I-SAKI smt 2D aoi umatshini wokuhlola ozenzekelayo we-BF-10D

I-SAKI BF-10D yi-2D ephezulu echanekileyo yokuhlola izixhobo zokuhlola okuzenzekelayo (i-AOI) eyasungulwa ngu-SAKI waseJapan, eyenzelwe i-PCB ye-ultra-precision (njenge-IC substrate, i-FPC, ibhodi ye-HDI ephezulu). Iimpawu zayo eziphambili ziyi-10μm yokubona isisombululo kunye nenkqubo yokukhanyisa edibeneyo ye-spectral, ekwazi ukujamelana neemfuno eziyinkimbinkimbi zokufumanisa isiphene samacandelo amancinci (afana ne-01005, 008004) kunye ne-solder joints.

2. Umgaqo wokusebenza

2.1 Inkqubo yokujonga umfanekiso

Ummandla oqaqambileyo (indawo eqaqambileyo) itekhnoloji yomthombo wokukhanya okuninzi:

Yamkela i-8-directional programmable uluhlu lwe-LED (obomvu / oluhlaza / oluhlaza okwesibhakabhaka / omhlophe / infrared indibaniselwano), ngokusebenzisa iimpawu zokubonakaliswa kwamaza ahlukeneyo okukhanya kwemithombo yokukhanya, ukunyusa umahluko phakathi kwe-solder joints kunye ne-substrates.

Uyilo lwendlela ye-coaxial optical: phelisa ukuphazamiseka kokukhanya kwendawo kunye nokuqinisekisa ukuzinza komfanekiso.

Ikhamera yokuskena umgca wesisombululo esiphezulu:

Ixhotyiswe nge-10μm / i-pixel yekhamera ye-industrial-grade (ukhetho lwe-5μm / i-pixel), i-scan enye igubungela indawo enkulu yokujonga (FOV), kuthathelwa ingqalelo zombini ukuchaneka kunye nokusebenza kakuhle.

2.2 Ingqiqo yokubona isiphene

I-algorithm yokufumanisa imigangatho emithathu:

Ungqamaniso lwejiyometri: Thelekisa ukutenxa kweendawo zecandelo kunye nekhontowuni kunye nethempleyithi eqhelekileyo (efana ne-offset kunye nokujikeleza).

Uhlalutyo lwe-Grayscale: Chonga i-solder joints, iibhola ze-solder, iibhulorho, njl.

Ukuhlelwa kwe-AI: Ukuhlelwa kwesiphene ngokusekelwe kufundo olunzulu (njengokwahlula phakathi kweBGA yebhola ye-solder yokuwa kunye nokudakumba okuqhelekileyo).

3. Uyilo lwezixhobo zokusebenza

3.1 Ubume boomatshini

Isiseko semarble + motor linear:

Isiseko se-thermal deformation ye-Zero ukuqinisekisa uzinzo lwexesha elide (ubushushu bokufudumala <± 2μm/℃).

I-Linear motor drive, isantya sokuskena sinokufikelela kwi-500mm / s, kunye nokuphindaphinda ukuchaneka kokubeka ± 3μm.

Imodyuli yomthombo wokukhanya:

Ixhasa ukutshintshwa ngokukhawuleza kweemodyuli ze-LED ukulungelelanisa kwii-solders ezahlukeneyo (ezifana ne-SAC305 ezingenalo i-lead-free zifuna ukufunyanwa kwe-infrared encedisayo).

3.2 Amacandelo angundoqo

IiNkcazo zeMicimbi iFunction

Ikhamera engundoqo 10μm/pixel CMOS emgceni uluhlu (12k pixels) Ukufunyanwa komfanekiso ochanekileyo

Ikhamera encedisayo 20μm/pixel isivalo sehlabathi jikelele ngokukhawuleza Fumana indawo ephawulweyo

Isilawuli somthombo wokukhanya I-16-channel ezimeleyo yohlengahlengiso lwe-PWM Ulawulo olunamandla lokukhanya kokukhanya / i-engile

4. Imisebenzi yeSoftware

4.1 Umsebenzi wokukhangela

Ukubonwa kwendawo yesolder:

Indawo ye-solder ye-SMT: Chonga i-voids ye-BGA (izinga lokubona> 99%), indawo ye-solder ye-QFN ene-tin encinci.

