Ibhondi yentambo ye-K&S ICONN

Uthotho lwe-ICONN oluvela kwi-K&S (Kulicke & Soffa) ludidi oluvuthiweyo, oluqinisekisiweyo kwimarike oluzenzekelayo olupheleleyo olwalukhe lwasebenza njengemveliso yokulinganisa kushishino lokupakisha lwe-semiconductor—ingakumbi kwicandelo lememori, indawo yokugcina, kunye ne-LED. Nangona iqonga layo eliphambili lilandelwe ziimodeli ezintsha, isiseko sayo esikhulu esifakiweyo kunye neenkcukacha zobugcisa ezibalaseleyo ziqinisekisa ukuba iyaqhubeka nokudlala indima ebalulekileyo kwimigca yemveliso kwihlabathi liphela.

Umgaqo-siseko oSebenzayo

I-ICONN wire bonder isebenzisa kakhulu iteknoloji ye-thermosonic ball bonding. Ngexesha lenkqubo yokubopha, ucingo lwegolide okanye lobhedu ludlula kwi-ceramic capillary; i-Electronic Flame-Off (EFO) discharge inyibilikisa incam yocingo ukuze yenze ibhola. Isebenzisa uxinzelelo kunye namandla e-ultrasonic, i-capillary ibopha le bhola kwi-chip's bond pad ngesenzo esidibeneyo sobushushu kunye ne-ultrasonics, idala uqhagamshelo oluqinileyo lombane kunye noomatshini (ibhondi yokuqala). Emva koko, i-capillary iyaphakamisa kwaye ihambe, yenze imo ethile ye-wire loop ngolawulo oluchanekileyo, ngaphambi kokuba ibophe isiphelo somsila wocingo kwi-substrate okanye kwisakhelo se-lead (ibhondi yesibini) ukuze kugqitywe inkqubo yoqhagamshelo. Iinkcukacha eziphambili ngokujonga

Oku kulandelayo sisishwankathelo seenkcukacha ezibalulekileyo zeemodeli zochungechunge lwe-ICONN, nto leyo enceda ekuthelekiseni izakhono zazo:

Uphawu IConn (Imodeli Esisiseko) IConn PLUS IConn ProCu PLUS I-IConn MEM PLUS

Ukuchaneka ±2.0 µm ±2.0 µm ±2.0 µm @ 3 sigma ±2.0 µm @ 3 sigma

Indawo yokudibanisa 56mm x 80mm 56mm x 80mm 56mm x 90mm Ayichazwanga ngqo

Intambo ehambelanayo - Igolide, iCopper Igolide, iCopper Igolide, i-alloy

I-Min. Bond Pad Pitch - 35µm 35µm -

Ubude obuncinci beLuphu <50µm Ingaphantsi kwe-50µm Ingaphantsi kwe-50µm -

Ubude beLuphu obuphezulu - 7.6mm 7.6mm -

Ubunzima bomatshini Malunga ne-566 kg Malunga ne-556 kg Malunga ne-590 kg -

Iindawo eziphambili zokusetyenziswa

Ngenxa yokuhambelana kwayo ngokubanzi kwenkqubo, uthotho lwe-ICONN luyahlangabezana neemfuno ezahlukeneyo zokupakisha iitships, kubandakanya ikakhulu:

Izixhobo zeMemori: Imodeli ye-IConn MEM PLUS yenzelwe ngokukodwa izixhobo zememori; ifanelekile kwizicelo ezintsonkothileyo zokubopha ucingo oludibeneyo olusebenzisa iingcingo zegolide neze-alloy, ezibonelela ngomgangatho ophezulu kunye nokukhupha okuphezulu.

Ukupakishwa kwe-LED: Olu luhlu lusetyenziswa kakhulu ekubopheleleni kwentambo yangaphakathi kwii-Light Emitting Diodes (ii-LED) kunye nee-transistors zamandla amancinci ukuya kwaphakathi. Ixhasa iintlobo ezahlukeneyo zefreyimu ye-lead—ezifana ne-SMD, i-LED enamandla aphezulu, kunye ne-DIP—okwenza ukuba ibe lukhetho oluqinisekisiweyo lokupakishwa kwe-LED.

Izixhobo Ezingabonakaliyo kunye neeSekethe Ezidibeneyo: Zifanelekile kwiintambo zangaphakathi zokubopha izixhobo eziqhelekileyo ezingabonakaliyo (iitransistors, njl.njl.), izixhobo zonxibelelwano lwe-optical, kunye nezixhobo ezikhethekileyo ze-semiconductor.

Ukupakisha Okuphambili: Kufanelekile kwi-ultra-fine pitch, i-ultra-low loop, i-stacked-die, i-Low-k dielectric material, kunye nezicelo zokupakisha ezineeleya ezininzi; iyakwazi ukujongana nemingeni yokubopha ucingo lwe-copper kwii-wafers ezinee-node eziphambili (28nm nangaphantsi). Iimpawu eziphambili kunye neeTekhnoloji eziphambili

Uthotho lwe-ICONN lufikelele kwinqanaba eliphambili ngenxa yetekhnoloji kunye noyilo olutsha oluninzi:

Ubuchule obuZinzileyo kunye noMgangatho: Le nkqubo inika ukuchaneka okubanzi kwe-±2.0 µm @ 3 sigma, ihlangabezana rhoqo neemfuno zee-pitch pads ezicolekileyo kakhulu (35 µm).

