SAKI smt 2D aoi ekyuma ekikebera amaaso mu ngeri ey’otoma BF-10D

SAKI BF-10D ye kyuma ekikebera amaaso mu ngeri ya 2D automatic optical optical inspection equipment (AOI) ekyatongozebwa SAKI eya Japan, ekyakolebwa ku PCB ezituufu ennyo (nga IC substrate, FPC, high-density HDI board). Ebintu byayo ebikulu bye bino: 10μm detection resolution ne multi-spectral collaborative lighting system, esobola okugumira ebyetaago ebizibu eby’okuzuula obulema eby’ebitundu ebitonotono (nga 01005, 008004) n’ebiyungo bya solder ebitangaaza ennyo.

2. Omusingi gw’okukola

2.1 Enkola y’okukuba ebifaananyi mu maaso

Bright Field (bright field) tekinologiya ow’ensibuko z’ekitangaala ekingi:

Adopt 8-directional programmable LED array (red/green/blue/white/infrared combination), okuyita mu mpisa z’okutunula ez’obuwanvu bw’amayengo ag’enjawulo ag’ensibuko z’ekitangaala, okwongera ku njawulo wakati w’ebiyungo bya solder ne substrates.

Coaxial optical path design: okumalawo okutaataaganyizibwa kw’ekitangaala ekiri mu kifo n’okukakasa nti ekifaananyi kinywevu.

Kkamera ya layini ya sikaani ey’obulungi obw’amaanyi:

Nga eriko kkamera ey’omutindo gw’amakolero eya 10μm/pixel (optional 5μm/pixel), sikaani emu ekwata ekifo ekinene eky’okulaba (FOV), ng’etunuulidde obutuufu n’obulungi.

2.2 Ensonga y’okuzuula obulema

Enkola y’okuzuula ey’emitendera esatu:

Okukwatagana kwa geometry: Geraageranya okukyama kw’ekifo ky’ekitundu ne contour ne template eya standard (nga offset ne rotation).

Okwekenenya enzirugavu: Laba ebiyungo bya solda ebinyogovu, emipiira gya solda, ebibanda n’ebirala ng’oyita mu kugabanya okwaka kw’ebiyungo bya solda.

AI classifier: Okugabanya ebikyamu nga kwesigamiziddwa ku kuyiga okw’amaanyi (nga enjawulo wakati w’okugwa kw’omupiira gwa BGA solder n’okunyigirizibwa okwa bulijjo).

3. Okukola dizayini ya Hardware

3.1 Ensengeka y’ebyuma

Omusingi gwa marble + motor ya linear:

Zero thermal deformation base okukakasa okutebenkera okw’ekiseera ekiwanvu (ebbugumu okuwuguka <±2μm/°C).

Linear motor drive, scanning speed esobola okutuuka ku 500mm/s, era okuddiŋŋana positioning accuracy eri ±3μm.

Olukungaana lw’ensibuko y’ekitangaala mu modulo:

Awagira okukyusa amangu modulo za LED okutuukagana ne solders ez’enjawulo (nga SAC305 etaliimu lead yeetaaga infrared auxiliary detection).

3.2 Ebitundu ebikulu

Ebitundu Ebikwata ku Mulimu

Kkamera enkulu 10μm/pixel CMOS linear array (12k pixels) Okufuna ebifaananyi mu ngeri entuufu ennyo

Kkamera eyamba 20μm/pixel global shutter array Funa mangu ekifo akabonero

Omufuzi w’ensibuko y’ekitangaala Ennongoosereza ya PWM eyeetongodde ey’emikutu 16 Okufuga okw’amaanyi okw’amaanyi g’ekitangaala/enkoona

4. Emirimu gya pulogulaamu

4.1 Omulimu gw’okuzuula

Okuzuula ensonga ya solder:

SMT solder point: Laba ebifo bya BGA (omuwendo gw’okuzuula>99%), ekifo kya solder ku ludda lwa QFN nga kiriko bbaati entono.