Inqaku le-solder nge-hole: Uhlalutyo lwezinga lokungena kwe-tin (inkxaso ye-X-ray data fusion ukhetho).

Ukufunyanwa kwelungu:

Ilitye lengcwaba lecandelo le-01005, i-side flip, i-polarity ebuyela umva.

Isiqhagamshelo se-pin coplanarity (linganisa ubude ngomfanekiso we-2D).

4.2 Uncedo olunengqondo

Unxibelelwano lwe-SPI: Tshatisa ngokuzenzekelayo idatha yokuprinta ye-solder kwaye uqikelele iziphene ezinokubakho (ezifana nokungonelanga kwe-solder paste ekhokelela kwi-solder ebandayo).

Ilayibrari yokuhlelwa kwe-NG: amanqanaba esiphako sesiko (I-Critical / Major / Minor), iguqulelwe kwimigangatho eyahlukeneyo yabathengi.

5. Iiparamitha zokusebenza

Iiparamitha zodidi

PCB ubukhulu Ubuncinane 50mm×50mm, ubuninzi 600mm×500mm (yandiswa)

Isantya sokubona 0.15 ~ 0.3 imizuzwana / indawo yokubona (kuxhomekeke kubunzima)

Ubuncinci becandelo 008004 (0.25mm×0.125mm)

Iprothokholi yonxibelelwano SECS/GEM, OPC UA, Modbus TCP

Imfuno yamandla AC 200V±10%, 50/60Hz, ukusetyenziswa kwamandla ≤2kW

6. Isicelo soshishino

6.1 Imeko eqhelekileyo

I-IC substrate: Ukufunyanwa kweglue ye-foil yobhedu kunye nophuhliso olubi lwe-micro-pitch pads (≤50μm).

I-Flexible circuit (FPC): Ukuqhekeka kwe-Solder kwindawo yokugoba (ibanjwe ngumthombo wokukhanya we-multi-angle).

I-Automotive electronics: Ukuvavanya ukuthembeka okuhlangabezana nemigangatho ye-AEC-Q100 (efana nokuqhekeka kwe-solder ephezulu yobushushu).

6.2 Amatyala oMthengi

Umenzi omkhulu we-semiconductor: esetyenziselwa ukufumanisa i-defect ye-2.5D yokupakisha i-interposer, kunye nesantya se-alarm yobuxoki <0.05%.

Abavelisi befowuni abahamba phambili: Ukusonga isikrini se-motherboard FPC ukubonwa, ukubuyisela isisombululo se-3D AOI sokuqala ukunciphisa iindleko nge-30%.

7. Iinzuzo zokhuphiswano

Ukuchaneka ukutyumza kwinqanaba elifanayo: isisombululo se-10μm sikhokelela kwiimarike eziqhelekileyo ze-20μm izixhobo (ezifana ne-Omron VT-S730).

Ukuguquguquka komthombo wokukhanya: Ukudityaniswa kwe-multi-spectral kusombulula ingxaki yokuhambelana kwe-high reflective / matte solder joints.

Vula i-API: Ukuxhasa uphuhliso lwesibini lwabathengi kunye nengqiqo yokufumanisa ngokwezifiso.

8. Ukuthelekiswa kwamanqaku okuphucula i-BF-TristarⅡ

Iimpawu ze-BF-10D BF-TristarⅡ

Isisombululo 10μm (ukhetho 5μm) 10μm

Ubuncinane becandelo 008004 01005

Itshaneli yomthombo wokukhanya Iitshaneli ezili-16 ezinokucwangciselwa amajelo asi-8 azinzileyo

I-data interface OPC UA (Industry 4.0 ehambelanayo) SECS/GEM

9. Isishwankathelo

I-SAKI BF-10D iye yaba yi-benchmark yesixhobo se-2D AOI kwinkalo ye-PCB ephezulu kunye ne-semiconductor epakishwayo kunye ne-"ultra-precision optics + intsebenziswano ye-multi-spectral + i-AI evaliweyo ye-loop" indibaniselwano yetekhnoloji, ngakumbi ilungele iimeko zokuvelisa eziphambili ezilandela i-zero defects ppm.