Amandla okuGqibela nokuLungelelanisa okuBalaseleyo: Ibonelela ngeentlobo ze-wire loop ezingaphezu kwama-50 ukuze zikwazi ukusingatha iinkqubo ezahlukeneyo ngendlela eguquguqukayo. Iimpawu eziphambili ziquka:

Iseti yeLoop eQhelekileyo: Ibandakanya iiloops ezisisiseko ezifana neStandard, Original, kunye ne-J-Wire, ezifanelekileyo kwizicelo zesiqhelo ze-short-loop.

I-ProLoop Advanced Looping: Iimpawu ezifana ne-K-Loop zivumela ulawulo oluchanekileyo kwiimilo ze-loop ngokulungiswa kwe-multi-segment.

Itekhnoloji yePower Series Low-Loop: Ifikelela kwiiluphu eziphambili ezingaphantsi kwe-50 µm, nto leyo ibalulekileyo ekupakishweni okuncinci.

Iteknoloji yokuBopha iiNtambo zeCopper ePhambili: Imodeli ye-IConn ProCu PLUS isebenzisa inkqubo yeProCu5; ngenkqubo yokuhanjiswa kwegesi ephuculiweyo kunye nolawulo lwegesi olucwangcisiweyo, iphucula ukudlula kunye nokukhupha kweentambo zecopper ngelixa igcina uzinzo.

Ubukrelekrele beNkqubo eSebenza kakuhle kakhulu:

I-Automatic BITS (Inkqubo yoVavanyo lwe-Bond Integrity): Ixhotyiswe nge-automatic BITS enokuchaneka kwe-1 pF, inkqubo ifunda ngokuzimeleyo kwaye iphucule iiparameter ukuqinisekisa umgangatho wokubopha othembekileyo nozinzileyo.

Inkqubo yokukhanyisa ye-WAVI: Ibonisa i-WAVI (i-Wide Angle Vertical Illumination); ukulungiswa kwezibane ezibomvu neziluhlaza okwesibhakabhaka ezinokucwangciswa kuphucula kakhulu ukuqondwa komfanekiso kunye nokuchaneka kokulungelelaniswa kwezinto ezintsonkothileyo.

UkuSebenza Nokugcinwa Komsebenzi: Ixhotyiswe ngesibonisi se-LCD esinombala we-intshi ezili-17 kunye ne-interface yomsebenzisi eqhelekileyo ye-K&S, eqinisekisa i-curve yokufunda emfutshane. Kwiinjineli ezinamava, ukutshintsha iingcingo kuthatha ngaphantsi kwemizuzu emi-4, kwaye ukutshintsha imveliso (ukutshintsha phakathi kwamanani ahlukeneyo eenxalenye) kuthatha ngaphantsi kwemizuzu esi-8, nto leyo ephucula kakhulu ukusetyenziswa kwezixhobo.

Ingcebiso yokubekwa kweMarike kunye nokuThengwa

Indawo yeMarike: Ngaphakathi kwipotifoliyo yemveliso ye-K&S, uthotho lwe-ICONN lubekwe ngokucacileyo njengeqonga lemveliso yobuninzi eliphakathi ukuya kwelona liphezulu. I-IConn esemgangathweni kunye ne-IConn PLUS ephuculweyo zisebenza njengeemodeli ezivuthiweyo neziphambili; zisebenzisa ubuchwepheshe obuthembekileyo kunye nomphumo ozinzileyo, ziyaqhubeka nokubonelela ngexabiso kwiimarike zokuvelisa ubuninzi ezikumgangatho ophakathi kwaye zikhethe iimarike zokuvelisa ubuninzi ezikumgangatho ophezulu. Okwangoku, iimodeli ezifana ne-ICOnn ProCu PLUS kunye ne-ICOnn MEM PLUS ziqinisa ubukho benkampani kwiindawo ezikhethekileyo zodidi oluphezulu, kubandakanya ukubopha ucingo lwekopolo kunye nokupakisha imemori okuphambili.

Ukuma kweShishini: Ngenxa yozinzo lwayo olumangalisayo, i-K&S inesabelo esiphambili kwimarike kwicandelo leebhondi zebhola eziphezulu kwilizwekazi laseTshayina—ingakumbi kwimarike yememori, apho inesabelo se-70%–80%. Ubuchule bayo obukhulu bobuchwephesha kunye nesiseko sayo esikhulu esifakiweyo sibonelela ngesiseko esiqinileyo sokugcinwa kwezixhobo kunye nemarike yesibini.

IMarike yesiBini: Uthotho lwe-ICONN lusebenza kakhulu kwimarike yesiBini; iimodeli ezifana ne-ICOnn PLUS—xa zikwimeko entle—zimele ukhetho olusebenzayo lwezixhobo zokupakisha ezifuna ukwandisa umthamo okanye ukutshintsha izixhobo ezindala. Nangona amaqonga afana ne-Moov kunye ne-CAE Online eluncedo ekufumaneni izixhobo, kuyacetyiswa kakhulu ukuba uqeshe iarhente yohlolo yochwephesha yangaphandle ukuze yenze uvavanyo olupheleleyo lwezixhobo.

Ukuba unomdla kwiiparameter ezithile zenkqubo yochungechunge lwe-ICONN kwizicelo ezithile (ezifana nokupakishwa kwe-LED okanye ukuqiniswa kwe-memory chip) okanye uthelekiso nezinye iimodeli, singakuhlola oku ngakumbi.