i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Ii-K&S wire bonders ziinkqubo zokunxibelelana ze-semiconductor ezizenzekelayo ezisetyenziselwa ukudala unxibelelwano lombane phakathi kwee-silicon chips kunye nee-package substrates. Inkqubo yokudibanisa idla ngokusebenzisa amandla e-thermosonic ukwenza unxibelelwano lwe-wire encinci ngegolide, ubhedu, okanye izinto ze-aluminium kwiphakheji yesekethe edibeneyo.
Ukubopha ngentambo yinkqubo yokudibanisa engundoqo kwiphakheji ye-semiconductor. Iinkqubo zokubopha ngentambo ze-K&S zisebenzisa indibaniselwano yobushushu, ukungcangcazela kwe-ultrasonic, kunye noxinzelelo ukwenza iibhondi ze-metallurgical phakathi kwentambo yokubopha kunye ne-semiconductor pad.
Le nkqubo iqinisekisa ukuhanjiswa kombane, amandla oomatshini, kunye nokuthembeka kwexesha elide kwizixhobo ze-IC, ii-semiconductors zamandla, kunye neenkqubo ze-microelectronic.
Iiplatifomu zomatshini wokubopha ucingo oluphambili ezisetyenziswa ekupakisheni ii-semiconductor kunye nokuhlanganisa ii-microelectronic.
Umatshini wokubopha iingcingo we-KS MAXUM PLUS ngumatshini wokubopha iingcingo ozenzekelayo ngokupheleleyo, osetyenziselwa ikakhulu ukuwelda i-lead yangaphakathi...
Jonga isitokhwe kunye nexabiso
I-KS Wire Bonder 8028PPS ngumatshini wokubopha intambo ozenzekelayo ngokupheleleyo, osetyenziswa kakhulu kwicandelo lezixhobo zokupakisha ze-LED. ...
Jonga isitokhwe kunye nexabiso
Uthotho lwe-ICONN oluvela kwi-K&S (Kulicke & Soffa) lucingo oluzenzekelayo olusebenzisa i-wire bonder oluneteknoloji evuthiweyo kunye ne-p...
Jonga isitokhwe kunye nexabiso
I-K&S IConn PLUS yintambo yokubopha eyaziwayo, ezenzekelayo ngokupheleleyo, ephakathi ukuya phezulu kwiphakheji ye-semiconductor...
Jonga isitokhwe kunye nexabisoIinkqubo zokubopha ze-K&S zihlanganiswe ngokubanzi kwiindawo zokwenza i-semiconductor apho ukuchaneka kokunxibelelana kombane kuchaphazela ngokuthe ngqo ukusebenza kwesixhobo kunye nokuthembeka kwaso.
Ukukhetha inkqubo efanelekileyo yokubopha intambo ye-K&S kufuna ukuvavanya iimfuno zesixhobo se-semiconductor, ubunzima bokupakisha, kunye neenjongo zokusebenza kwemveliso. Usetyenziso olwahlukeneyo lufuna amanqanaba ahlukeneyo okuchaneka, ukukhupha, kunye nokukwazi ukubopha.
Kwimveliso ye-semiconductor,ibhondi yentamboUkukhetha kuchaphazela ngokuthe ngqo isivuno, uzinzo lonxibelelwano, kunye nokuthembeka kwesixhobo ixesha elide.
Umgca wemveliso ye-K&S wire bonder uhlelwe ngamaqonga amaninzi ayilelwe amanqanaba ahlukeneyo okuchaneka kokupakisha kwe-semiconductor kunye neemfuno zemveliso.
| Inkqubo | Isikhundla | Ingqwalasela yeSicelo |
|---|---|---|
| I-ACON ye-K&S | Iqonga lemveliso engundoqo | Ukubopha ucingo lwe-semiconductor oluqhelekileyo lokupakisha i-IC ngokubanzi |
| I-K&S ICONN PLUS | Iqonga lokuchaneka eliphambili | Ukupakisha i-IC ecacileyo kunye neenkqubo zokunxibelelana ezinoxinano oluphezulu |
Kwiinkqubo ze-ICONN series okanye ze-ICONN PLUS, ukufumaneka komatshini kunye noqwalaselo kuxhomekeke kwimbali yemveliso, ukuseta izixhobo, kunye neziphumo zokuhlolwa.
Fumana iimpendulo kwimibuzo eqhelekileyo malunga neenkqubo ze-K&S ICONN kunye ne-ICONN PLUS zokubopha iingcingo ezisetyenziswa kwimveliso ye-semiconductor.
Isetyenziswa kwiphakheji ye-semiconductor ukudala unxibelelwano lombane phakathi kweetships ze-silicon kunye ne-package substrates ngokusebenzisa uqhagamshelo lwentambo encinci.
Ukubopha ngentambo yinkqubo yokudibanisa engundoqo esebenzisa ucingo lwesinyithi esincinci ukuqhagamshela ii-semiconductor dies kwi-external circuitry kwi-IC packaging.
I-ICONN yenzelwe usetyenziso oluqhelekileyo lwe-semiconductor bonding, ngelixa i-ICONN PLUS ixhasa iinkqubo zokupakisha ezichanekileyo neziphucukileyo.
Zisetyenziswa kakhulu kwimveliso ye-semiconductor, kwi-elektroniki yeemoto, kwimveliso ye-LED, kwizixhobo ze-sensor, nakwi-microelectronics packaging.
Oomatshini bokubopha iingcingo be-K&S bahlala bexhasa iingcingo zegolide, iingcingo zobhedu, kunye neengcingo ze-aluminiyam kuxhomekeke kwindlela yokumisela inkqubo kunye neemfuno zemveliso.
Ewe. I-ICONN PLUS yenzelwe ukusebenza ngokuzenzekelayo okuzinzileyo kwiindawo zemveliso ye-semiconductor ezifuna ukwenziwa rhoqo kunye nokubophelela ngokuchanekileyo.
Ewe. Iimodeli eziphambili ezifana ne-ICONN PLUS zihlala zisetyenziswa kwizicelo zokupakisha ze-IC ezithambileyo nezixineneyo.
Izinto eziphambili ziquka imeko yomatshini, imeko yentloko yokubopha, uqwalaselo lwesoftware, imbali yemveliso, kunye nokuhambelana nenkqubo yakho ye-semiconductor.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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