SAKI 3D spi smt ekyuma ekikebera solder paste 3Si-MS2

SAKI 3Si-MS2 nkola ya 3D 3D solder paste inspection system eyakolebwa ku layini z’okufulumya SMT ez’omulembe. Ekozesa tekinologiya wa multi-spectral 3D imaging okuzuula mu ngeri ey’otoma obuzito, obugulumivu, n’enkula ya solder paste oluvannyuma lw’okukuba ebitabo ne nga tennabaawo SMT, okuziyiza obulungi obulema mu soldering n’okulongoosa pass yield (FPY). Okusinga ekozesebwa mu kulondoola omutindo gw’enkola ya PCB ez’omulembe nga motherboard z’amasimu, ebyuma by’emmotoka, ne seeva.

2. Omusingi gwa tekinologiya omukulu

📌 Tekinologiya w'okukuba ebifaananyi mu ngeri ya 3D

Okukozesa layisi triangulation + structured light projection enkola ya mirundi ebiri:

Okusika kwa layisi (Laser Triangulation) .

Layini ya layisi ey’obutuufu obw’amaanyi esika ku ngulu w’ekikuta kya solder, ekwata ekitangaala ekitunuuliddwa okuyita mu kkamera ya CCD, era n’ebala data y’obugulumivu bwa Z-axis

Obutuufu bwa ±1.5μm (Z axis), obusaanira ebitundu by’eddoboozi ebitono ennyo (01005)

Okulaga ekitangaala ekitegekeddwa (Ekitangaala ekitegekeddwa) .

Multi-angle stripe light projection, kwongera ku busobozi bw’okuzzaawo enkula ya 3D eya paadi enzibu (nga BGA, QFN)

Gonjoola ekizibu kya "shadow effect" ekya laser scanning ku mbiriizi eziwanvuwa

📌 Enkola ey'amagezi ey'okuzuula

PCB positioning → multi-spectral scanning → 3D modeling → Okwekenenya obulema mu AI → Okuddamu kwa data ya SPC

3. Ebintu ebikulu ebikola emirimu

🔹 1. Okuzuula okusiiga kwa solder mu bujjuvu

Ebintu ebizuula Obutuufu bw’okupima Amakulu g’enkola

Volume (Volume) ±3% Kakasa nti ebbakuli emala okwewala okusoda mu nnyonta oba ebbaati emala

Obugulumivu (Obugulumivu) ±1.5μm Fuga okugwa kw’ekikuta kya solder n’okuziyiza okukola omukutu

Ekitundu: ±5μm Laba offset y’okukuba ebitabo oba okuzibikira kwa stencil

Enkula: Okugeraageranya enkula ya 3D Zuula obulema mu kubumba nga ensonga y’okusika n’okunyigirizibwa

🔹 2. Obusobozi obw’omulembe obw’okuzuula obulema

Ebibikka ebikyamu ebya bulijjo:

✅ Paste etamala

✅ Okukola omutala

✅ Okukwatagana obubi

✅ Okutuuka ku ntikko/Okuzikira

✅ Obucaafu bwa Stencil

Okuzuula ekifo eky’enjawulo:

✔ Okuliyirira enjawulo mu bugumu ku stencil y’omutendera

✔ Solder paste okusika ensonga okuzuula ku fine pitch QFN

🔹 3. Okwekenenya data mu ngeri ey’amagezi

Okufuga SPC mu kiseera ekituufu: Okukola lipoota za CPK/PPK mu ngeri ey’otoma okulondoola okutebenkera kw’enkola y’okukuba ebitabo

Closed-loop feedback: Teekateeka mu ngeri ey’otoma parameters za printer (nga puleesa ya scraper ne sipiidi)

4. Ebikwata ku Hardware n’ensengeka

📌 Enkola y'amaaso

Ebitundu Ebipimo (Parameters).