Through-hole solder point: Okwekenenya omutindo gw’okuyingira kwa bbaati (okuwagira enkola ya X-ray data fusion).

Okuzuula ebitundu:

01005 ekitundu ejjinja ly’entaana, side flip, reverse polarity.

Connector pin coplanarity (okukoppa obuwanvu okuyita mu kifaananyi kya 2D).

4.2 Obuyambi obw’amagezi

SPI linkage: Okukwatagana mu ngeri ey’otoma data y’okukuba solder paste era n’okulagula ebiyinza okubaawo obulema (nga solder paste obutamala ekivaako soldering ennyogovu).

Etterekero ly’okugabanya NG: emitendera gy’obulema obw’ennono (Critical/Major/Minor), egyatuukagana n’omutindo gwa bakasitoma ogw’enjawulo.

5. Ebipimo by’enkola y’emirimu

Ebipimo by’Ekika

Sayizi ya PCB Ekitono ennyo 50mm×50mm, ekisinga obunene 600mm×500mm (eyinza okugaziwa)

Sipiidi y'okuzuula 0.15 ~ 0.3 sekondi / ekifo ky'okuzuula (okusinziira ku buzibu)

Ekitundu ekitono ennyo 008004 (0.25mm×0.125mm)

Enkola y’empuliziganya SECS/GEM, OPC UA, Modbus TCP

Amaanyi geetaagisa AC 200V±10%, 50/60Hz, amaanyi agakozesebwa ≤2kW

6. Okukozesa amakolero

6.1 Ensonga eya bulijjo

IC substrate: Okuzuula copper foil residual glue n’okukula obubi kwa micro-pitch pads (≤50μm).

Flexible circuit (FPC): Okukutuka kwa solder mu kifo ekibeebalama (ekikwatibwa ensibuko y’ekitangaala eky’enkoona nnyingi).

Ebyuma ebikozesebwa mu mmotoka: Okugezesa obwesigwa okutuukana n’omutindo gwa AEC-Q100 (nga enjatika za solder ez’ebbugumu eringi).

6.2 Emisango gya Bakasitoma

Omukozi wa semiconductor omukulu: akozesebwa okuzuula obulema mu 2.5D packaging interposer, nga alamu ey’obulimba eri <0.05%.

Abakulembedde mu kukola amasimu: Folding screen motherboard FPC detection, okukyusa 3D AOI solution eyasooka okukendeeza ku nsaasaanya ebitundu 30%.

7. Enkizo mu kuvuganya

Precision okumenya level y’emu: 10μm resolution ekulembera akatale mainstream 20μm ebyuma (nga Omron VT-S730).

Okukyukakyuka kw’ensibuko y’ekitangaala: Okugatta kwa multi-spectral kugonjoola ekizibu ky’okukwatagana kw’ebiyungo bya solder ebitangaaza ennyo/matte.

Open API: Okuwagira enkulaakulana ya kasitoma ey’okubiri n’ensonga y’okuzuula erongooseddwa.

8. Okugeraageranya ebifo eby’okulongoosa ebya BF-Tristar2

Erimu ennyonyi ekika kya BF-10D BF-Tristar2

Okusalawo 10μm (okusalawo 5μm) 10μm

Ekitundu ekitono ennyo 008004 01005

Ensibuko y’ekitangaala omukutu 16 emikutu programmable 8 channels fixed

Enkolagana ya data OPC UA (Ekwatagana ne Industry 4.0) SECS/GEM

9. Mu bufunze

SAKI BF-10D efuuse ekyuma kya 2D AOI eky'omutindo mu kisaawe ky'okupakinga PCB ez'omulembe ne semiconductor n'omugatte gwa tekinologiya gwayo ogwa "ultra-precision optics + multi-spectral collaboration + AI closed loop", naddala ogusaanira embeera z'amakolero ez'omulembe ezigoberera zero defects ppm.