SAKI 3D spi smt solder phala yoyendera makina 3Si-MS2

SAKI 3Si-MS2 ndi njira yowunikira kwambiri ya 3D solder paste yopangidwira mizere yamakono yopanga ma SMT. Amagwiritsa ntchito ukadaulo wojambula wamitundu yambiri wa 3D kuti azindikire voliyumu, kutalika, ndi mawonekedwe a solder phala pambuyo posindikiza komanso pamaso pa SMT, kuteteza bwino kuwonongeka kwa soldering ndikuwongolera zokolola (FPY). Amagwiritsidwa ntchito kwambiri pakuwongolera khalidwe la ma PCB apamwamba kwambiri monga mavabodi a foni yam'manja, zamagetsi zamagalimoto, ndi maseva.

2. mfundo zamakono zamakono

📌 Ukadaulo wojambula wa 3D

Kugwiritsa ntchito ma laser triangulation + mawonekedwe owoneka bwino amitundu iwiri:

Kusanthula kwa Laser (Laser Triangulation)

Mzere wolondola kwambiri wa laser umayang'ana phala la solder, kujambula kuwala kudzera mu kamera ya CCD, ndikuwerengera kutalika kwa Z-axis

Kulondola kwa ± 1.5μm (Z axis), yoyenera pazigawo zomveka bwino kwambiri (01005)

Mawonekedwe a kuwala (Structured Light)

Kuwoneka kowala kwa mizere ingapo, kumakulitsa luso lobwezeretsanso ma contour a 3D a mapadi ovuta (monga BGA, QFN)

Konzani vuto la "shadow effect" la kusanthula kwa laser m'mphepete mwake

📌 Njira yozindikira mwanzeru

Kuyika kwa PCB → kusanthula kwamitundu yambiri → kutengera mawonekedwe a 3D → kusanthula zolakwika za AI → Ndemanga za data ya SPC

3. Zina mwazinthu zogwirira ntchito

🔹 1. Full parameter solder phala kuzindikira

Zinthu zozindikirika Kuyeza kulondola Kufunika kwa ndondomeko

Voliyumu (Volume) ± 3% Onetsetsani malata okwanira kupewa kuwotchera kozizira kapena malata osakwanira

Kutalika (Kutalika) ± 1.5μm Control solder phala kugwa ndi kuteteza mlatho

Chigawo: ± 5μm Dziwani zosindikizira kapena kutsekeka kwa stencil

Mawonekedwe: Kufananiza kozungulira kwa 3D Dziwani zolakwika zomwe zimapangidwira monga kukoka nsonga ndi kukhumudwa

🔹 2. Kuthekera kwapamwamba kozindikira zolakwika

Chodziwika bwino chazovuta:

✅ Pasta wosakwanira

✅ Kulumikizana

✅ Kusokoneza

✅ Kuyang'ana / Kutsika

✅ Kuwonongeka kwa Stencil

Kuzindikira zochitika zapadera:

✔ Kulipirira kusiyana kwa makulidwe a stencil

✔ Chidziwitso cha solder paste kukoka nsonga ya QFN yabwino

🔹 3. Kusanthula deta mwanzeru

Ulamuliro wa SPC wanthawi yeniyeni: Ingopangani malipoti a CPK/PPK kuti muwone kukhazikika kwa ntchito yosindikiza

Ndemanga zotsekedwa: Sinthani zokha zosindikizira (monga kuthamanga kwa scraper ndi liwiro)

4. Mafotokozedwe a hardware ndi masanjidwe

📌 Optical system

Components Parameters

Laser gwero 650nm wofiira laser, sikani pafupipafupi 20kHz

Mawonekedwe opangidwa ndi kuwala kwa Blue LED mizere yowala, kusamvana 5μm

Kamera 5 miliyoni pixels high-liwiro CMOS, frame rate 120fps

Makina opangira magetsi mphete ya LED + coaxial kuwala kophatikizika, mitundu 8 yosinthika yowunikira

📌 Kuchita kwamakina

Zofotokozera za Project

Liwiro lozindikira Maximum 45cm²/s (mwanjira yothamanga kwambiri)

PCB kukula osiyanasiyana 50mm×50mm ~ 510mm×460mm

Chinthu chochepa chodziwikiratu 01005 (0.4mm×0.2mm)

Bwerezani zolondola X / Y: ± 3μm, Z: ± 1.5μm

Motion system High rigidity linear motor, mathamangitsidwe 1.5G

📌 Pulogalamu yamapulogalamu

SAKI VisionPro opareting'i sisitimu

Mawonekedwe a pulogalamu yojambula, kuthandizira kuyerekezera kwapaintaneti (OLP)

Ntchito yodziphunzira ya AI: kukhathamiritsa kodziwikiratu pozindikira

Fomu yotulutsa lipoti: PDF/Excel, chithandizo cha ma tempuleti omwe mumakonda

5. Zopindulitsa pachimake cha mankhwala

✅ Kusinthasintha kwachangu komanso liwiro

Kulondola kwa Z-axis ± 1.5μm, ndikusunga liwiro la 45cm²/s, 20% mwachangu kuposa zida zofananira

Kusintha kwamtundu wamitundu iwiri yojambulira (laser + yopangidwa ndi kuwala), poganizira zonse bwino komanso zolondola.

✅ Luntha lapamwamba

Algorithm yophunzirira mozama: kugawika kwamitundu yachilema, ma alarm abodza <2%

Kuunikira kosinthika: Chotsani mtundu wa PCB / zosokoneza

6. Milandu yodziwika bwino yogwiritsira ntchito

📱 Zamagetsi za Consumer

Bolodi ya foni yam'manja: kuzindikira kwa phala la solder la zida za 0.3mm pitch CSP

Bokosi la TWS lolipiritsa m'makutu: kuwongolera voliyumu yazing'onoting'ono (m'mimba mwake 0.2mm)

🚗 Zamagetsi zamagalimoto

Gawo la ADAS: onetsetsani kuti BGA solder phala kudzaza mlingo> 90% (zogwirizana ndi IPC Class 3)

Chiwonetsero chamgalimoto: FPC flexible board printing quality monitoring

🖥️ Zida zamafakitale

Seva ya CPU socket: kuzindikira kwapakatikati kwamapadi akulu akulu

5G base station PA module: solder phala kuwongolera kuwongolera kwazinthu zothamanga kwambiri

7. Ubwino poyerekeza ndi zinthu mpikisano

Dimension SAKI 3Si-MS2 Ochiritsira 3D SPI 2D SPI

Tekinoloje ya kuzindikira Laser + yopangidwa ndi kuwala kwapawiri modekha ya laser single Kujambula kwa Planar kokha

Kulondola kwa Z-axis ± 1.5μm ± 3 ~ 5μm Kulephera kuyeza

Liwiro 45cm²/s Nthawi zambiri 30~35cm²/s Mofulumira koma magwiridwe antchito ochepa

Kuzindikira zolakwika Gulu la AI la 20+ zolakwika Basic algorithm (mitundu 5-10) Kusanthula kozungulira kokha

8. Mwachidule

SAKI 3Si-MS2 imapereka kachulukidwe kakang'ono ka SMT kokhala ndi zithunzi zambiri za 3D + kusanthula kwanzeru kwa AI:

Kupewa kwa njira: chepetsa zochulukirapo 95% za zolakwika za solder musanayambe kuzigamba

Kupititsa patsogolo deta: zenizeni zenizeni SPC imayendetsa kukhathamiritsa kwa kusindikiza

Kusintha kosinthika: kuzindikira kwathunthu kuchokera ku 01005 kupita ku BGA yayikulu