Besi Datacon 8800 is an advanced chip Bonding Machine, mainly used for 2.5D and 3D packaging technology, especially TSV (Through Silicon Via) applications‌

Features●Accuracy ± 3 µm @ 3s●Glue dispensing/jetting for Die Bonding●Material source traceability for enhanced quality control●Patented soldering head design●Up to 8” x 8” substrate handling●Options●Flip chip capability●UV curingDimensionsW x D x H2,150

‌MRSI Systems Die Bonder‌ is a product of the Mycronic Group, which focuses on providing fully automatic, high-precision, ultra-flexible Die Bonding systems, which are widely used in the optoelectronics industry

ASMPT's SD8312 fully automatic soft solder Die bonder system is an advanced device designed for 12-inch wafer processing, with high-density lead frame processing capabilities and leading Die Bonding speed. The system is suitable for the power semicon

AD420XL provides high-speed, high-precision pick and place Mini LED COB solutions for large-size LCD BLUs (for local dimming) and ultra-fine pitch LED displays, with small chip handling capabilities, as small as 2 x 4 mil LED chips*. Thanks to the XY corr

Features● New generation high-capacity AD8312 series Die bonders set new standards for the industry● Universal worktable design, suitable for processing high-density lead frames● Available in multiple configurations to meet different market needs● AD8312P

The specifications and dimensions of the ASMPT fully automatic Die Bonding system are as follows:Dimensions: W x D x H 1,970 x 1,350 x 2,190 mm