I-Besi Datacon 8800 yi-chip ephezuluUkudibanisa Umatshini, ikakhulu isetyenziselwa i-2.5D kunye ne-3D iteknoloji yokupakisha, ngakumbi i-TSV (Nge-Silicon Via) izicelo

Iimpawu ● Ukuchaneka ± 3 µm @ 3s ● Ukukhupha iglu/ijetting ukwenzelaI Ukudibanisa● Umthombo wesixhobo sokulandeleka ukwenzela ulawulo oluphuculweyo lomgangatho ● uyilo lwentloko ethengiswayo enelungelo elilodwa lomenzi wechiza ● Ukuya kuthi ga kwi-8” x 8” yokuphatha isubstrate ● Iinketho ● I-Flip chip capability ● UV curingDimensionsW x D x H2,150

Iinkqubo ze-MRSIII-Bonder yimveliso yeQela leMycronic, elijolise ekuboneleleni ngokuzenzekela ngokupheleleyo, ukuchaneka okuphezulu, okuguquguqukayo.I Ukudibanisaiinkqubo, ezisetyenziswa ngokubanzi kushishino optoelectronics

I-SD8312 ye-ASMPT ye-SD8312 ezenzekelayo ethambileyo ezenzekelayo ngokupheleleyoIInkqubo yebhondi sisixhobo esiphucukileyo esenzelwe i-12-intshi yokusetyenzwa kwe-wafer, kunye noxinzelelo oluphezulu lwesakhelo sokusebenza kunye nokukhokela.I Ukudibanisaisantya. Inkqubo ifanelekile kwi-semicon yamandla

I-AD420XL ibonelela ngesantya esiphezulu, ukuchaneka okuphezulu kunye nokubeka izisombululo ze-Mini ze-LED COB zobungakanani obukhulu be-LCD BLUs (ye-dimming yendawo) kunye ne-ultra-fine pitch iziboniso ze-LED, kunye nezakhono zokuphatha i-chip encinci, encinci njenge-2 x 4 mil chips ze-LED. *. Enkosi kwi-XY corr

Iimpawu ● Isizukulwana esitsha somthamo ophezulu we-AD8312 uthothoIiibhondi ziseta imigangatho emitsha kushishino ● Uyilo oluthatywayo olusebenzayo jikelele, olulungele ukusetyenzwa kwezakhelo ezinoxinano oluphezulu.

Iinkcukacha kunye nemilinganiselo ye-ASMPT ngokuzenzekelayoI Ukudibanisainkqubo zezi zilandelayo: Imilinganiselo: W x D x H 1,970 x 1,350 x 2,190 mm