Semiconductor equipment
MRSI Systems Die Bonding Machine

IiNkqubo ze-MRSI Die Bonding Machine

I-MRSI Systems Die Bonder yimveliso yeQela le-Mycronic, elijolise ekuboneleleni ngokuzenzekela ngokupheleleyo, ukuchaneka okuphezulu, iinkqubo eziguquguqukayo zokudibanisa ukufa, ezisetyenziswa ngokubanzi kwishishini le-optoelectronics.

Ilizwe:Isetyenzisiwe Ikhona: yiba Iwaranti: ubonelelo
Iinkcukacha

I-MRSI Systems die bonders ziyimveliso yeQela le-Mycronic, elijolise ekuboneleleni ngokuzenzekela ngokupheleleyo, ukuchaneka okuphezulu, kunye ne-ultra-flexible die bond systems kwiinkqubo ezininzi zokusetyenziswa kwishishini le-optoelectronics. Iibhondi zokufa ze-MRSI Systems zinezi mpawu zilandelayo kunye nezibonelelo:

MAR

Ukuchaneka okuphezulu kunye nokuguquguquka: I-MRSI-H i-series die bonders inikezela ngokuchaneka kwebhondi ye-micron ye-1.5, ifanelekile kwi-high-volume, imveliso ephezulu yokuxuba, kunye nokuguquguquka okukhethekileyo kunye nokuthembeka. I-MRSI-S-HVM die bonder inokutshintsha ngokuzenzekelayo phakathi kwe-± 0.5 micron kunye ne-± 1.5 micron ukuchaneka kweendlela, ezifanelekileyo kwi-packaging ye-semiconductor wafer-level, ukuxhasa i-multi-chip, imveliso emininzi.

Isantya esiphezulu kunye nokuSebenza okuPhakamileyo: Uthotho lwe-MRSI-HVM iibhondi zokufa zibonwa njengeebhondi ezikhokelela kudidi lokuqala kwishishini kwimveliso enesantya esiphezulu, echanekileyo echanekileyo ngesantya esihamba phambili, "zero ixesha" lokutshintsha phakathi kwemilomo, nangaphantsi kwe. 1.5 micron die bond ukuchaneka.

Ubuchwephesha obukwinqanaba eliphambili kunye noYilo: I-MRSI-HVM die bonder isebenzisa iintloko ezimbini ezinelungelo elilodwa lomenzi wechiza, izikhululo zokuwelda ezimbini ze-eutectic, inkqubo yokuguqula i-nozzle-time-nozzle, uyilo olugcweleyo lomoya kunye nezinye i-multi-level multi-function parallel process automation ukuqinisekisa ukusebenza kakuhle. I-MRSI-705 die bonder isebenzisa i-high-resolution linear encoders kunye neteknoloji yokuthwala umoya ukufezekisa ngokukhawuleza, ukuchaneka, ukubeka i-loop evaliweyo, kunye nokuchaneka kokubekwa kwe-chip kufinyelela +/- 8 microns.

Iinkalo zeSicelo esiBanzi: Ii-MRSI Systems 'die bonders zisetyenziswa ngokubanzi kunxibelelwano lwe-optical kunye nezixhobo zedatha yedatha / iimodyuli, izixhobo ze-microwave kunye ne-RF, i-laser enamandla amakhulu, i-Lidar kunye ne-AR / VR kunye nezinye i-optoelectronic sensors. Ukongeza, ifanelekile kwizixhobo ezicacileyo, iisekethe ezidibeneyo, i-MEMS kunye nezinye izicelo.

Ukusebenza kweMarike kunye noVavanyo lwabasebenzisi: IiNkqubo ze-MRSI zinendawo ebalulekileyo kwimarike yehlabathi, kwaye abakhuphisana nabo abaphambili baquka iBesi, i-Yamaha Robotics Holdings, i-KAIJO corporation kunye ne-AKIM Corporation. Iimveliso ze-MRSI Systems ziphumelele ukuqondwa kwabasebenzisi ngokubanzi kunye nesabelo semarike ngenxa yokuthembeka kwazo okuphezulu, isantya esiphezulu kunye nokuguquguquka okuphezulu.

Isishwankathelo, i-MRSI Systems 'die bonders ziye zaba ngumboneleli wesisombululo esibalulekileyo kwishishini le-optoelectronics ngokuchaneka okuphezulu, isantya esiphezulu, ukuguquguquka, kunye noluhlu olubanzi lwezicelo.

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