Ekyuma ekibumba ekya Towa CPM1180

Ensengeka y’omusingi gwa Towa CPM1180 etegeerekeka bulungi: nkola ya compression molding eyakolebwa yinginiya mu ngeri ey’enjawulo okukola ebintu ebinene ebya Panel-Level Packages (PLP). Ekigendererwa kyayo ekikulu eky'okukola dizayini kwe kugonjoola okusoomoozebwa okukulu mu makolero mu kitongole ky'okupakinga eby'omulembe: "engeri y'okupakinga ebikozesebwa ebinene mu ngeri ennungi era etali ya ssente nnyingi."

**CPM1180: Emisingi gy'ebyekikugu n'ensengeka**

Ku mutima gwa CPM1180 kwe kuli tekinologiya wa Compression Molding —enkola eyawukana ennyo ku nkola ya Injection Molding eyakozesebwa mu Y-series eyayogerwako emabegako:

**Compression Molding:** Mu nkola eno, resin ey’amazzi oba eya granular esooka kuteekebwa mu kisenge ky’ekibumbe; oluvannyuma ebitundutundu oba substrate binnyikibwa mu resin, ne binyigirizibwa wansi, ne biwona. Enkola eno eraga ebirungi naddala ebirabika ng’ebipimo by’ekipapula byeyongera, okukuuma obulungi waya za zaabu enzirugavu n’okukakasa nti ziteekebwamu obuziba obutaliimu.

**Key Structural Design:** Enkola eno ekozesa ensengekera ya "Cavity Down" eriko patent. Mu ngeri ennyangu, dizayini eno eteeka ekituli ky’ekibumbe (ekifo ekibumba) nga kitunudde wansi mu nkola y’okusiba. Ensengeka eno ekozesa bulungi amaanyi ag’ekisikirize okuyamba okutambula okuva waggulu okudda wansi okwa resin, bwe kityo n’ekakasa obumu obw’enjawulo mu kugabanya resin mu substrates ennene-obuyiiya bwa tekinologiya obukulu obwetaagisa okutuuka ku biva mu kubumba eby’omutindo ogwa waggulu.

**CPM1180: Ebikulu Ebikulu mu Mirimu**

Ekiteeso ky’omuwendo gwa CPM1180 kisinga kulagibwa okuyita mu bintu ebikulu ebiwerako, naddala obusobozi bwayo obw’okumenya ettaka ku bikwata ku bipimo bya panel n’okuyita mu kukola.

**Obusobozi bw'okupakinga mu ngeri ennene ennyo (Core Advantage):** Kino kye kikola ekintu ekisinga okumanyika mu CPM1180. Enkola eno ewagira enkola ya automated substrate processing okutuuka ku sayizi esinga obunene eya 625mm x 620mm. Obusobozi buno tebukoma ku kusukka nnyo 320mm x 320mm specifications zaayo eyasooka, CPM1080, naye era busobozesa okubumba wafers za yinsi 18 (450mm). Ekirala, mu nkola ya manual oba semi-automated, enkola eno esobola okusuza substrates ennene n’okusingawo, okutuuka ku bipimo ebituuka ku 660mm x 620mm. Nga tusiba ekitundu ekinene ekya substrate mu cycle emu —bwe kityo ne kyongera ku muwendo gwa chips ezikolebwa buli yuniti y’obudde —enkola eno etuuka ku kukendeera okw’amaanyi mu nsaasaanya ya buli chip ssekinnoomu.

**High-Precision, High-Quality Packaging:** Okuyita mu synergistic combination ya "Cavity Down" structure n'enkola y'emu granular resin dispensing, enkola etuuka ku nkulaakulana ennene mu byombi okubumba omutindo n'okutebenkera enkola.

**Modular Design:** Enkola eno erimu enzimba ya modular esobozesa okutereeza obusobozi obukyukakyuka nga bongera oba okuggyawo modulo, bwe kityo n’ewa enkyukakyuka mu nsengeka eyongezeddwa okusobola okutuukiriza ebyetaago by’okufulumya eby’enjawulo. Okufiirwa Ebintu Ebitono n’Okufulumya Ebiyonjo: Ebyuma bino bikozesa firimu ez’okwawula ezisaliddwa nga tezinnabaawo; bw’ogeraageranya n’ebintu eby’edda, dizayini eno ekekkereza ebitundu nga 25% ku bintu ebikozesebwa buli nsengekera y’okubumba era esobozesa okukola kasasiro kumpi ziro mu nkola y’okubumba, ekigifuula etali ya bulabe nnyo eri obutonde bw’ensi.

Ebikulu ebikwata ku CPM1180 Series Models

Nga omukutu gw’ebintu ebikuze, CPM1180 egaba ensengeka ez’enjawulo ezikoleddwa okutuukiriza ebyetaago bingi-okuva ku R&D n’okukola prototyping okutuuka ku kukola ebintu mu bungi mu bungi. Nkuŋŋaanyizza obusobozi obukulu obwa buli muze mu kipande kino wammanga okusobola okwanguyiza okugeraageranya okw’amangu:

Omuze gw'Ebyuma | Enkola y'okukola | Ebikulu Ebirimu | Max. Obunene bwa Substrate | Ensonga eza bulijjo ez’okukozesa

CPM1180

(Ekikola mu bujjuvu) | Mu bujjuvu Automatic | Okubumba mu ngeri ey'obwengula ku substrates ennene ennyo, enzimba ya "Cavity Down", okugabira resin mu ngeri ey'obwengula | 625mm x 620mm | Okufulumya mu bungi mu bungi okukola Panel-Level Packaging (PLP) .

