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The core pick-and-place module of the sorter is responsible for chip transfer
The main function of the control card is to receive instructions from the host computer, plan multi-axis movements (such as the XYZ axes of the turret and nozzle), and generate signals to precisely dr...
Precisely and gently pick up the chips, transfer them to the test station, and subsequently sort and place them into designated locations based on the test results
BESI die bonders are positioned in the global mid-to-high-end market, and with their leading flip-chip and hybrid bonding technologies, they hold a dominant position in the field of high-precision adv...
BESI die bonders are positioned in the global mid-to-high-end market, and their products are widely used in AI chips and high-performance computing, which is the core driving force for their rapid gro...
DISCO is the undisputed leader in the global semiconductor dicing machine market, with cutting, grinding, and polishing technologies at its core. Its equipment can process a variety of materials with ...
DISCO is a leading global manufacturer of dicing machines, specializing in cutting, grinding, and polishing technologies. Its dual-spindle and laser cutting solutions support precision and high-effici...
DISCO is a leading global manufacturer of wafer thinning machines with a high market share. Its equipment boasts high precision, supports ultra-thin wafer processing, and employs unique processes such...
DISCO thinning machines are characterized by high precision and low-damage grinding. Their unique TAIKO process can strengthen wafer edges and is widely used in memory, power devices and advanced pack...
The power module depicted in the image serves as the central subsystem of the ASM sorter. Far more than merely a stable energy source, it constitutes a comprehensive system that integrates intelligent...
In the realm of semiconductor dicing equipment, DISCO stands as the undisputed industry leader. Far from merely dominating the market, the company has erected formidable competitive barriers—bolstered...
It is the sensitivity adjustment amplifier used in the Blade Breakage Detector (BBD) on DISCO fully automatic dicing saws
LKFH-010068-0 is a CC Filter (proprietary filter) consumable designed for the water circulation systems of Disco dicing machines, serving as a core component of the cutting water filtration unit.
The LNEH-010010-0 flow meter is a precision sensor located within the cooling water circuit of a Disco dicing saw; it is responsible for monitoring the coolant flow to critical components—such as the ...
It is specifically designed to process the faint signals acquired by high-precision displacement sensors; through amplification, filtering, and conversion, it transforms these signals into standard el...
K&S is a leading global supplier of semiconductor wire bonders, specializing in areas such as ball bonding, wedge bonding, and advanced packaging. Renowned for its high precision and stability, th...
Core Function: As an integral part of the detection system, it converts faint optical signals into electrical signals, which are used to assess the integrity of components such as cutting blades.
To accommodate various bonding processes, K&S wire bonders are equipped with a range of power supply solutions, including AC/DC input power, high-power bonding power supplies, and switching power ...
The core function of this module is to precisely control gas flow rates within the die-bonding process. By regulating the mass flow of vapor within the "bubbler system," it ensures the stabi...
The core pick-and-place module of the sorter is responsible for chip transfer
The main function of the control card is to receive instructions from the host computer, plan multi-axis movements (such as the XYZ axes of the turret and nozzle), and generate signals to precisely drive the machine operation
Precisely and gently pick up the chips, transfer them to the test station, and subsequently sort and place them into designated locations based on the test results
BESI die bonders are positioned in the global mid-to-high-end market, and with their leading flip-chip and hybrid bonding technologies, they hold a dominant position in the field of high-precision advanced packaging
BESI die bonders are positioned in the global mid-to-high-end market, and their products are widely used in AI chips and high-performance computing, which is the core driving force for their rapid growth
Our clients are all from large publicly listed companies.
SMT Technical Articles
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Semiconductor accessories FAQ
MORE+Learn how to inspect used ASM SIPLACE 2x8 and 3x8 feeders before shipment. Review tape paths, lanes, latches, cover tape, tests and FAT evidence.
Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
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