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xhASM wire bonder Eagle Aero Reel to Reel is a high-performance wire bonding equipment designed for semiconductor packaging and testing production. The following is a detailed introduction:
Features
High precision: Eagle Aero wire bonder adopts advanced optical positioning technology and high-precision motion control system, which can achieve high-precision wire bonding process.
Multi-function: Suitable for a variety of package types, including QFN, DFN, TQFP, LQFP packaging, as well as optical module COC, COB packaging.
High efficiency: With high-speed movement and fast wire change functions, it can greatly improve production efficiency.
Easy to operate: With a user-friendly operation interface and intelligent control system, the operation is simple and easy to learn.
Application scenario
Eagle Aero wire bonder is mainly used in the wire bonding process in semiconductor packaging and testing production. The quality of wire bonding directly affects the reliability and performance of the packaged product. Therefore, Eagle Aero wire bonder can meet the wire bonding requirements of different package types and provide efficient and accurate wire bonding process for semiconductor packaging and testing production
