Ekyuma Ekibumba Towa CPM1080

Towa CPM1080 nkola ya compression molding system ey'okupakinga semiconductor ey'omulembe, etenderezebwa nga solution empya ku "high precision and high productivity in WLP/PLP molding processes."

Tekinologiya waayo omukulu, "compression molding," mu bukulu yawukana ku "transfer molding" ey'ennono: Compression molding erimu okuteeka amazzi oba granular resin mu mould, olwo n'onnyika chip oba substrate mu resin n'oginyiga n'okugiwonya.

Ebirungi: Ekuuma bulungi waya za zaabu, ejjuza wansi, yeewala ebituli, era ekekkereza ssente.

CPM1080 ye nkola erimu emitendera egy’enjawulo egy’okukola otoma okusobola okutuukana n’obwetaavu bwa bakasitoma ab’enjawulo n’emitendera gy’okufulumya. Ebika ebikulu bigeraageranyizibwa wansi: CPM1080 Series Equipment Core Specifications and Features

**Omulembe gw'ebyuma**

**Ebintu Ebikulu**

**Obusobozi bw'enkola**

**Ebikozesebwa Ebisaanira**

**Okukola mu ngeri ey'obwengula n'obusobozi**

**CPM1080-HP (Obutuufu obw'amaanyi)**

**Omulembe gwa ultra-high precision ogusaanira okupakinga okusinga okw'omulembe nga HBM/2.5D/3D/Chiplet.**

**Ekwata okubumba ebintu ebigonvu ennyo/ebinene ennyo n'okujjuza wansi mu MUF.**

**HBM, 2.5D/3D IC, Chiplet, n'ebirala eby'omulembe eby'okupakinga eby'enjawulo ebitali bimu.**

**Obuwanvu bw'ekikuta obw'enjawulo n'obuziba bwa waggulu nnyo.**

**Dizayini ya modulo esobozesa okugatta oba okuggyawo modulo mu ngeri ekyukakyuka okusobola okutuukagana n’enkyukakyuka mu busobozi.**

CPM1080 Ekola mu bujjuvu**

**Fully automated production platform esaanira omutindo ogwa waggulu, ku ssente entono PLP / WLP okubumba enkola.**

**Ebyuma ebisoose mu makolero ebikwatagana ne resin zombi ezirimu obutundutundu n'amazzi.**

**Enkola z’okufulumya ebintu ku mutendera omunene nga FOWLP (Fan-out Wafer-Level Packaging) ne PLP (Panel-Level Packaging).**

**Erimu roboti eyeekola ekwata ebintu nga esobola okukwata ebintu ebikoze ebiwuguddwa oba ebizito.**

**Erimu emirimu gy'okupima resin n'okugijjuza mu ngeri ey'otoma.**

CPM1080 Fully Automatic** Enkola ya CPM1080 semi-automatic ekuwa obusobozi okukyukakyuka mu R&D oba okufulumya mu bitundu ebitono. Kye kyuma ekisoose mu mulimu guno ekikwatagana n’ebizigo byombi ebiyitibwa granular ne liquid resins. Ewagira yinsi 12 (φ300mm) FOWLP/FIWLP ne mmita 320 x mmita 320 FOPLP/FIPLP. Substrate yeetaaga okuteekawo omukozi mu ngalo, naye resin eweebwa otomatiki.

Tekinologiya Omukulu n’Emigaso

Nga tetufuddeeyo ku mulembe gwalondeddwa, CPM1080 egabana ebirungi bino wammanga ebikulu mu tekinologiya:

Tekinologiya ow’omulembe ow’okubumba okunyigiriza: Kumpi amalawo okusenya waya n’ebiwujjo eby’omunda, ekikulu ennyo mu kuyungibwa okw’amaloboozi amalungi n’aga density enkulu. Bw'ogeraageranya n'okubumba okw'ennono okw'okukyusa, kutuuka ku kumpi 100% okukozesa resin, okusobozesa okufulumya "zero-waste".

Pioneering resin compatibility: Kye kyuma ekisoose mu makolero okulongoosa omulundi gumu granular (powdered) ne liquid resins mu yuniti emu. Abakola ebintu basobola okulonda mu ddembe ebintu ebitali bya ssente nnyingi oba ebikola obulungi nga basinziira ku mpisa z’ebintu, ne biwa enkola enkyukakyuka ey’amaanyi.

Precision-Controlled Material Handling: Equipped ne TOWA's proprietary handling robot, ebyuma bisobola okwesigika okukwata substrates / panels n'okuwuguka okw'amaanyi olw'okugonza oba obuzito obw'amaanyi, obulungi okukola ku kusoomoozebwa enkola y'okupakinga sayizi ennene.

Optimized Cost and Film Consumption: Enkola yaayo eya patent eya Release Film Precutting System ekekkereza nga 25% ku nkozesa ya firimu efulumya buli cycle y’okubumba, ekendeeza nnyo ku nsaasaanya y’emirimu mu kukola okumala ebbanga eddene.

Key Process Parameters: Esobola okukwata wafers ezituuka ku mm 300 (yinsi 12) mu diameter ne panels ezituuka ku 320×320mm mu sayizi. Awagira okupakinga ebyuma nga obuwanvu bwa waya z’okusiba okutuuka ku mm 110.

Mu bufunze n’okukozesebwa: Mu bufunze, Towa CPM1080 ye nkola eyakolebwa okupakinga eby’omulembe mu ngeri entuufu, etali ya ssente nnyingi. Omuze gwayo ogwa "HP" gukola ng'omutala eri tekinologiya ow'omulembe oguddako ogw'okupakinga, ate omuze gwa "Fully Automated" gukiikirira enkola etali ya ssente nnyingi mu kukola ebintu ebinene mu biseera eby'omu maaso. Ekyuma kino tekisobola kupakira byuma bya bulijjo byokka nga ICs, microprocessors, ne sensors, wabula n’amaanyi ga semiconductors (nga MOSFETs ne IGBTs) n’ebyuma eby’amasannyalaze ag’amaaso (nga LEDs).