CPM1180

(Semi-Otomatiki) | Semi-Otomatiki | Okubumba ku substrates ennene ennyo, okukendeeza ku nsaasaanya ey’enkyukakyuka, okugabira resin mu ngeri ey’obwengula, okutikka substrate mu ngalo | 660mm x 620mm | Okufulumya ebipande ebinene mu bitundutundu, okutebenkeza okukendeeza ku nsaasaanya n’okukyukakyuka mu mirimu

CPM1180

(Ekitabo ky’Ekitabo) | Ekitabo ekiyitibwa Manual | Obusobozi obw’ebigendererwa bibiri (wafer/panel ennene), okukendeeza ku nsimbi ez’enjawulo, okufulumya okutabula ennyo/obunene obutono, okutikka mu ngalo ku substrates zombi ne wafers | 625mm x 620mm (Ekipande) / .

φ450mm (Wafer) | Okubumba wafers za yinsi 18, R&D prototyping, okufulumya mu bitundu ebitono

Weetegereze: "Max. Substrate Size" ewandiikiddwa mu kipande ekiikirira ebiragiro ebitongole. Enjawukana mu data ziyinza okubaawo wakati w’ebikozesebwa ebimu olw’enjawulo mu nkola ezenjawulo oba omutindo gw’okupima; n’olwekyo, ebikwata ku nsonga ezisembayo birina okukakasibwa nga bayita mu kwebuuza obutereevu.

Ensonga z’okukozesa n’Ebirungi eby’enjawulo

CPM1180 yakolebwa mu ngeri ey’enjawulo okukola ku nsonga enkulu eziruma amakolero, era omugaso gwayo gusinga kulagibwa bulungi mu mbeera ezenjawulo ez’okukozesa:

Okutunuulira okupakinga okw'omulembe oguddako: Ekyuma kino kikoleddwa okutwalibwa abakola ebikozesebwa mu kukola ebipande, ng'enkizo yaakyo enkulu eri mu busobozi bwakyo okuyamba amakolero "okutumbula tekinologiya w'okupakinga ate mu kiseera kye kimu kikendeeza ku nsaasaanya."

Okukola butereevu ku kusoomoozebwa kw’okupakinga: Mu nkola z’okupakinga mu kitundu ekinene, substrates —nga abatwala mu ngeri ennene eya FOWLP (Fan-Out Wafer-Level Packaging) oba PLP —batera okugwa. Okutikka ebintu mu ngalo mulimu muzibu nnyo; wabula, enkola ya CPM1180 ekola mu bujjuvu etuuka ku kukwata ebintu okunywevu, okw’otoma okuyita mu nkola ya roboti ey’obwannannyini ey’amaanyi, ey’obugumu ennyo —obusobozi obukola ng’ekisumuluzo ky’okugonjoola ebizibu ebikulu mu kukola ebintu mu bungi.

Amakungula ge bulamu: ekitundu ky’okupakinga bwe kigaziwa, obuzibu bw’okuddukanya amakungula bweyongera nnyo. Ensengeka ya "Cavity Down" ekakasa okujjula kwa resin okwa kimu okuyita mu substrates ennene, bwe kityo ne kiziyiza obulema obutta ng'obuziba; mu kiseera kino, dizayini ya modulo ekakasa obwesigwa bw’ebyuma mu biseera ebiwanvu nga bikola emirimu egy’amaanyi.

Okuteeka mu maaso: Okuva ku CPM1080 okutuuka ku CPM1180

Okusinziira ku ndowooza y'omuddiring'anwa gw'ebintu, CPM1180 esobola okutunuulirwa nga "nkyukakyuka ennene" eya CPM1080, ng'esitula omulimu omukulu ogw'okusobozesa okufulumya mu bungi Panel-Level Packages (PLP) mu kiraasi ya 625mm x 620mm. Okujjuliza kino, CPM series era erimu "CPM1080-HP" ku mutindo ogwa waggulu-model eyakolebwa yinginiya mu ngeri ey'enjawulo okukola ku byetaago bya tekinologiya ow'omulembe ow'okupakinga eby'okugatta eby'enjawulo, nga HBM, 2.5D, 3D, ne Chiplets.

N’olwekyo, eri Towa, enteekateeka y’okuteekebwa mu kifo kya CPM1180 eyawukana nnyo ku ya CPM1080-HP: eyookubiri yeewaddeyo okuvvuunuka ebizibu eby’ekikugu ebikwata ku butuufu ebikwatagana ne tekinologiya ow’ensalo nga Chiplets, so nga CPM1180 essira erisinga kulissa ku kusobozesa okukola ebintu ebinene, ebitali bya ssente nnyingi mu kitundu kya PLP.

Okubumbako

Mu kumaliriza, Towa CPM1180 nkola ya compression molding eyakolebwa mu ngeri ey’enjawulo okusobola okufulumya mu bungi ku mutendera gwa Panel-Level Packages (PLP) ennene. Okuyita mu mpagi za tekinologiya ssatu enkulu —obusobozi bw’okupakinga ebintu ebinene ennyo (ultra-large substrate packaging), ensengeka ya Cavity Down, n’okugaba resin mu ngeri ey’enjawulo —kigonjoola bulungi okusoomoozebwa kw’obulungi, omutindo, n’amakungula okuzaalibwa mu kupakinga mu ngeri ennene.