SAKI smt 2D aoi zodziwikiratu kuwala koyendera makina BF-10D

SAKI BF-10D ndi chipangizo chapamwamba kwambiri cha 2D automatic Optical inspection equipment (AOI) chokhazikitsidwa ndi SAKI waku Japan, chopangidwira PCB yolondola kwambiri (monga IC substrate, FPC, HDI board). Mawonekedwe ake apakati ndi mawonekedwe a 10μm kuzindikira ndi njira yowunikira yolumikizana ndi ma spectral angapo, yomwe imatha kuthana ndi zovuta zowunikira zovuta zamagulu ang'onoang'ono (monga 01005, 008004) ndi ma solder owunikira kwambiri.

2. Mfundo yogwira ntchito

2.1 Optical imaging system

Bright Field (gawo lowala) ukadaulo wopangira magetsi ambiri:

Adopt 8-directional programmable gulu la LED (wofiira/wobiriwira/buluu/woyera/wosakanikirana ndi infrared), kudzera m'mawonekedwe a kutalika kosiyanasiyana kwa magwero a kuwala, kumawonjezera kusiyana pakati pa zolumikizira zogulitsira ndi magawo.

Mapangidwe a Coaxial Optical path: Chotsani kusokoneza kwa kuwala kozungulira ndikuwonetsetsa kukhazikika kwa chithunzi.

Kamera yojambulira mzere wapamwamba kwambiri:

Zokhala ndi kamera ya 10μm/pixel ya kalasi ya mafakitale (posankha 5μm/pixel), sikani imodzi imakhala ndi mawonekedwe okulirapo (FOV), poganizira kulondola komanso kuchita bwino.

2.2 Kuzindikira zolakwika

Algorithm yozindikira magawo atatu:

Kufananitsa ndi geometric: Fananizani kupatuka kwa malo ndi mizere ndi template yokhazikika (monga kuchotsera ndi kuzungulira).

Kusanthula kwa Grayscale: Dziwani zolumikizira zoziziritsa kukhosi, mipira yogulitsira, milatho, ndi zina zambiri.

Gulu la AI: Gulu lachilema potengera kuphunzira mozama (monga kusiyana pakati pa kugwa kwa mpira wa solder wa BGA ndi kukhumudwa kwanthawi zonse).

3. Mapangidwe a hardware

3.1 Kapangidwe ka makina

Marble base + liniya mota:

Zero matenthedwe mapindikidwe maziko kuonetsetsa kukhazikika kwa nthawi yayitali (kutentha kosunthika <± 2μm/℃).

Liniya galimoto pagalimoto, kupanga sikani liwiro akhoza kufika 500mm/s, ndi mobwerezabwereza malo olondola ndi ± 3μm.

Modular source source assembly:

Imathandizira kusinthika mwachangu kwa ma module a LED kuti agwirizane ndi ma solders osiyanasiyana (monga SAC305 yopanda lead imafuna kuzindikira kwa infrared).

3.2 Zigawo zazikulu

Mfundo Zazigawo Ntchito

Kamera yayikulu 10μm/pixel CMOS linear arraya (12k pixels) Kupeza zithunzi zolondola kwambiri

Makamera othandizira 20μm/pixel global shutter array Pezani mwachangu polowera

Wowongolera gwero lowunikira 16-channel yodziyimira payokha PWM Kusintha Kuwongolera kwamphamvu kwakuya kwambiri / ngodya

4. Ntchito zamapulogalamu

4.1 Ntchito yozindikira

Kuzindikira malo a solder:

SMT solder point: Dziwani BGA voids (kuzindikira> 99%), QFN mbali solder point yokhala ndi malata ochepa.

Kupyolera mu dzenje la solder: Kusanthula kwa matani olowera (thandizo la X-ray data fusion njira).

Kuzindikira zinthu:

01005 gawo tombstone, mbali flip, reverse polarity.

Connector pin coplanarity (yerekezerani kutalika ndi chithunzi cha 2D).

4.2 Thandizo lanzeru

Kulumikizana kwa SPI: Gwirizanitsani zokha data yosindikiza ya solder ndikudziwiratu zolakwika zomwe zingachitike (monga phala losakwanira lomwe limatsogolera ku soldering yozizira).

Laibulale yamagulu a NG: milingo yachilema (Yovuta / Yaikulu / Yaing'ono), yosinthidwa malinga ndi miyezo yosiyanasiyana yamakasitomala.

5. Magawo a magwiridwe antchito

Magawo a Gulu

PCB kukula Osachepera 50mm×50mm, pazipita 600mm×500mm (expandable)

Kuthamanga kwa 0.15 ~ 0.3 masekondi / malo ozindikira (malingana ndi zovuta)

Gawo locheperako 008004 (0.25mm×0.125mm)

Kulumikizana protocol SECS/GEM, OPC UA, Modbus TCP

Mphamvu zofunika AC 200V ± 10%, 50/60Hz, kugwiritsa ntchito mphamvu ≤2kW

6. Kugwiritsa ntchito mafakitale

6.1 Zochitika zenizeni

Gawo laling'ono la IC: Kuzindikirika kwa guluu wamkuwa wotsalira wa zojambulazo komanso kusakula bwino kwa ma micro-pitch pads (≤50μm).

Flexible circuit (FPC): Solder cracking m'dera lopindika (lotengedwa ndi gwero la kuwala kosiyanasiyana).

Zamagetsi zamagalimoto: Kuyezetsa kudalirika komwe kumakwaniritsa miyezo ya AEC-Q100 (monga ming'alu ya solder yotentha kwambiri).

6.2 Milandu Yamakasitomala

Wopanga semiconductor wamkulu: wogwiritsidwa ntchito pozindikira chilema cha 2.5D chophatikizira chophatikizira, chokhala ndi ma alarm abodza <0.05%.

Otsogola opanga mafoni a m'manja: Pindani sikirini ya FPC kuzindikira, m'malo mwa njira yoyambirira ya 3D AOI kuti muchepetse mtengo ndi 30%.

7. Ubwino wampikisano

Mwatsatanetsatane kuphwanya mlingo womwewo: 10μm kusamvana amatsogolera msika waukulu 20μm zipangizo (monga Omron VT-S730).

Kusinthasintha kochokera ku kuwala: Kuphatikizika kwamitundu yambiri kumathetsa vuto lolumikizana ndi zolumikizira zazikulu zowunikira / matte solder.

Open API: Thandizani chitukuko chachiwiri chamakasitomala ndi malingaliro ozindikira omwe mwasintha.

8. Kuyerekeza kwa mfundo zowonjezera za BF-TristarⅡ

Zomwe zili ndi BF-10D BF-TristarⅡ

Kusamvana 10μm (ngati mukufuna 5μm) 10μm

Gawo locheperako 008004 01005

Kuwala kochokera njira 16 njira 8 zokhazikika

Mawonekedwe a data OPC UA (Industry 4.0 yogwirizana) SECS/GEM

9. Mwachidule

SAKI BF-10D yakhala zida zoyeserera za 2D AOI m'munda wa PCB wapamwamba kwambiri ndi semiconductor package yokhala ndi "ultra-precision optics + multi-spectral Cooperation + AI closed loop" kuphatikiza ukadaulo, makamaka koyenera pazopanga zapamwamba zomwe zimatsata ziro zolakwika ppm.