Ensibuko ya layisi 650nm layisi emmyufu, frequency ya sikaani 20kHz

Structured light projection Ettaala ya bbululu eya LED ey’emiguwa, okusalawo kwa 5μm

Kkamera ya pixel obukadde 5 CMOS ya sipiidi ya waggulu, frame rate 120fps

Enkola y’ensibuko y’ekitangaala Ring LED + coaxial light combination, 8 adjustable lighting modes

📌 Omulimu gw'okukanika

Ebikwata ku pulojekiti

Sipiidi y’okuzuula Ekisinga obunene 45cm2/s (mode ya sipiidi ya waggulu)

PCB sayizi okuva ku 50mm × 50mm ~ 510mm × 460mm

Ekintu ekitono ekizuula 01005 (0.4mm×0.2mm) .

Ddamu obutuufu X/Y: ±3μm, Z: ±1.5μm

Enkola y’entambula Motor ya linear ey’obugumu obw’amaanyi, eyanguwa 1.5G

📌 Omukutu gwa pulogulaamu

Enkola y'emirimu eya SAKI VisionPro

Enkolagana ya pulogulaamu z’ebifaananyi, okuwagira okukoppa okutali ku mutimbagano (OLP) .

AI okweyiga omulimu: automatic optimization of okuzuula threshold

Enkola y'ebifulumizibwa mu lipoota: PDF/Excel, obuwagizi bwa templates ez'enjawulo

5. Ebirungi ebikulu mu bikozesebwa

✅ Bbalansi y'obutuufu n'obwangu

Z-axis precision ±1.5μm, ate nga ekuuma sipiidi y’okuzuula eya 45cm2/s, 20% esinga ebyuma ebifaanagana

Okukyusa mu ngeri ey’otoma ey’engeri za sikaani bbiri (laser + ekitangaala ekitegekeddwa), nga otunuulidde obulungi n’obutuufu

✅ Obugezi obwa waggulu

Enkola y’okuyiga okw’obuziba: okugabanya mu ngeri ey’otoma ebika by’obulema, omuwendo gwa alamu ey’obulimba <2%

Okutaasa okukyusakyusa: okumalawo okutaataaganyizibwa kwa langi/okutunula kwa PCB

6. Emisango egya bulijjo egy’okusaba

📱 Ebyuma ebikozesebwa mu byuma bikalimagezi

Motherboard y’essimu: okuzuula okukuba solder paste ku byuma bya CSP ebya 0.3mm pitch

TWS earphone charging box: okufuga eddoboozi lya paadi entonotono (0.2mm diameter)

🚗 Ebyuma ebikozesebwa mu mmotoka

Module ya ADAS: kakasa nti BGA solder paste ejjuza omuwendo >90% (ekwatagana ne IPC Class 3)

Okwolesebwa mu mmotoka: FPC flexible board printing omutindo okulondoola

🖥️ Ebikozesebwa mu makolero

Server CPU socket: okuzuula coplanarity ya pads ennene

5G base station PA module: solder paste okubumba okufuga ebintu ebya frequency enkulu

7. Ebirungi bw’ogeraageranya n’ebintu ebivuganya

Ekipimo SAKI 3Si-MS2 SPI eya bulijjo eya 3D 2D SPI

Tekinologiya w’okuzuula Layisi + ekitangaala ekitegekeddwa mu ngeri ey’emirundi ebiri Okusika layisi emu Okukuba ebifaananyi mu bbanga kwokka

Z-axis obutuufu ±1.5μm ±3 ~ 5μm Tesobola kupima

Sipiidi 45cm2/s Ebiseera ebisinga 30~35cm2/s Esingako mangu naye nga ekoma mu nkola

Okutegeera obulema Okugabanya AI okw’obulema 20+ Basic algorithm (ebika 5-10) Okwekenenya contour yokka

8. Mu bufunze

SAKI 3Si-MS2 egaba okufulumya SMT eya density enkulu n’okukuba ebifaananyi eby’ekika kya multi-spectral 3D + AI intelligent analysis:

Okuziyiza enkola: okukwata ebitundu ebisukka mu 95% eby’obulema bwa solder paste nga tonnaba kussaako patching

Okunyweza data: SPC mu kiseera ekituufu evuga okulongoosa enkola y’okukuba ebitabo

Okukyusakyusa okukyukakyuka: okuzuula okubikka mu bujjuvu okuva ku 01005 okutuuka ku BGA ennene