuvuOmu Okukwatagana (bonding).enkola ziri bwe ziti:Ebipimo: Obugazi x Obugazi x Obuwanvu 1,970 x 1,350 x mm 2,190